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Specifications
Current - Saturation (Isat):
-
Mfr. Part #:
CMP201209XD100MT
Package:
0805
Key Attributes
Model Number:
CMP201209XD100MT
Product Description
Product Overview
The CMP201209 Series is a Multilayer Chip Ferrite Power Inductor designed for various electronic applications. These inductors offer reliable performance with precise electrical characteristics, housed in a compact 2012 (2.0x1.2x0.9mm) form factor. They are manufactured with a ferrite or ceramic body, inner electrodes of pure silver, and terminal electrodes with Ni/Sn plating, ensuring durability and excellent solderability. The series is suitable for applications requiring efficient power management and signal integrity.
Product Attributes
- Product Type: Multilayer Chip Ferrite Power Inductor
- Manufacturer: (Implied by Approval Sheet)
- Material: Ferrite (Ni-Cu-Zn system) for body, Pure Silver (Ag) for inner electrode, Ag layer and Ni/Sn plating for terminal electrode.
- Certifications: RoHS compliant (if marked "Unitary lead free")
Technical Specifications
| Part NO. | Tolerance (%) | Inductance (H) | RDC ()max | Test Frequency (MHz) | Test Voltage (mV) | SRF (MHz) min | Rated Current (mA)max |
|---|---|---|---|---|---|---|---|
| CMP201209VD47NMT | 20 | 0.047 | 0.10 | 1 | 50 | 280 | 1100 |
| CMP201209VD56NMT | 20 | 0.056 | 0.10 | 1 | 50 | 280 | 1100 |
| CMP201209VD68NMT | 20 | 0.068 | 0.15 | 1 | 50 | 250 | 1100 |
| CMP201209VD82NMT | 20 | 0.082 | 0.15 | 1 | 50 | 250 | 1100 |
| CMP201209VDR10MT | 20 | 0.10 | 0.15 | 1 | 50 | 210 | 1100 |
| CMP201209VDR12MT | 20 | 0.12 | 0.15 | 1 | 50 | 200 | 1100 |
| CMP201209VDR15MT | 20 | 0.15 | 0.15 | 1 | 50 | 175 | 1100 |
| CMP201209VDR18MT | 20 | 0.18 | 0.15 | 1 | 50 | 160 | 1100 |
| CMP201209VDR22MT | 20 | 0.22 | 0.15 | 1 | 50 | 150 | 1100 |
| CMP201209VDR27MT | 20 | 0.27 | 0.15 | 1 | 50 | 130 | 1100 |
| CMP201209VDR33MT | 20 | 0.33 | 0.15 | 1 | 50 | 120 | 1100 |
| CMP201209VDR39MT | 20 | 0.39 | 0.15 | 1 | 50 | 110 | 1100 |
| CMP201209VDR47MT | 20 | 0.47 | 0.15 | 1 | 50 | 100 | 1100 |
| CMP201209VDR56MT | 20 | 0.56 | 0.36 | 1 | 50 | 100 | 800 |
| CMP201209VDR68MT | 20 | 0.68 | 0.36 | 1 | 50 | 95 | 800 |
| CMP201209VDR82MT | 20 | 0.82 | 0.36 | 1 | 50 | 90 | 800 |
| CMP201209UD1R0MT | 20 | 1.0 | 0.24 | 1 | 50 | 75 | 800 |
| CMP201209UD1R2MT | 20 | 1.2 | 0.24 | 1 | 50 | 65 | 800 |
| CMP201209UD1R5MT | 20 | 1.5 | 0.30 | 1 | 50 | 60 | 700 |
| CMP201209UD1R8MT | 20 | 1.8 | 0.36 | 1 | 50 | 55 | 600 |
| CMP201209UD2R2MT | 20 | 2.2 | 0.36 | 1 | 50 | 50 | 600 |
| CMP201209UD2R7MT | 20 | 2.7 | 0.36 | 1 | 50 | 45 | 600 |
| CMP201209UD3R3MT | 20 | 3.3 | 0.40 | 1 | 50 | 41 | 350 |
| CMP201209UD3R9MT | 20 | 3.9 | 0.40 | 1 | 50 | 38 | 350 |
| CMP201209UD4R7MT | 20 | 4.7 | 0.40 | 1 | 50 | 35 | 350 |
| CMP201209XD5R6MT | 20 | 5.6 | 0.50 | 1 | 50 | 32 | 250 |
| CMP201209XD6R8MT | 20 | 6.8 | 0.50 | 1 | 50 | 29 | 250 |
| CMP201209XD8R2MT | 20 | 8.2 | 0.56 | 1 | 50 | 26 | 250 |
| CMP201209XD100MT | 20 | 10 | 0.56 | 1 | 50 | 24 | 250 |
| CMP201209XD120MT | 20 | 12 | 0.56 | 1 | 50 | 22 | 250 |
| CMP201209JD150MT | 20 | 15 | 0.65 | 1 | 50 | 19 | 100 |
| Dimension Size | L (mm) | W (mm) | T (mm) | Terminal Electrode Width (mm) |
|---|---|---|---|---|
| 201209 | 2.00.20 | 1.20.20 | 0.90.20 | 0.50.3 |
| Item | Requirements | Test Methods and Remarks |
|---|---|---|
| Operating Temperature Range | -40+85 | |
| Solder ability | At least 95% of terminal electrode should be covered with solder | Preheating temperature:120 to 150, Preheating time: 60s, Solder temperature: 2455, Immersion tin depth:10mm, Duration : 51s |
