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Specifications
Current - Saturation (Isat):
-
Mfr. Part #:
CMP321609XD100KT
Package:
1206
Key Attributes
Model Number:
CMP321609XD100KT
Product Description
Product Overview
This document details chip beads, chip inductors, and chip high-frequency inductors from the CBG, CBW, CBM, CBY, CBH, CMI, CMP, and VHF series. These components are designed for various electronic applications, offering specific electrical characteristics such as impedance, inductance, DC resistance, Q value, and rated current. They are available in multiple sizes and materials, catering to diverse circuit requirements.
Product Attributes
- Brand: Not explicitly stated, but implied to be the manufacturer listed.
- Origin: Implied to be from the manufacturer listed.
- Materials: Ferrite (Ni-Cu-Zn system for inductors), Ceramic (Al2O3 for VHF inductors), Silver (Ag) for inner electrodes, Ni/Sn plating for terminal electrodes.
- Certifications: RoHS compliant for "Unitary lead free" products.
Technical Specifications
| Product Series | Part Number Example | Size (L x W x T) | Tolerance | Inductance / Impedance | DC Resistance (Max) | Rated Current (Max) | Test Frequency | Self-Resonant Frequency (Min) |
|---|---|---|---|---|---|---|---|---|
| CMI (Ferrite Inductors) | CMI100505U1R0KT | 1.0 x 0.5 x 0.5 mm | 10% | 1.0 H | 0.90 | 25 mA | 10 MHz | 40 MHz |
| CMI (Ferrite Inductors) | CMI160808U1R0KT | 1.6 x 0.8 x 0.8 mm | 10% | 1.0 H | 0.50 | 25 mA | 10 MHz | 75 MHz |
| CMI (Ferrite Inductors) | CMI201209U1R0KT | 2.0 x 1.2 x 0.9 mm | 10% | 1.0 H | 0.40 | 50 mA | 10 MHz | 75 MHz |
| CMI (Ferrite Inductors) | CMI321609U1R0KT | 3.2 x 1.6 x 0.9 mm | 10% | 1.0 H | 0.30 | 100 mA | 10 MHz | 75 MHz |
| CMI (Ferrite Inductors) | CMI322513U1R0KT | 3.2 x 2.5 x 1.3 mm | 10% | 1.0 H | 0.20 | 600 mA | 10 MHz | 70 MHz |
| CMI (Ferrite Inductors) | CMI453215U1R0KT | 4.5 x 3.2 x 1.5 mm | 10% | 1.0 H | 0.55 | 650 mA | 10 MHz | 50 MHz |
| CMP (Power Inductors) | CMP201209UD1R0MT | 2.0 x 1.2 x 0.9 mm | 20% | 1.0 H | 0.24 | 800 mA | 1 MHz | 75 MHz |
| CMP (Power Inductors) | CMP321609UD1R0MT | 3.2 x 1.6 x 0.9 mm | 20% | 1.0 H | 0.15 | 1200 mA | 1 MHz | 60 MHz |
| CMP (Power Inductors) | CMP252009UD1R0MT | 2.5 x 2.0 x 0.9 mm | 20% | 1.0 H | 0.12 | 1500 mA | 1 MHz | 70 MHz |
| CMP (Power Inductors) | CMP160808UE1R0MT | 1.6 x 0.8 x 0.8 mm | 20% | 1.0 H | 0.30 | 150 mA | 1 MHz | 75 MHz |
| VHF (High Frequency Inductors) | VHF100505H1N0ST | 1.0 x 0.5 x 0.5 mm | 0.3 nH | 1.0 nH | 0.10 | 400 mA | 100 MHz | 10000 MHz |
| VHF (High Frequency Inductors) | VHF160808H1N5ST | 1.6 x 0.8 x 0.8 mm | 0.3 nH | 1.5 nH | 0.10 | 400 mA | 100 MHz | 10000 MHz |
| VHF (High Frequency Inductors) | VHF201209H1N5ST | 2.0 x 1.2 x 0.9 mm | 0.3 nH | 1.5 nH | 0.10 | 600 mA | 100 MHz | 6000 MHz |
| CBG (Chip Beads) | CBG100505U120T | 1.0 x 0.5 x 0.5 mm | 25% | 120 | 0.50 | 150 mA | 100 MHz | N/A |
| CBG (Chip Beads) | CBG160808U121T | 1.6 x 0.8 x 0.8 mm | 25% | 120 | 0.20 | 300 mA | 100 MHz | N/A |
| CBG (Chip Beads) | CBG201209U121T | 2.0 x 1.2 x 0.9 mm | 25% | 120 | 0.20 | 500 mA | 100 MHz | N/A |
