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Quality Ceramic Chip High Frequency Inductor FH VHF100505HQ47NJT Suitable for Stable Inductance Applications factory
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Quality Ceramic Chip High Frequency Inductor FH VHF100505HQ47NJT Suitable for Stable Inductance Applications factory
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Specifications
Current Rating:
700mA
Inductance:
47nH
Tolerance:
±5%
Frequency - Self Resonant:
1GHz
Current - Saturation (Isat):
-
DC Resistance(DCR):
160mΩ
Type:
Multilayer Inductor;High-frequency Inductor
Ratings:
-
Q @ Frequency:
8@100MHz
Mfr. Part #:
VHF100505HQ47NJT
Package:
0402
Key Attributes
Model Number: VHF100505HQ47NJT
Product Description

Chip High Frequency Inductors - VHF100505HQ Series

Product Overview
The VHF100505HQ Series are chip high frequency inductors designed for demanding electronic applications. These multilayer ceramic inductors offer reliable performance with precise electrical characteristics. They are suitable for various high-frequency circuits requiring stable inductance and low resistance.

Product Attributes

  • Product Type: Chip high frequency inductors
  • Series: VHF100505HQ
  • Material: Ceramic system (Al2O3)
  • Internal Electrode Material: Pure Silver (Ag)
  • Terminal Electrode Material: Silver layer (Ag) with Ni/Sn plating
  • Plating: Ni/Sn
  • Compliance: RoHS (if specified as 'Unitary lead free')

Technical Specifications

Part NO. Inductance (nH) Q Value (min) DCR (Ω) max Test Frequency (MHz) Test Voltage (mV) SRF (MHz) min Rated Current (mA) max
VHF100505HQ1N0T 1.0 8 0.06 100 50 10000 1000
VHF100505HQ1N1T 1.1 8 0.07 100 50 10000 1000
VHF100505HQ1N2T 1.2 8 0.07 100 50 10000 1000
VHF100505HQ1N3T 1.3 8 0.07 100 50 10000 1000
VHF100505HQ1N5T 1.5 8 0.08 100 50 6000 1000
VHF100505HQ1N6T 1.6 8 0.08 100 50 6000 1000
VHF100505HQ1N8T 1.8 8 0.08 100 50 6000 900
VHF100505HQ2N0T 2.0 8 0.09 100 50 6000 900
VHF100505HQ2N2T 2.2 8 0.09 100 50 6000 900
VHF100505HQ2N4T 2.4 8 0.10 100 50 6000 800
VHF100505HQ2N7T 2.7 8 0.12 100 50 6000 800
VHF100505HQ3N0T 3.0 8 0.12 100 50 6000 800
VHF100505HQ3N3T 3.3 8 0.13 100 50 6000 800
VHF100505HQ3N6T 3.6 8 0.15 100 50 4000 700
VHF100505HQ3N9T 3.9 8 0.16 100 50 4000 700
VHF100505HQ4N3T 4.3 8 0.16 100 50 4000 700
VHF100505HQ4N7T 4.7 8 0.16 100 50 4000 700
VHF100505HQ5N1T 5.1 8 0.16 100 50 4000 600
VHF100505HQ5N6T 5.6 8 0.20 100 50 4000 600
VHF100505HQ6N2T 6.2 8 0.20 100 50 3900 600
VHF100505HQ6N8T 6.8 8 0.20 100 50 3900 600
VHF100505HQ7N5T 7.5 8 0.24 100 50 3700 500
VHF100505HQ8N2T 8.2 8 0.24 100 50 3600 500
VHF100505HQ9N1T 9.1 8 0.26 100 50 3400 500
VHF100505HQ10NT 10 8 0.26 100 50 3200 500
VHF100505HQ12NT 12 8 0.50 100 50 2700 400
VHF100505HQ15NT 15 8 0.50 100 50 2300 400
VHF100505HQ18NT 18 8 0.60 100 50 2100 350
VHF100505HQ20NT 20 8 0.60 100 50 2000 350
VHF100505HQ22NT 22 8 0.60 100 50 1900 350
VHF100505HQ27NT 27 8 0.70 100 50 1600 300
VHF100505HQ33NT 33 8 0.80 100 50 1300 300
VHF100505HQ39NT 39 8 1.00 100 50 1200 250
VHF100505HQ43NT 43 8 1.10 100 50 1100 250
VHF100505HQ47NT 47 8 1.10 100 50 1000 250
VHF100505HQ56NT 56 8 1.20 100 50 750 200
VHF100505HQ68NT 68 8 1.40 100 50 750 200
VHF100505HQ82NT 82 8 1.60 100 50 750 200
VHF100505HQR10T 100 8 2.00 100 50 700 200
VHF100505HQR12T 120 8 2.50 100 50 600 150
VHF100505HQR15T 150 8 3.00 100 50 550 150
VHF100505HQR18T 180 8 3.50 100 50 500 150
VHF100505HQR22T 220 8 3.70 100 50 450 100
VHF100505HQR27T 270 8 4.50 100 50 400 100
VHF100505HQR33T 330 6 5.00 50 50 350 80

