Product Overview
This document details a range of Chip Beads, Chip Inductors, and Chip High Frequency Inductors from the CBG, CBW, CBM, CBY, CBH, CMI, CMP, and VHF series. These components are designed for various electronic applications, offering impedance, inductance, and current handling capabilities. The products are manufactured with ferrite or ceramic bodies, featuring silver inner electrodes and Ni/Sn plated terminal electrodes. They are available in multiple sizes and packaging options, including bulk and tape & reel, and are suitable for surface mount technology.
Product Attributes
- Brand: Not explicitly stated, but implied to be from the manufacturer identified in the document.
- Material: Ferrite (Ni-Cu-Zn system for inductors, unspecified for beads), Ceramic (Al2O3 for VHF inductors).
- Inner Electrode Material: Pure Silver (Ag).
- Terminal Electrode Plating: Ni/Sn plating.
- Compliance: RoHS compliant (indicated by 'Unitary lead free' labeling).
Technical Specifications
| Product Series | Model / Part Number | Size (L x W x T) mm | Tolerance | Inductance / Impedance | DC Resistance (RDC) max () | Rated Current (mA) max | Test Frequency (MHz) | Self-Resonant Frequency (SRF) min (MHz) |
|---|---|---|---|---|---|---|---|---|
| CMI (Ferrite Inductors) | CMI100505V47NKT | 1.0 x 0.5 x 0.5 | 10% | 0.047 H | 0.45 | 25 | 50 | 220 |
| CMI (Ferrite Inductors) | CMI160808U1R0KT | 1.6 x 0.8 x 0.8 | 10% | 1.0 H | 0.50 | 25 | 10 | 40 |
| CMI (Ferrite Inductors) | CMI201209U1R0KT | 2.0 x 1.2 x 0.9 | 10% | 1.0 H | 0.40 | 50 | 10 | 75 |
| CMI (Ferrite Inductors) | CMI321609U1R0KT | 3.2 x 1.6 x 0.9 | 10% | 1.0 H | 0.30 | 100 | 10 | 75 |
| CMI (Ferrite Inductors) | CMI322513U1R0KT | 3.2 x 2.5 x 1.3 | 10% | 1.0 H | 0.20 | 600 | 10 | 70 |
| CMI (Ferrite Inductors) | CMI453215U1R0KT | 4.5 x 3.2 x 1.5 | 10% | 1.0 H | 0.55 | 650 | 10 | 50 |
| CMP (Power Inductors) | CMP201209UD1R0MT | 2.0 x 1.2 x 0.9 | 20% | 1.0 H | 0.24 | 800 | 1 | 75 |
| CMP (Power Inductors) | CMP321609UD1R0MT | 3.2 x 1.6 x 0.9 | 20% | 1.0 H | 0.15 | 1200 | 1 | 60 |
| CMP (Power Inductors) | CMP252009UD1R0MT | 2.5 x 2.0 x 0.9 | 20% | 1.0 H | 0.12 | 1500 | 1 | 70 |
| CMP (Power Inductors) | CMP160808UE1R0MT | 1.6 x 0.8 x 0.8 | 20% | 1.0 H | 0.30 | 150 | 1 | 75 |
| CMP (Power Inductors) | CMP201209UE1R0MT | 2.0 x 1.2 x 0.9 | 20% | 1.0 H | 0.26 | 220 | 1 | 75 |
| CMP (Power Inductors) | CMP321609UE1R0MT | 3.2 x 1.6 x 0.9 | 20% | 1.0 H | 0.20 | 250 | 1 | 60 |
| VHF (High Frequency Inductors) | VHF100505H1N0ST | 1.0 x 0.5 x 0.5 | 0.3 nH | 1.0 nH | 0.10 | 400 | 100 | 10000 |
| VHF (High Frequency Inductors) | VHF160808H1N5ST | 1.6 x 0.8 x 0.8 | 0.3 nH | 1.5 nH | 0.10 | 400 | 100 | 10000 |
| VHF (High Frequency Inductors) | VHF201209H1N5ST | 2.0 x 1.2 x 0.9 | 0.3 nH | 1.5 nH | 0.10 | 600 | 100 | 6000 |
| CBG (Chip Beads) | CBG100505U121T | 1.0 x 0.5 x 0.5 | 25% | 120 | 0.50 | 150 | 100 | N/A |
| CBG (Chip Beads) | CBG160808U101T | 1.6 x 0.8 x 0.8 | 25% | 100 | 0.20 | 300 | 100 | N/A |
| CBG (Chip Beads) | CBG201209U101T | 2.0 x 1.2 x 0.9 | 25% | 100 | 0.18 | 500 | 100 | N/A |
| CBG (Chip Beads) | CBG321609U101T | 3.2 x 1.6 x 0.9 | 25% | 100 | 0.15 | 1000 | 100 | N/A |
