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Quality Multilayer chip ferrite inductors FH CMI201212J470KT designed with pure silver inner electrodes and plating factory
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Quality Multilayer chip ferrite inductors FH CMI201212J470KT designed with pure silver inner electrodes and plating factory
>
Specifications
Current Rating:
-
Inductance:
47uH
Tolerance:
±10%
Frequency - Self Resonant:
-
Current - Saturation (Isat):
-
DC Resistance(DCR):
-
Type:
Multilayer Inductor
Ratings:
-
Q @ Frequency:
-
Mfr. Part #:
CMI201212J470KT
Package:
0805
Key Attributes
Model Number: CMI201212J470KT
Product Description

Product Overview

The CMI2012 Series Multilayer Chip Ferrite Inductors are designed for various electronic applications. These inductors are constructed with a ferrite or ceramic body, inner electrodes made of pure silver, and terminal electrodes with silver and Ni/Sn plating. They offer a range of inductance values and electrical characteristics suitable for signal line applications.

Product Attributes

  • Product Type: Multilayer Chip Ferrite Inductors
  • Series: CMI2012 Series
  • Material (Body): Ferrite (Ni-Cu-Zn system)
  • Material (Inner Electrode): Pure Silver (Ag)
  • Material (Terminal Electrode): Silver layer (Ag layer) with Ni/Sn plating
  • Plating: Ni/Sn
  • RoHS Compliance: Indicated by "Unitary lead free" product label.

Technical Specifications

Dimensions & Inner Configuration

Size L (mm) W (mm) T (mm) Terminal Electrode Width (mm)
201209 2.00.20 1.20.20 0.90.20 0.50.3
201212 2.00.20 1.20.20 1.20.20 0.50.3

Product Spec. Model Composition

Example: CMI 201209 U 1R0 K T

  • CMI: Multilayer Chip Ferrite Chip Inductors
  • 201209: Dimensions (LWT) (2.01.20.9mm)
  • U: Material code
  • 1R0: Inductance (1.0H)
  • K: Tolerance (10%)
  • T: Packaging (Tape & Reel)

Electrical Characteristics List

Part NO. Tolerance (%) Inductance (H) Q Value (min) RDC ()max Test Frequency (MHz) Test Voltage (mV) SRF (MHz) min Rated Current (mA)max
CMI201209V47NKT 10 0.047 25 0.15 50 50 320 300
CMI201209V56NKT 10 0.056 25 0.15 50 50 320 300
CMI201209V68NKT 10 0.068 25 0.20 50 50 280 300
CMI201209V82NKT 10 0.082 25 0.20 50 50 280 300
CMI201209VR10KT 10 0.10 20 0.20 25 50 235 250
CMI201209VR12KT 10 0.12 20 0.25 25 50 220 250
CMI201209VR15KT 10 0.15 20 0.25 25 50 200 250
CMI201209VR18KT 10 0.18 20 0.30 25 50 185 250
CMI201209VR22KT 10 0.22 20 0.30 25 50 170 250
CMI201209VR27KT 10 0.27 20 0.40 25 50 150 250
CMI201209VR33KT 10 0.33 20 0.40 25 50 145 250
CMI201209VR39KT 10 0.39 25 0.50 25 50 135 200
CMI201209VR47KT 10 0.47 25 0.50 25 50 125 200
CMI201209VR56KT 10 0.56 25 0.60 25 50 115 150
CMI201209VR68KT 10 0.68 25 0.65 25 50 105 150
CMI201209VR82KT 10 0.82 25 0.70 25 50 100 150
CMI201209U1R0KT 10 1.0 35 0.40 10 50 75 50
CMI201209U1R2KT 10 1.2 35 0.40 10 50 65 50
CMI201209U1R5KT 10 1.5 35 0.40 10 50 60 50
CMI201209U1R8KT 10 1.8 35 0.40 10 50 55 50
CMI201209U2R2KT 10 2.2 35 0.60 10 50 50 50
CMI201209U2R7KT 10 2.7 35 0.60 10 50 45 50
CMI201209U3R3KT 10 3.3 35 0.60 10 50 41 50
CMI201209U3R9KT 10 3.9 35 0.80 10 50 38 50
CMI201209U4R7KT 10 4.7 35 0.90 10 50 35 30
CMI201209X5R6KT 10 5.6 30 1.00 4 50 32 15
CMI201209X6R8KT 10 6.8 30 1.05 4 50 29 15
CMI201209X8R2KT 10 8.2 30 1.05 4 50 26 15
CMI201209X100KT 10 10 30 1.15 2 50 24 15
CMI201209X120KT 10 12 30 1.15 2 50 22 15
CMI201209J150KT 10 15 25 1.15 1 50 19 5
CMI201209J180KT 10 18 25 1.20 1 50 18 5
CMI201209J220KT 10 22 25 1.20 1 50 16 5
CMI201209J270KT 10 27 25 1.50 1 50 16 5
CMI201209J330MT 20 33 25 1.50 1 50 16 5
CMI201212J390MT 20 39 25 1.50 1 50 16 5
CMI201212J470MT 20 47 25 1.70 1 50 15 5
CMI201212J560MT 20 56 25 2.60 1 50 10 5
CMI201212J680MT 20 68 25 2.60 1 50 10 5