Dimensions: 1.0 x 0.5 x 0.5 mm (L x W x T)

Tolerance Codes:

  • Ls 6.2nH: B (0.1nH), C (0.2nH), S (0.3nH)
  • Ls > 6.2nH: G (2%), H (3%), J (5%)

Note: VHF100505HQ series products have no compensation value; the product test center value equals the nominal value.

Reliability Testing Items

Item Requirements Test Methods and Remarks
Operating Temperature Range -55+125
Solder ability At least 95% of terminal electrode should be covered with solder. Preheating temperature: 120-150; Preheating time: 60s; Solder: 96.5%Sn/3.0%Ag/0.5%Cu; Solder temperature: 2455; Immersion depth: 10mm; Duration: 51s; Dip to flux: 3-5s.
Resistance to Soldering Heat At least 95% of terminal electrode covered with solder. No mechanical damage. Inductance change: 10% (HQ); Q value change: 20% (ceramic). Preheating temperature: 120-150; Preheating time: 60s; Solder: 96.5%Sn/3.0%Ag/0.5%Cu; Solder temperature: 2605; Immersion depth: 10mm; Duration: 101s; Dip to flux: 3-5s.
Adhesion of electrode Termination and body should be no damage. Applied force: 5N for 1005 series; Keep time: 101S.
Low temperature resistance No mechanical damage. Inductance change: within 10%. Q value change (ceramic): within 20%. Temperature: -552; Testing time: 1000+24/-0 h.
Bending strength No mechanical damage. Testing board: glass epoxy-resin substrate; Curvature: 2mm; Hold time: 20s1s; Compression speed: 0.5 mm/s.
Vibration No mechanical damage. Inductance change: within 10%. Q value change (ceramic): within 20%. Amplitude: 1.5mm; Test time: 2h in each of 3 mutually perpendicular directions; Frequency range: 10Hz-55Hz-10Hz (1 min).
High temperature resistance No mechanical damage. Inductance change: within 10%. Q value change (ceramic): within 20%. Temperature: 1252; Testing time: 1000+24/-0 h.
Static Humidity No mechanical damage. Inductance change: within 10%. Q value change (ceramic): within 20%. Humidity: 90%-95% RH; Temperature: 602; Testing time: 1000+24/-0 h.
High temperature load No mechanical damage. Inductance change: within 10%. Q value change (ceramic): within 20%. Imposed current: rated current; Temperature: 1252; Testing time: 1000+24/-0 h.
Temperature Shock No mechanical damage. Inductance change: within 10%. Q value change (ceramic): within 20%. Temperature: -55 (303 min) +125 (303 min); Number of cycles: 100.

Note: Electrical performance tests require 242 hours of recovery under standard conditions after testing.

Product Packaging

  • Packaging Type: Tape & Reel
  • Packaging Quantity (Pcs): 10000 per Reel, 100000 per Box, 600000 per Case (for 100505 size)

Recommended Soldering Conditions

  • Type: Reflow soldering
  • Conditions: Temperature difference between solder and ferrite surface limited to 150 max during pre-heating. Temperature difference between product surface and solvent after soldering limited to 100 max.
  • Manual Soldering: Soldering iron temperature: 350 (Max); Power: 30W (Max); Soldering Time: < 5S. Avoid touching terminal electrodes.

Cleaning

  • Cleaning Temperature: 60 (max)
  • Cleaning Time: 1 minute (min)
  • Ultrasonic Power: 200W (max)

Storage Requirements

  • Storage Period: Within 1 year from the factory inspection date. If exceeded, check solderability before use.
  • Storage Conditions: Temperature: -10 to +40; Humidity: 30% to 70% RH. Store in a warehouse away from corrosive substances, moisture, dust, heat shock, vibration, and direct sunlight. Maintain airtight packaging.

Usage Of ODS (Ozone Depleting Substances)

The company does not use ODS such as CCl4 and HCFC in its production process.

Notes

  • If the product is designated as 'Unitary lead free', it complies with RoHS directive requirements.
  • This product specification guarantees the quality of the product as a single unit. Ensure your product has been evaluated and confirmed against your specifications when this product is mounted.
  • The company does not warrant against failures caused by uses deviating from the intended use described in this product specification.

2410121256_FH-VHF100505HQ47NJT_C395068.pdf
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