| Resistance to Soldering | At least 95% of terminal electrode should be covered with solder. No mechanical damage. Inductance: VD, UD: change within 20%; JD: change within 30% | Preheating temperature: 120 to 150, Preheating time: 60s, Solder temperature: 2605, Immersion tin depth:10mm, Duration : 101s |
| Adhesion of electrode | The termination and body should be no damage. | Applied force: 10N for 2012 series. Keep time: 101S |
| Low temperature resistance | No mechanical damage. Inductance change: within 10% | Temperature: -402, Testing time: 1000 +24-0 h |
| Bending strength | No mechanical damage. | Testing board: glass epoxy-resin substrate, curvature: 2mm, hold time: 20s1s |
| Vibration | No mechanical damage. Inductance change: within 10% | Amplitude: 1.5mm, Test time: 2h in each of 3 directions, Frequency range: 10Hz55Hz10Hz (1 minute) |
| High temperature resistance | No mechanical damage. Inductance change: within 10% | Testing time: 1000 +24-0 h, Temperature: 852 |
| Static Humidity | No mechanical damage. Inductance change: within 10% | Humidity: 90% to 95% RH, Temperature: 602, Testing time: 1000 +24-0 h |
| High temperature load | No mechanical damage. Inductance change: within 10% | Imposed current: rated current, Testing time: 1000 +24-0 h, Temperature: 852 |
| Temperature Shock | No mechanical damage. Inductance change: within 10% | Temperature: -40 for 303min +85 for 303min, Number of cycles: 32 |
| Size | Quantity per REEL | Quantity per BOX | Quantity per CASE |
|---|---|---|---|
| 201209 | 4000 | 40000 | 240000 |
| Recommended Soldering Conditions | Details |
|---|---|
| Reflow Soldering | Temperature difference between solder and ferrite surface during pre-heating: max 150. Temperature difference during cooling into solvent: max 100. Products should be soldered within the allowable range indicated by the slanted line in the reflow profile. |
| Iron Soldering | Soldering iron temperature: 350 max, Power: 30W max, Soldering iron dwell time: < 5s. Take care not to apply the tip of the soldering iron to the terminal electrodes. |
| Cleaning Conditions | Details |
|---|---|
| Temperature | 60 max |
| Time | 1 minute min. |
| Ultrasonic output power | 200W max |
| Storage Requirements | Details |
|---|---|
| Storage Period | Within 1 year from the inspection date by the inductor company. If exceeded, solderability should be checked before use. |
| Storage Conditions | Temperature: -10 to +40, Humidity: 30 to 70% relative humidity. Avoid corrosive substances (sulfur, chlorine gas, acid). Store on a palette to prevent influence from humidity and dust. Avoid heat shock, vibration, and direct sunlight. Products should be stored in airtight packaged condition. |
| ODS Usage | Details |
|---|---|
| Substances Not Used | CCl4 (Carbon Tetrachloride), HCFC, etc. |
| Notes | Details |
|---|---|
| Lead-Free Compliance | If marked "Unitary lead free", the product complies with RoHS directive requirements. |
| Customer Product Evaluation | This specification guarantees the quality of our product as a single unit. Please ensure your product has been evaluated and confirmed against your specifications when our product is mounted. |
| Usage Deviation | We cannot warrant against failure caused by any use of our product that deviates from the intended use as described in this product specification. |
2410121310_FH-CMP201209XD100MT_C139245.pdf
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