Chip High Frequency Inductors - VHF100505HQ Series
Product Overview
The VHF100505HQ Series are chip high frequency inductors designed for demanding electronic applications. These multilayer ceramic inductors offer reliable performance with precise electrical characteristics. They are suitable for various high-frequency circuits requiring stable inductance and low resistance.
Product Attributes
- Product Type: Chip high frequency inductors
- Series: VHF100505HQ
- Material: Ceramic system (Al2O3)
- Internal Electrode Material: Pure Silver (Ag)
- Terminal Electrode Material: Silver layer (Ag) with Ni/Sn plating
- Plating: Ni/Sn
- Compliance: RoHS (if specified as 'Unitary lead free')
Technical Specifications
| Part NO. | Inductance (nH) | Q Value (min) | DCR (Ω) max | Test Frequency (MHz) | Test Voltage (mV) | SRF (MHz) min | Rated Current (mA) max |
|---|---|---|---|---|---|---|---|
| VHF100505HQ1N0T | 1.0 | 8 | 0.06 | 100 | 50 | 10000 | 1000 |
| VHF100505HQ1N1T | 1.1 | 8 | 0.07 | 100 | 50 | 10000 | 1000 |
| VHF100505HQ1N2T | 1.2 | 8 | 0.07 | 100 | 50 | 10000 | 1000 |
| VHF100505HQ1N3T | 1.3 | 8 | 0.07 | 100 | 50 | 10000 | 1000 |
| VHF100505HQ1N5T | 1.5 | 8 | 0.08 | 100 | 50 | 6000 | 1000 |
| VHF100505HQ1N6T | 1.6 | 8 | 0.08 | 100 | 50 | 6000 | 1000 |
| VHF100505HQ1N8T | 1.8 | 8 | 0.08 | 100 | 50 | 6000 | 900 |
| VHF100505HQ2N0T | 2.0 | 8 | 0.09 | 100 | 50 | 6000 | 900 |
| VHF100505HQ2N2T | 2.2 | 8 | 0.09 | 100 | 50 | 6000 | 900 |
| VHF100505HQ2N4T | 2.4 | 8 | 0.10 | 100 | 50 | 6000 | 800 |
| VHF100505HQ2N7T | 2.7 | 8 | 0.12 | 100 | 50 | 6000 | 800 |
| VHF100505HQ3N0T | 3.0 | 8 | 0.12 | 100 | 50 | 6000 | 800 |
| VHF100505HQ3N3T | 3.3 | 8 | 0.13 | 100 | 50 | 6000 | 800 |
| VHF100505HQ3N6T | 3.6 | 8 | 0.15 | 100 | 50 | 4000 | 700 |
| VHF100505HQ3N9T | 3.9 | 8 | 0.16 | 100 | 50 | 4000 | 700 |
| VHF100505HQ4N3T | 4.3 | 8 | 0.16 | 100 | 50 | 4000 | 700 |
| VHF100505HQ4N7T | 4.7 | 8 | 0.16 | 100 | 50 | 4000 | 700 |
| VHF100505HQ5N1T | 5.1 | 8 | 0.16 | 100 | 50 | 4000 | 600 |
| VHF100505HQ5N6T | 5.6 | 8 | 0.20 | 100 | 50 | 4000 | 600 |
| VHF100505HQ6N2T | 6.2 | 8 | 0.20 | 100 | 50 | 3900 | 600 |
| VHF100505HQ6N8T | 6.8 | 8 | 0.20 | 100 | 50 | 3900 | 600 |
| VHF100505HQ7N5T | 7.5 | 8 | 0.24 | 100 | 50 | 3700 | 500 |
| VHF100505HQ8N2T | 8.2 | 8 | 0.24 | 100 | 50 | 3600 | 500 |
| VHF100505HQ9N1T | 9.1 | 8 | 0.26 | 100 | 50 | 3400 | 500 |
| VHF100505HQ10NT | 10 | 8 | 0.26 | 100 | 50 | 3200 | 500 |
| VHF100505HQ12NT | 12 | 8 | 0.50 | 100 | 50 | 2700 | 400 |
| VHF100505HQ15NT | 15 | 8 | 0.50 | 100 | 50 | 2300 | 400 |
| VHF100505HQ18NT | 18 | 8 | 0.60 | 100 | 50 | 2100 | 350 |
| VHF100505HQ20NT | 20 | 8 | 0.60 | 100 | 50 | 2000 | 350 |
| VHF100505HQ22NT | 22 | 8 | 0.60 | 100 | 50 | 1900 | 350 |
| VHF100505HQ27NT | 27 | 8 | 0.70 | 100 | 50 | 1600 | 300 |
| VHF100505HQ33NT | 33 | 8 | 0.80 | 100 | 50 | 1300 | 300 |
| VHF100505HQ39NT | 39 | 8 | 1.00 | 100 | 50 | 1200 | 250 |
| VHF100505HQ43NT | 43 | 8 | 1.10 | 100 | 50 | 1100 | 250 |
| VHF100505HQ47NT | 47 | 8 | 1.10 | 100 | 50 | 1000 | 250 |
| VHF100505HQ56NT | 56 | 8 | 1.20 | 100 | 50 | 750 | 200 |
| VHF100505HQ68NT | 68 | 8 | 1.40 | 100 | 50 | 750 | 200 |
| VHF100505HQ82NT | 82 | 8 | 1.60 | 100 | 50 | 750 | 200 |
| VHF100505HQR10T | 100 | 8 | 2.00 | 100 | 50 | 700 | 200 |
| VHF100505HQR12T | 120 | 8 | 2.50 | 100 | 50 | 600 | 150 |
| VHF100505HQR15T | 150 | 8 | 3.00 | 100 | 50 | 550 | 150 |
| VHF100505HQR18T | 180 | 8 | 3.50 | 100 | 50 | 500 | 150 |
| VHF100505HQR22T | 220 | 8 | 3.70 | 100 | 50 | 450 | 100 |
| VHF100505HQR27T | 270 | 8 | 4.50 | 100 | 50 | 400 | 100 |
| VHF100505HQR33T | 330 | 6 | 5.00 | 50 | 50 | 350 | 80 |
Dimensions: 1.0 x 0.5 x 0.5 mm (L x W x T)
Tolerance Codes:
- Ls 6.2nH: B (0.1nH), C (0.2nH), S (0.3nH)
- Ls > 6.2nH: G (2%), H (3%), J (5%)
Note: VHF100505HQ series products have no compensation value; the product test center value equals the nominal value.