| CBG (Chip Beads) | CBG322513U100T | 3.2 x 2.5 x 1.3 | N/A (Range 7-15) | 10 | 0.10 | 1000 | 100 | N/A |
| CBG (Chip Beads) | CBG451616U190T | 4.5 x 1.6 x 1.6 | N/A (Range 12-25) | 19 | 0.10 | 1000 | 100 | N/A |
| CBG (Chip Beads) | CBG453215U300T | 4.5 x 3.2 x 1.5 | 25% | 30 | 0.15 | 1000 | 100 | N/A |
| CBW (Power Beads) | CBW100505U102T | 1.0 x 0.5 x 0.5 | 25% | 1000 | 1.00 | 200 | 100 | N/A |
| CBW (Power Beads) | CBW160808U101T | 1.6 x 0.8 x 0.8 | 25% | 100 | 0.15 | 1000 | 100 | N/A |
| CBW (Power Beads) | CBW201209U101T | 2.0 x 1.2 x 0.9 | 25% | 100 | 0.10 | 2500 | 100 | N/A |
| CBW (Power Beads) | CBW321609U101T | 3.2 x 1.6 x 0.9 | 25% | 100 | 0.07 | 3000 | 100 | N/A |
| CBW (Power Beads) | CBW322513U102T | 3.2 x 2.5 x 1.3 | 25% | 1000 | 0.30 | 2000 | 100 | N/A |
| CBW (Power Beads) | CBW451616U151T | 4.5 x 1.6 x 1.6 | 25% | 150 | 0.10 | 3000 | 100 | N/A |
| CBW (Power Beads) | CBW453215U101T | 4.5 x 3.2 x 1.5 | 25% | 100 | 0.08 | 4000 | 100 | N/A |
| CBM (Ultra-high Current Beads) | CBM100505U102T | 1.0 x 0.5 x 0.5 | 25% | 1000 | 0.65 | 300 | 100 | N/A |
| CBM (Ultra-high Current Beads) | CBM160808U101T | 1.6 x 0.8 x 0.8 | 25% | 100 | 0.06 | 2500 | 100 | N/A |
| CBM (Ultra-high Current Beads) | CBM201209U101T | 2.0 x 1.2 x 0.9 | 25% | 100 | 0.05 | 3000 | 100 | N/A |
| CBM (Ultra-high Current Beads) | CBM321609U101T | 3.2 x 1.6 x 0.9 | 25% | 100 | 0.035 | 4000 | 100 | N/A |
| CBM (Ultra-high Current Beads) | CBM451616U190T | 4.5 x 1.6 x 1.6 | N/A (Range 12-25) | 19 | 0.01 | 6000 | 100 | N/A |
| CBM (Ultra-high Current Beads) | CBM453215U300T | 4.5 x 3.2 x 1.5 | 25% | 30 | 0.01 | 6000 | 100 | N/A |
| CBY (Peak Beads) | CBY100505A121T | 1.0 x 0.5 x 0.5 | 25% | 120 | 0.50 | 150 | 100 | N/A |
| CBY (Peak Beads) | CBY160808A121T | 1.6 x 0.8 x 0.8 | 25% | 120 | 0.35 | 200 | 100 | N/A |
| CBY (Peak Beads) | CBY201209A121T | 2.0 x 1.2 x 0.9 | 25% | 120 | 0.25 | 600 | 100 | N/A |
| CBY (Peak Beads) | CBY321609A121T | 3.2 x 1.6 x 0.9 | 25% | 120 | 0.20 | 1000 | 100 | N/A |
| CBH (High R Beads) | CBH160808W102T | 1.6 x 0.8 x 0.8 | 25% | 1000 | 0.90 | 100 | 100 | N/A |
| CBH (High R Beads) | CBH201209W102T | 2.0 x 1.2 x 0.9 | 25% | 1000 | 0.50 | 180 | 100 | N/A |
| CBH (High R Beads) | CBH321609W102T | 3.2 x 1.6 x 0.9 | 25% | 1000 | 0.12 | 2000 | 100 | N/A |
Reliability Testing Items
| No. | Item | Requirements | Test Methods and Remarks |
|---|---|---|---|
| 1 | Operating Temperature Range | -40+85 | |
| 2 | Solder ability | At least 90% of terminal electrode should be covered with solder | Preheating temperature: 120-150, time: 60s; Solder temperature: 2455, duration: 51s. |
| 3 | Resistance to Soldering Heat | At least 75% of terminal electrode should be covered with solder. No mechanical damage. | Inductance change: 10% (H material), 20% (V, U material), 25% (X material), 30% (J material). Q value change: 30% (ferrite), 20% (ceramic). Impedance change: 30%. Solder temperature: 2605, duration: 101s. |
| 4 | Adhesion of electrode | Termination and body should be no damage. | Applied force: 5N (1005, 1608 series), 10N (2012, 3216, 2520, 3225, 4516, 4532 series). Keep time: 101S. |