Reliability Testing Items

No. Items Requirements Test Methods and Remarks
1 Operating Temperature Range -40+85
2 Solder ability At least 95% of terminal electrode should be covered with solder Preheating temperature:120 to 150; Preheating time: 60s; Solder: 96.5%Sn/3.0%Ag/0.5%Cu; Solder temperature: 2455; Immersion tin depth:10mm; Duration: 51s; Dip performance to a flux of about:3 ~ 5 s
3 Resistance to Soldering At least 95% of terminal electrode should be covered with solder. No mechanical damage. Inductance change: V,U: 20%; X: 25%; J: 30%. Q value change(ferrite): within 30% Preheating temperature: 120 to 150; Preheating time: 60s; Solder: 96.5%Sn/3.0%Ag/0.5%Cu; Solder temperature: 2605; Immersion tin depth:10mm; Duration: 101s; Dip performance to a flux of about:3 ~ 5 s
4 Adhesion of electrode The termination and body should be no damage. Applied force: 10N for 2012 series. Keep time: 101S
5 Low temperature resistance No mechanical damage. Inductance change: within 10%. Q value change(ferrite): within 30%. Temperature: -402; Testing time: 1000 24h
6 Bending strength No mechanical damage. Testing board: glass epoxy-resin substrate; For 0.5 mm/s compression speed, curvature: 2mm, hold time: 20s1s
7 Vibration No mechanical damage. Inductance change: within 10%. Q value change(ferrite): within 30%. Amplitude modulation: 1.5mm; Test time: 2h in each of 3 mutually perpendicular directions; Frequency range: 10Hz to 55Hz to 10Hz for 1min.
8 High temperature resistance No mechanical damage. Inductance change: within 10%. Q value change(ferrite): within 30%. Testing time: 1000 24h; Temperature: 852
9 Static Humidity No mechanical damage. Inductance change: within 10%. Q value change(ferrite): within 30%. Humidity: 90% to 95% RH; Temperature: 602; Testing time: 1000 24h
10 High temperature load No mechanical damage. Inductance change: within 10%. Q value change(ferrite): within 30%. Impose current: rated current; Testing time: 1000 24h; Temperature: 852
11 Temperature Shock No mechanical damage. Inductance change: within 10%. Q value change(ferrite): within 30%. Temperature: -40 for 303min +85 for 303min; Number of cycles: 32

Note: When there are questions concerning, measurement shall be made after 242hrs of recovery under the standard condition.

Packaging

Size REEL Quantity BOX Quantity CASE Quantity
201212 3000 30000 180000
201209 4000 40000 240000

Peeling off force: 0.1N0.7N (pulling in the direction of arrow); Speed of peeling off: 300mm/min.

Recommended Soldering Conditions (Reflow Soldering)

Soldering Conditions:

  • Temperature difference between solder and ferrite surface during pre-heating: max 150.
  • Temperature difference between product surface and solvent during cooling after soldering: max 100.
  • Products should be soldered within the allowable range indicated by the slanted line in the reflow soldering profile.

Manual Soldering

  • Soldering Iron Temperature: 350 (Max)
  • Power: 30W (Max)
  • Soldering Time: < 5S (Avoid applying the tip of the soldering iron to the terminal electrodes).

Cleaning Conditions

  • Cleaning Temperature: 60 (Max)
  • Cleaning Time: 1 minute (Min)
  • Ultrasonic Output Power: 200W (Max)

Storage Requirements

  • Storage Period: Within 1 year from the factory inspection date. If exceeding 1 year, check solderability before use.
  • Storage Conditions:
    • Warehouse Temperature: -10 +40
    • Relative Humidity: 30 70%
    • Do not store in corrosive substances (sulfur, chlorine gas, acid).
    • Store on a pallet to prevent influence from humidity and dust.
    • Avoid heat shock, vibration, and direct sunlight.
    • Products should be stored in airtight packaged condition.

Usage Of ODS (Ozone Depleting Substances)

ODS such as CCl4, HCFC are not used in the production process.

Notes

  • If the product is labeled "Unitary lead free", it complies with RoHS directive requirements.
  • This specification guarantees the quality of the product as a single unit. Ensure your product has been evaluated and confirmed against your specifications when this product is mounted.
  • The company cannot warrant against failure caused by any use of the product that deviates from the intended use described in this specification.

2410121256_FH-CMI201212J470KT_C105499.pdf

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