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Specifications
Mfr. Part #:
MS74-4R7MT
Package:
SMD,7.3x7.3mm
Key Attributes
Model Number:
MS74-4R7MT
Product Description
Product Overview
The MS74 Series of SMD power inductors are designed for general electronic equipment applications, including audio-visual equipment, office automation, and household appliances. These power inductors offer reliable performance with a wide operating temperature range and robust construction.
Product Attributes
- Series: MS74 Series
- Type: SMD Power Inductor
- Manufacturer: (Implied: Fenghua, based on context)
- Compliance: RoHS compliant
Technical Specifications
| Customer Part No. | Fenghua Part No. | Inductance (Ls) (H) | Tolerance | Max. DC Resistance (RDC) () | Rated DC Current (IDC) (A) | Marking |
|---|---|---|---|---|---|---|
| MS74-1R0NT | 1.0 | 30% | 0.022 | 6.00 | 1R0 | |
| MS74-1R5NT | 1.5 | 30% | 0.028 | 3.20 | 1R5 | |
| MS74-2R2NT | 2.2 | 30% | 0.030 | 3.00 | 2R2 | |
| MS74-3R3NT | 3.3 | 30% | 0.035 | 2.80 | 3R3 | |
| MS74-4R7NT | 4.7 | 30% | 0.040 | 2.50 | 4R7 | |
| MS74-6R8NT | 6.8 | 30% | 0.050 | 2.10 | 6R8 | |
| MS74-8R2NT | 8.2 | 30% | 0.060 | 2.00 | 8R2 | |
| MS74-100MT | 10 | 20% | 0.055 | 1.84 | 100 | |
| MS74-120MT | 12 | 20% | 0.058 | 1.71 | 120 | |
| MS74-150MT | 15 | 20% | 0.081 | 1.47 | 150 | |
| MS74-180MT | 18 | 20% | 0.091 | 1.31 | 180 | |
| MS74-220MT | 22 | 20% | 0.110 | 1.23 | 220 | |
| MS74-270MT | 27 | 20% | 0.150 | 1.10 | 270 | |
| MS74-330MT | 33 | 20% | 0.170 | 0.96 | 330 | |
| MS74-390MT | 39 | 20% | 0.230 | 0.91 | 390 | |
| MS74-470MT | 47 | 20% | 0.260 | 0.88 | 470 | |
| MS74-560MT | 56 | 20% | 0.350 | 0.75 | 560 | |
| MS74-680MT | 68 | 20% | 0.380 | 0.69 | 680 | |
| MS74-820MT | 82 | 20% | 0.430 | 0.61 | 820 | |
| MS74-101MT | 100 | 20% | 0.610 | 0.60 | 101 | |
| MS74-121MT | 120 | 20% | 0.660 | 0.52 | 121 | |
| MS74-151MT | 150 | 20% | 0.880 | 0.46 | 151 | |
| MS74-181MT | 180 | 20% | 0.980 | 0.42 | 181 | |
| MS74-221MT | 220 | 20% | 1.170 | 0.36 | 221 | |
| MS74-271MT | 270 | 20% | 1.640 | 0.34 | 271 | |
| MS74-331MT | 330 | 20% | 1.860 | 0.32 | 331 | |
| MS74-391MT | 390 | 20% | 2.850 | 0.29 | 391 | |
| MS74-471MT | 470 | 20% | 3.010 | 0.26 | 471 | |
| MS74-561MT | 560 | 20% | 3.620 | 0.23 | 561 | |
| MS74-681MT | 680 | 20% | 4.630 | 0.22 | 681 | |
| MS74-821MT | 820 | 20% | 5.200 | 0.20 | 821 | |
| MS74-102MT | 1000 | 20% | 6.000 | 0.18 | 102 | |
| MS74-152MT | 1500 | 20% | 8.800 | 0.16 | 152 | |
| MS74-182MT | 1800 | 20% | 10.000 | 0.15 | 182 |
General Specifications
| Parameter | Value |
|---|---|
| Series | MS74 |
| Product Type | SMD Power Inductor |
| Operating Temperature Range | -40 to +85 (Including self-heating) |
| Dimensions (Typical) | Length: 7.3mm 0.30mm, Width: 7.3mm 0.30mm, Thickness: 4.2mm 0.30mm |
| Testing Conditions (Standard) | Temperature: 2015, Humidity: 6520% RH |
| Testing Conditions (Doubt) | Temperature: 202, Humidity: 655% RH, Atmospheric Pressure: 86 to 106 kPa |
| Rated DC Current Definition | Current causing 20% inductance reduction or 40 surface temperature rise (whichever is smaller), reference ambient 20. |
| Core Material | Ni-Zn ferrite DR/RI core |
| Winding Material | Enamelled Wire (H class) |
| Base Material | Phosphor bronze |
| Glue Material | Epoxy |
| Marking Ink | INK |
Reliability Data
