Product Overview
The VHF160808H Series Chip High Frequency Inductors are designed for high-frequency applications. Constructed with a ceramic body and internal silver electrodes, these inductors feature terminal electrodes with silver plating and Ni/Sn plating for reliable connectivity. They are suitable for various electronic circuits requiring precise inductance values and stable performance.
Product Attributes
- Product Type: Chip high frequency inductors
- Series: VHF160808H Series
- Body Material: Ceramic (Al2O3)
- Inner Electrode Material: Pure Silver (Ag)
- Terminal Electrode Material: Silver Layer (Ag Layer) / Ni/Sn Plating
- Packaging: Tape & Reel (T)
- RoHS Compliance: Available (if marked 'Unitary lead free')
Technical Specifications
Dimensions
| Size (LWT) | Length (mm) | Width (mm) | Thickness (mm) | Terminal Electrode Length (mm) |
|---|---|---|---|---|
| 160808 | 1.6 0.20 (0.063 0.008) | 0.8 0.20 (0.031 0.008) | 0.8 0.20 (0.031 0.008) | 0.3 0.2 (0.012 0.008) |
Electrical Characteristics
| Part NO. | Inductance (nH) | Q Value (min) | DC Resistance () max | Test Frequency (MHz) | Test Voltage (mV) | SRF (MHz) min | Rated Current (mA) max |
|---|---|---|---|---|---|---|---|
| VHF160808H1N0T | 1.0 | 8 | 0.05 | 100 | 50 | 10000 | 500 |
| VHF160808H1N2T | 1.2 | 8 | 0.05 | 100 | 50 | 10000 | 500 |
| VHF160808H1N5T | 1.5 | 8 | 0.10 | 100 | 50 | 6000 | 500 |
| VHF160808H1N8T | 1.8 | 8 | 0.10 | 100 | 50 | 6000 | 500 |
| VHF160808H2N0T | 2.0 | 8 | 0.10 | 100 | 50 | 6000 | 500 |
| VHF160808H2N2T | 2.2 | 8 | 0.10 | 100 | 50 | 6000 | 500 |
| VHF160808H2N4T | 2.4 | 8 | 0.12 | 100 | 50 | 6000 | 500 |
| VHF160808H2N7T | 2.7 | 10 | 0.12 | 100 | 50 | 6000 | 500 |
| VHF160808H3N3T | 3.3 | 10 | 0.15 | 100 | 50 | 6000 | 500 |
| VHF160808H3N6T | 3.6 | 10 | 0.16 | 100 | 50 | 6000 | 500 |
| VHF160808H3N9T | 3.9 | 10 | 0.16 | 100 | 50 | 6000 | 500 |
| VHF160808H4N3T | 4.3 | 10 | 0.18 | 100 | 50 | 6000 | 500 |
| VHF160808H4N7T | 4.7 | 10 | 0.20 | 100 | 50 | 6000 | 500 |
| VHF160808H5N1T | 5.1 | 10 | 0.25 | 100 | 50 | 5500 | 500 |
| VHF160808H5N6T | 5.6 | 10 | 0.25 | 100 | 50 | 5000 | 500 |
| VHF160808H6N8T | 6.8 | 10 | 0.30 | 100 | 50 | 5000 | 500 |
| VHF160808H7N5T | 7.5 | 10 | 0.35 | 100 | 50 | 4500 | 500 |
| VHF160808H8N2T | 8.2 | 10 | 0.35 | 100 | 50 | 4500 | 500 |
| VHF160808H9N1T | 9.1 | 10 | 0.40 | 100 | 50 | 3500 | 500 |
| VHF160808H10NT | 10 | 12 | 0.40 | 100 | 50 | 3500 | 300 |
| VHF160808H12NT | 12 | 12 | 0.45 | 100 | 50 | 3000 | 300 |
| VHF160808H15NT | 15 | 12 | 0.50 | 100 | 50 | 2300 | 300 |
| VHF160808H18NT | 18 | 12 | 0.55 | 100 | 50 | 2200 | 300 |
| VHF160808H22NT | 22 | 12 | 0.60 | 100 | 50 | 2000 | 300 |
| VHF160808H24NT | 24 | 12 | 0.60 | 100 | 50 | 2000 | 300 |
| VHF160808H27NT | 27 | 12 | 0.65 | 100 | 50 | 1700 | 300 |
| VHF160808H33NT | 33 | 12 | 0.70 | 100 | 50 | 1500 | 300 |
| VHF160808H36NT | 36 | 12 | 0.70 | 100 | 50 | 1400 | 300 |
| VHF160808H39NT | 39 | 12 | 0.70 | 100 | 50 | 1400 | 300 |
| VHF160808H47NT | 47 | 12 | 0.70 | 100 | 50 | 1200 | 300 |
| VHF160808H56NT | 56 | 12 | 0.75 | 100 | 50 | 1100 | 300 |
| VHF160808H68NT | 68 | 12 | 0.85 | 100 | 50 | 900 | 300 |
| VHF160808H82NT | 82 | 8 | 1.00 | 100 | 50 | 800 | 300 |
| VHF160808HR10T | 100 | 8 | 1.20 | 100 | 50 | 700 | 300 |
| VHF160808HR12T | 120 | 8 | 1.40 | 50 | 50 | 600 | 200 |
| VHF160808HR15T | 150 | 8 | 1.60 | 50 | 50 | 500 | 200 |
| VHF160808HR18T | 180 | 8 | 1.90 | 50 | 50 | 400 | 200 |
| VHF160808HR22T | 220 | 8 | 2.40 | 50 | 50 | 350 | 200 |
| VHF160808HR27T | 270 | 8 | 2.60 | 50 | 50 | 350 | 150 |
| VHF160808HR33T | 330 | 8 | 2.80 | 50 | 50 | 350 | 150 |
| VHF160808HR39T | 390 | 8 | 3.20 | 50 | 50 | 300 | 150 |
| VHF160808HR43T | 430 | 8 | 3.40 | 50 | 50 | 280 | 150 |
| VHF160808HR47T | 470 | 8 | 3.60 | 50 | 50 | 250 | 150 |
Inductance Tolerance: Ls < 6.8nH, select 'S/D'; Ls 6.8nH, select 'J/K'. S (0.3nH), D (0.5nH), J (5%), K (10%).