| CBG (Chip Beads) | CBG321609U121T | 3.2 x 1.6 x 0.9 mm | 25% | 120 | 0.15 | 1000 mA | 100 MHz | N/A |
| CBG (Chip Beads) | CBG322513U100T | 3.2 x 2.5 x 1.3 mm | 7~15 | 10 | 0.10 | 1000 mA | 100 MHz | N/A |
| CBG (Chip Beads) | CBG451616U190T | 4.5 x 1.6 x 1.6 mm | 12~25 | 19 | 0.10 | 1000 mA | 100 MHz | N/A |
| CBG (Chip Beads) | CBG453215U300T | 4.5 x 3.2 x 1.5 mm | 25% | 30 | 0.15 | 1000 mA | 100 MHz | N/A |
| CBW (Power Beads) | CBW100505U121T | 1.0 x 0.5 x 0.5 mm | 25% | 120 | 0.25 | 450 mA | 100 MHz | N/A |
| CBW (Power Beads) | CBW160808U121T | 1.6 x 0.8 x 0.8 mm | 25% | 120 | 0.15 | 1000 mA | 100 MHz | N/A |
| CBW (Power Beads) | CBW201209U121T | 2.0 x 1.2 x 0.9 mm | 25% | 120 | 0.10 | 2000 mA | 100 MHz | N/A |
| CBW (Power Beads) | CBW321609U121T | 3.2 x 1.6 x 0.9 mm | 25% | 120 | 0.07 | 3000 mA | 100 MHz | N/A |
| CBW (Power Beads) | CBW322513U110T | 3.2 x 2.5 x 1.3 mm | 7~15 | 11 | 0.05 | 5000 mA | 100 MHz | N/A |
| CBW (Power Beads) | CBW451616U190T | 4.5 x 1.6 x 1.6 mm | 12~25 | 19 | 0.015 | 6000 mA | 100 MHz | N/A |
| CBW (Power Beads) | CBW453215U300T | 4.5 x 3.2 x 1.5 mm | 25% | 30 | 0.06 | 5000 mA | 100 MHz | N/A |
| CBM (Ultra-high Current Beads) | CBM100505U101T | 1.0 x 0.5 x 0.5 mm | 25% | 100 | 0.15 | 800 mA | 100 MHz | N/A |
| CBM (Ultra-high Current Beads) | CBM160808U101T | 1.6 x 0.8 x 0.8 mm | 25% | 100 | 0.06 | 2500 mA | 100 MHz | N/A |
| CBM (Ultra-high Current Beads) | CBM201209U101T | 2.0 x 1.2 x 0.9 mm | 25% | 100 | 0.05 | 3000 mA | 100 MHz | N/A |
| CBM (Ultra-high Current Beads) | CBM321609U101T | 3.2 x 1.6 x 0.9 mm | 25% | 100 | 0.035 | 4000 mA | 100 MHz | N/A |
| CBM (Ultra-high Current Beads) | CBM451616U190T | 4.5 x 1.6 x 1.6 mm | 12~25 | 19 | 0.01 | 6000 mA | 100 MHz | N/A |
| CBM (Ultra-high Current Beads) | CBM453215U300T | 4.5 x 3.2 x 1.5 mm | 25% | 30 | 0.01 | 6000 mA | 100 MHz | N/A |
| CBY (Peak Beads) | CBY100505A121T | 1.0 x 0.5 x 0.5 mm | 25% | 120 | 0.50 | 150 mA | 100 MHz | N/A |
| CBY (Peak Beads) | CBY160808A121T | 1.6 x 0.8 x 0.8 mm | 25% | 120 | 0.35 | 200 mA | 100 MHz | N/A |
| CBY (Peak Beads) | CBY201209A121T | 2.0 x 1.2 x 0.9 mm | 25% | 120 | 0.25 | 600 mA | 100 MHz | N/A |
| CBY (Peak Beads) | CBY321609A121T | 3.2 x 1.6 x 0.9 mm | 25% | 120 | 0.20 | 500 mA | 100 MHz | N/A |
| CBH (High R Beads) | CBH160808W121T | 1.6 x 0.8 x 0.8 mm | 25% | 120 | 0.18 | 500 mA | 100 MHz | N/A |
| CBH (High R Beads) | CBH201209W121T | 2.0 x 1.2 x 0.9 mm | 25% | 120 | 0.15 | 400 mA | 100 MHz | N/A |
| CBH (High R Beads) | CBH321609W121T | 3.2 x 1.6 x 0.9 mm | 25% | 120 | 0.15 | 1000 mA | 100 MHz | N/A |
Reliability Testing
| Item | Requirements | Test Methods and Remarks |
|---|---|---|
| Operating Temperature Range | -40+85 | N/A |
| Solderability | At least 90% of terminal electrode should be covered with solder. | Preheating: 120-150 (60s), Solder: 96.5Sn/3.0Ag/0.5Cu, Temp: 2455, Duration: 51s. |
| Resistance to Soldering Heat | At least 75% of terminal electrode should be covered with solder. No mechanical damage. | Preheating: 120-150 (60s), Solder: 96.5Sn/3.0Ag/0.5Cu, Temp: 2605, Duration: 101s. |
| Adhesion of electrode | The termination and body should be no damage. | Force: 5N (1005/1608), 10N (others). Keep time: 101S. |