| Item | Requirements | Test Methods and Remarks |
|---|---|---|
| Insulation Resistance | 100M | 100 V DC between coil and core for 60 seconds. |
| Solderability | 95% or more of electrode area shall be coated by new solder. | Dip in solder pot (96.5Sn/3.0Ag/0.5Cu) at 245 5 for (51) seconds. |
| Resistance to Soldering Heat | No visible mechanical damage. Inductance change: Within 10%. | Dip in solder pot (96.5Sn/3.0Ag/0.5Cu) at 2605 for (101) seconds. |
| Adhesion of terminal electrode | Strong bond between the pad and the core, without come off. | Subjected to 260 5 for 20 s5 s soldering, then apply 10 N force for 10 1s. |
| High temperature | No visible mechanical damage. Inductance change: Within 10%. | 85 2 , 1000 +24 0 h; Test within 48 hours after 2 hours at room temperature. |
| Low temperature | No visible mechanical damage. Inductance change: Within 10%. | -40 2 , 1000 +24 0 h; Test within 48 hours after 2 hours at room temperature. |
| Temperature Cycling | No visible mechanical damage. Inductance change: Within 10%. | (-403 for (303) min (852) /(303) min, 32 cycles. Test within 48 hours after 2 hours at room temperature. |
| Temperature characteristic | Inductance change Pc-b, Pc-d: Within 20%. | See formula in source document. |
| Constant damp heat | No visible mechanical damage. Inductance change: Within 10%. | (90~95)% RH, 60 2 , 1000 +24 0 h. Test within 48 hours after 2 hours at room temperature. |
| High-temperature load (Life-span) | No visible mechanical damage. Inductance change: Within 10%. | 85 2, 1000 +24 0 h, Apply rated current. Test within 48 hours after 2 hours at room temperature. (Note: Derate current if surface temp > 125) |
Packaging
| Item | Details |
|---|---|
| Tape Dimensions | W: 160.5 mm, P: 7.60.3 mm, E: 7.60.3 mm, F: 1.50.3 mm, P2: 1.50.3 mm, D: 1.750.3 mm, D1: 7.50.3 mm, A0: 5.00.3 mm, B0: 4.00.3 mm, K0: 2.00.3 mm, T: 0.350.10 mm |
| Packing Quantity | Reel (PCS): 1,000; Box (PCS): 4,000; Carton (PCS): 12,000 |
| Peeling Force | 10130g |
| Peeling Speed | 300mm/min10% |
| Peeling Angle | 165180 |
Recommended Soldering Profile
Reflow soldering is recommended.
- Solder: Sn-3.0Ag-0.5Cu
- Flux: Rosin-based flux. Avoid strongly acidic flux (chlorine > 0.2 wt%) and water-soluble flux.
Soldering Iron Rework: Preheating at 150 for 1 minute. Tip temperature: 350, Power: 30W, Tip diameter: 1.0mm, Time: <3 s. Do not directly touch the core with the tip.
Cleaning
- Cleaning Temperature: 60 (40 for alcohol cleaning agents)
- Ultrasonic Cleaning: Output: 20 W/L, Duration: 5 min, Frequency: 28 to 40kHz. Avoid PCB resonance.
Storage Methods
- Storage Period: Use within 6 months from delivery. Check solderability if stored longer.
- Storage Conditions: Warehouse temperature: -10 to +40 (taped); -40 to +85 (body). Humidity: 30~70% RH. Avoid rapid temperature/humidity changes, chemical atmospheres, bulk packaging, heat shock, vibration, and direct sunlight. Store on pallets.
Precautions For Use
- Suitable for general electronic devices (AV, OA, home appliances, information service).
- Do not apply excessive vibration or mechanical shock.
- Avoid touching coils with sharp objects to prevent wire breakage.
- Do not apply excessive mounting stress to prevent core breakage.
2410121315_FH-MS74-4R7MT_C158092.pdf
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