Note: VHF160808H series products have no compensation value; the product test center value equals the nominal value.
Reliability Testing Items
| No. | Item | Requirements | Test Methods and Remarks |
|---|---|---|---|
| 1 | Operating Temperature Range | -40+85 | |
| 2 | Solder ability | At least 95% of terminal electrode should be covered with solder. | Preheating temperature: 120~150, Preheating time: 60s, Solder: 96.5%Sn/3.0%Ag/0.5%Cu, Solder temperature: 2455, Immersion depth: 10mm, Duration: 51s, Dip to flux: 3 ~ 5 s |
| 3 | Resistance to Soldering Heat | At least 95% of terminal electrode should be covered with solder. No mechanical damage. Inductance change: 10% (H series ceramic), Q value change: 20% (ceramic). | Preheating temperature: 120~150, Preheating time: 60s, Solder: 96.5%Sn/3.0%Ag/0.5%Cu, Solder temperature: 2605, Immersion depth: 10mm, Duration: 101s, Dip to flux: 3 ~ 5 s |
| 4 | Adhesion of electrode | The termination and body should be no damage. | Applied force: 7N for 1608 series. Keep time: 101S |
| 5 | Low temperature resistance | No mechanical damage. Inductance change: within 10%. Q value change (ceramic): within 20%. | Temperature: -402, Testing time: 1000+240/-0 h |
| 6 | Bending strength | No mechanical damage. | Testing board: glass epoxy-resin substrate. Compression speed: 0.5mm/s, Curvature: 2mm, Hold time: 20s 1s |
| 7 | Vibration | No mechanical damage. Inductance change: within 10%. Q value change (ceramic): within 20%. | Amplitude: 1.5mm. Test time: 2h in each of 3 mutually perpendicular directions. Frequency range: 10Hz to 55Hz to 10Hz (1 minute). |
| 8 | High temperature resistance | No mechanical damage. Inductance change: within 10%. Q value change (ceramic): within 20%. | Testing time: 1000+240/-0 h. Temperature: 852. |
| 9 | Static Humidity | No mechanical damage. Inductance change: within 10%. Q value change (ceramic): within 20%. | Humidity: 90% to 95% RH, Temperature: 602. Testing time: 1000+240/-0 h. |
| 10 | High temperature load | No mechanical damage. Inductance change: within 10%. Q value change (ceramic): within 20%. | Imposed current: rated current. Testing time: 1000+240/-0 h. Temperature: 852. |
| 11 | Temperature Shock | No mechanical damage. Inductance change: within 10%. Q value change (ceramic): within 20%. | Temperature: -55 for 303min +125 for 303min. Number of cycles: 100. |
Note: Measurements for electrical performance tests should be made after 242hrs of recovery under standard conditions.
Packaging
| Size | Pieces per Reel | Pieces per Box | Pieces per Case |
|---|---|---|---|
| 160808 | 4000 | 40000 | 240000 |
Taping Dimensions (mm): Refer to document for detailed drawings.
Peeling Off Force: Cover tape peeling force: 0.1N0.7N. Peeling speed: 300mm/min.
Recommended Soldering Conditions
Suitable for reflow soldering.
- Pre-heating: Temperature difference between solder and ferrite surface should be limited to 150 max. Cooling into solvent after soldering should be limited to 100 max.
- Reflow Soldering Profile: Refer to document for curve.
- Iron Soldering: Temperature: 350 (Max). Power: 30W (Max). Duration: < 5S. Avoid touching terminal electrodes.
Cleaning
- Cleaning Temperature: 60 (Max)
- Cleaning Time: 1 minute (Min)
- Ultrasonic Power: 200W (Max)
Storage Requirements
- Storage Period: Within 1 year from the factory inspection date. If over 1 year, check solderability before use.
- Storage Conditions: Temperature: -10+40, Relative Humidity: 3070%. Avoid corrosive substances, moisture, dust, heat shock, vibration, and direct sunlight. Store in sealed packaging on a pallet.
Usage Of ODS (Ozone Depleting Substances)
The company does not use ODS such as CCl4 and HCFC in its production process.
Notes
- If the product is marked 'Unitary lead free', it complies with RoHS directive requirements.
- This specification guarantees the quality of the product as a single unit. Ensure your product has been evaluated and confirmed when our product is mounted.
- The company does not warrant against failures caused by uses deviating from the intended use described in this specification.
2410121258_FH-VHF160808H2N0ST_C395081.pdf
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