| 5 | Low temperature resistance | No mechanical damage. Inductance change: 10%. Q value change: 30% (ferrite), 20% (ceramic). Impedance change: 30%. | Temperature: -552, Testing time: 500h. |
| 6 | Bending strength | No mechanical damage. Inductance change: 10%. Q value change: 30% (ferrite), 20% (ceramic). Impedance change: 30%. | Warp: 2mm. Testing board thickness: 0.8mm. |
| 7 | Drop | No mechanical damage. Inductance change: 10%. Q value change: 30% (ferrite), 20% (ceramic). Impedance change: 30%. | Drop 10 times from 1m height onto concrete floor. |
| 8 | Vibration | No mechanical damage. Inductance change: 10%. Q value change: 30% (ferrite), 20% (ceramic). Impedance change: 30%. | Amplitude: 1.5mm. Test time: 2h in each of 3 directions. Frequency range: 10Hz-55Hz-10Hz (1min). |
| 9 | High temperature resistance | No mechanical damage. Inductance change: 10%. Q value change: 30% (ferrite), 20% (ceramic). Impedance change: 30%. | Applied rated current (CBW Series). Temperature: 852. Testing time: 1000h. |
| 10 | Static Humidity | No mechanical damage. Inductance change: 10%. Q value change: 30% (ferrite), 20% (ceramic). Impedance change: 30%. | Humidity: 90-95% RH. Temperature: 552. Testing time: 500h. |
| 11 | Thermal Shock | No mechanical damage. Inductance change: 10%. Q value change: 30% (ferrite), 20% (ceramic). Impedance change: 30%. | -40 (303min) to +85 (303min). Transforming interval: max 20 sec. Cycles: 32. |
Product Packaging
| Packaging Type | Details |
|---|---|
| Tape & Reel | Available in standard reel sizes (CF-8, CF-12) with specific dimensions and quantities per reel/box/case. Includes leader and blank portion specifications. Embossed tape dimensions provided for various sizes. Peeling force: 0.1N-0.7N at 300mm/min. |
| Bulk | Available as ''. |
Recommended Soldering Conditions
Reflow Soldering: Products should be soldered within the specified curves. Temperature difference between product surface and solder should not exceed 150 during preheating and 100 during cooling. Excessive conditions may cause electrode corrosion.
Flow Soldering: Conditions similar to reflow soldering, adhering to specified curves.
Iron Soldering: Temperature: 350 max, Power: 30W max, Time: < 5S. Avoid contact with terminal electrodes.
Cleaning
Cleaning Conditions: Temperature: 60 max. Time: 1 minute min. Ultrasonic power: 200W max.
Storage Requirements
Storage Period: Within 6 months from inspection date. If exceeding 6 months, check solderability before use.
Storage Conditions: Temperature: -10 to +40, Humidity: 30-70% RH. Avoid corrosive gases, moisture, dust, heat shock, vibration, and direct sunlight. Store in airtight packaging on shelves.
Usage Of ODS (Ozone Depleting Substances)
The company does not use ODS such as CCl4 and HCFC in its production processes.
Notes
1. 'Unitary lead free' products comply with RoHS directives.
2. Product specification guarantees quality as a single unit. Ensure your product has been validated with our component integrated.
3. Failures from uses deviating from intended applications or exceeding test specification limits are not warranted.
2411220117_FH-CMP201209XD6R8KT_C139247.pdf
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