Reliability Testing Items
| Item | Requirements | Test Methods and Remarks |
|---|---|---|
| Operating Temperature Range | -55+125 | |
| Solder ability | At least 95% of terminal electrode should be covered with solder. | Preheating temperature: 120-150; Preheating time: 60s; Solder: 96.5%Sn/3.0%Ag/0.5%Cu; Solder temperature: 2455; Immersion depth: 10mm; Duration: 51s; Dip to flux: 3-5s. |
| Resistance to Soldering Heat | At least 95% of terminal electrode covered with solder. No mechanical damage. Inductance change: 10% (HQ); Q value change: 20% (ceramic). | Preheating temperature: 120-150; Preheating time: 60s; Solder: 96.5%Sn/3.0%Ag/0.5%Cu; Solder temperature: 2605; Immersion depth: 10mm; Duration: 101s; Dip to flux: 3-5s. |
| Adhesion of electrode | Termination and body should be no damage. | Applied force: 5N for 1005 series; Keep time: 101S. |
| Low temperature resistance | No mechanical damage. Inductance change: within 10%. Q value change (ceramic): within 20%. | Temperature: -552; Testing time: 1000+24/-0 h. |
| Bending strength | No mechanical damage. | Testing board: glass epoxy-resin substrate; Curvature: 2mm; Hold time: 20s1s; Compression speed: 0.5 mm/s. |
| Vibration | No mechanical damage. Inductance change: within 10%. Q value change (ceramic): within 20%. | Amplitude: 1.5mm; Test time: 2h in each of 3 mutually perpendicular directions; Frequency range: 10Hz-55Hz-10Hz (1 min). |
| High temperature resistance | No mechanical damage. Inductance change: within 10%. Q value change (ceramic): within 20%. | Temperature: 1252; Testing time: 1000+24/-0 h. |
| Static Humidity | No mechanical damage. Inductance change: within 10%. Q value change (ceramic): within 20%. | Humidity: 90%-95% RH; Temperature: 602; Testing time: 1000+24/-0 h. |
| High temperature load | No mechanical damage. Inductance change: within 10%. Q value change (ceramic): within 20%. | Imposed current: rated current; Temperature: 1252; Testing time: 1000+24/-0 h. |
| Temperature Shock | No mechanical damage. Inductance change: within 10%. Q value change (ceramic): within 20%. | Temperature: -55 (303 min) +125 (303 min); Number of cycles: 100. |
Note: Electrical performance tests require 242 hours of recovery under standard conditions after testing.
Product Packaging
- Packaging Type: Tape & Reel
- Packaging Quantity (Pcs): 10000 per Reel, 100000 per Box, 600000 per Case (for 100505 size)
Recommended Soldering Conditions
- Type: Reflow soldering
- Conditions: Temperature difference between solder and ferrite surface limited to 150 max during pre-heating. Temperature difference between product surface and solvent after soldering limited to 100 max.
- Manual Soldering: Soldering iron temperature: 350 (Max); Power: 30W (Max); Soldering Time: < 5S. Avoid touching terminal electrodes.
Cleaning
- Cleaning Temperature: 60 (max)
- Cleaning Time: 1 minute (min)
- Ultrasonic Power: 200W (max)
Storage Requirements
- Storage Period: Within 1 year from the factory inspection date. If exceeded, check solderability before use.
- Storage Conditions: Temperature: -10 to +40; Humidity: 30% to 70% RH. Store in a warehouse away from corrosive substances, moisture, dust, heat shock, vibration, and direct sunlight. Maintain airtight packaging.
Usage Of ODS (Ozone Depleting Substances)
The company does not use ODS such as CCl4 and HCFC in its production process.
Notes
- If the product is designated as 'Unitary lead free', it complies with RoHS directive requirements.
- This product specification guarantees the quality of the product as a single unit. Ensure your product has been evaluated and confirmed against your specifications when this product is mounted.
- The company does not warrant against failures caused by uses deviating from the intended use described in this product specification.
2410121256_FH-VHF100505HQ47NJT_C395068.pdf
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