| Low temperature resistance | No mechanical damage. Inductance change: 10%. | Temp: -552. Time: 500h. |
| Bending strength | No mechanical damage. Inductance change: 10%. | Warp: 2mm. Substrate: Glass epoxy. Thickness: 0.8mm. |
| Drop | No mechanical damage. Inductance change: 10%. | Drop 10 times from 1m height onto concrete floor. |
| Vibration | No mechanical damage. Inductance change: 10%. | Amplitude: 1.5mm. Time: 2h per direction (3 directions). Freq: 10Hz-55Hz-10Hz. |
| High temperature resistance | No mechanical damage. Inductance change: 10%. | Applied current: rated current (CBW Series). Time: 1000h. Temp: 852. |
| Static Humidity | No mechanical damage. Inductance change: 10%. | Humidity: 90-95% RH. Temp: 552. Time: 500h. |
| Thermal Shock | No mechanical damage. Inductance change: 10%. | Temp: -40 (303min) to +85 (303min). Cycles: 32. |
Product Packaging
| Packaging Type | Dimensions / Details |
|---|---|
| Reel Size | CF-8: 178 2.0 mm (A), 22.0 2.0 mm (B), 12.5 1.5 mm (C), 57 2.0 mm (N), 8 mm (G) CF-12: 3302.0 mm (A), 22.02.0 mm (B), 12.51.5 mm (C), 98 2.0 mm (N), 12 mm (G) |
| Taping Dimensions (Paper Tape) | 100505: A=0.650.1, B=1.150.1, F=2.00.05, T=0.8max 160808: A=1.10.2, B=1.90.2, F=4.00.2, T=1.1max 201209: A=1.50.2, B=2.30.2, F=4.00.2, T=1.1max 321609: A=1.90.2, B=3.50.2, F=4.00.2, T=1.1max |
| Taping Dimensions (Embossed Tape) | Various dimensions (W, P, E, F, D, D1, P0, P010, P2, A0, B0, t, K0) listed for sizes 4532, 4516, 3225, 3216, 2012, 2520. |
| Peeling Off Force | 0.1N~0.7N (pulling in direction of arrow), Speed: 300mm/min. Cover bond should not be damaged. |
| Packaging Quantity (Pcs) | Per Reel: 3000-10000 Per Box: 12000-100000 Per Case: 36000-600000 (Varies by size) |
Recommended Soldering Conditions
| Method | Conditions |
|---|---|
| Reflow Soldering | Temperature difference between solder and ferrite surface: max 150. Cooling difference: max 100. Soldering within allowable range of curve. |
| Flow Soldering | Conditions specified by curve. |
| Iron Soldering | Temperature: 350 max. Power: 30W max. Time: < 5S. Avoid contact with terminal electrodes. |
Cleaning
| Parameter | Specification |
|---|---|
| Temperature | 60 max |
| Time | 1 minute min. |
| Ultrasonic Output Power | 200W max |
Storage Requirements
| Parameter | Specification |
|---|---|
| Storage Period | Within 6 months from factory inspection date. Check solder ability if exceeded. |
| Storage Conditions | Temperature: -10 ~ +40, Humidity: 30 ~ 70% RH. Avoid corrosive gases, humidity, dust, heat shock, vibration, direct sunlight. Store in airtight packaging. |
Usage Of ODS (Ozone Depleting Substances)
The company does not use ODS such as CCl4 and HCFC in its production processes.
Notes
- Products labeled "Unitary lead free" comply with RoHS directive requirements.
- This specification guarantees product quality as a single unit. Ensure your product has been evaluated and confirmed when our product is mounted.
- Failure caused by use deviating from intended use as described in this specification is not warranted.
2411220117_FH-CMP321609XD100KT_C139251.pdf
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