<
>
Specifications
Current - Saturation (Isat):
-
Mfr. Part #:
CMP201209UD2R7MT
Package:
0805
Key Attributes
Model Number:
CMP201209UD2R7MT
Product Description
Product Overview
The CMP201209 Series is a range of multilayer chip ferrite power inductors designed for various electronic applications. These inductors are constructed with a ferrite body, inner electrodes made of pure silver, and terminal electrodes featuring silver and Ni/Sn plating. They offer reliable performance with specific electrical characteristics, making them suitable for integration into electronic circuits where efficient power management is crucial.
Product Attributes
- Product Type: Multilayer Chip Ferrite Power Inductor
- Series: CMP201209-D Series
- Manufacturer: Not specified (Implied from document context)
- Material: Ferrite (Ni-Cu-Zn system for body), Pure Silver (inner electrode), Silver layer & Ni/Sn plating (terminal electrode)
- Certifications: RoHS compliant (if marked 'Unitary lead free')
Technical Specifications
Dimensions
| Size | L (mm/inch) | W (mm/inch) | T (mm/inch) | Terminal Electrode Width (mm/inch) |
|---|---|---|---|---|
| 201209 | 2.00.20 (0.0790.008) | 1.20.20 (0.0470.008) | 0.90.20 (0.0350.008) | 0.50.3 (0.0200.012) |
Product Model Composition Example: CMP 201209 UD 1R0 M T
- CMP: Multilayer Chip Ferrite Power Inductor
- 201209: Dimensions (LWT) (2.01.20.9mm)
- UD: Material code
- 1R0: Inductance (1.0H)
- M: Tolerance (20%)
- T: Packaging (Tape & Reel)
Electrical Characteristics
| Part NO. | Tolerance (%) | Inductance (H) | RDC ()max | Test frequency (MHz) | Test voltage (mV) | SRF (MHz) min | Rated current (mA)max |
|---|---|---|---|---|---|---|---|
| CMP201209VD47NMT | 20 | 0.047 | 0.10 | 1 | 50 | 280 | 1100 |
| CMP201209VD56NMT | 20 | 0.056 | 0.10 | 1 | 50 | 280 | 1100 |
| CMP201209VD68NMT | 20 | 0.068 | 0.15 | 1 | 50 | 250 | 1100 |
| CMP201209VD82NMT | 20 | 0.082 | 0.15 | 1 | 50 | 250 | 1100 |
| CMP201209VDR10MT | 20 | 0.10 | 0.15 | 1 | 50 | 210 | 1100 |
| CMP201209VDR12MT | 20 | 0.12 | 0.15 | 1 | 50 | 200 | 1100 |
| CMP201209VDR15MT | 20 | 0.15 | 0.15 | 1 | 50 | 175 | 1100 |
| CMP201209VDR18MT | 20 | 0.18 | 0.15 | 1 | 50 | 160 | 1100 |
| CMP201209VDR22MT | 20 | 0.22 | 0.15 | 1 | 50 | 150 | 1100 |
| CMP201209VDR27MT | 20 | 0.27 | 0.15 | 1 | 50 | 130 | 1100 |
| CMP201209VDR33MT | 20 | 0.33 | 0.15 | 1 | 50 | 120 | 1100 |
| CMP201209VDR39MT | 20 | 0.39 | 0.15 | 1 | 50 | 110 | 1100 |
| CMP201209VDR47MT | 20 | 0.47 | 0.15 | 1 | 50 | 100 | 1100 |
| CMP201209VDR56MT | 20 | 0.56 | 0.36 | 1 | 50 | 100 | 800 |
| CMP201209VDR68MT | 20 | 0.68 | 0.36 | 1 | 50 | 95 | 800 |
| CMP201209VDR82MT | 20 | 0.82 | 0.36 | 1 | 50 | 90 | 800 |
| CMP201209UD1R0MT | 20 | 1.0 | 0.24 | 1 | 50 | 75 | 800 |
| CMP201209UD1R2MT | 20 | 1.2 | 0.24 | 1 | 50 | 65 | 800 |
| CMP201209UD1R5MT | 20 | 1.5 | 0.30 | 1 | 50 | 60 | 700 |
| CMP201209UD1R8MT | 20 | 1.8 | 0.36 | 1 | 50 | 55 | 600 |
| CMP201209UD2R2MT | 20 | 2.2 | 0.36 | 1 | 50 | 50 | 600 |
| CMP201209UD2R7MT | 20 | 2.7 | 0.36 | 1 | 50 | 45 | 600 |
| CMP201209UD3R3MT | 20 | 3.3 | 0.40 | 1 | 50 | 41 | 350 |
| CMP201209UD3R9MT | 20 | 3.9 | 0.40 | 1 | 50 | 38 | 350 |
| CMP201209UD4R7MT | 20 | 4.7 | 0.40 | 1 | 50 | 35 | 350 |
| CMP201209XD5R6MT | 20 | 5.6 | 0.50 | 1 | 50 | 32 | 250 |
| CMP201209XD6R8MT | 20 | 6.8 | 0.50 | 1 | 50 | 29 | 250 |
| CMP201209XD8R2MT | 20 | 8.2 | 0.56 | 1 | 50 | 26 | 250 |
| CMP201209XD100MT | 20 | 10 | 0.56 | 1 | 50 | 24 | 250 |
| CMP201209XD120MT | 20 | 12 | 0.56 | 1 | 50 | 22 | 250 |
| CMP201209JD150MT | 20 | 15 | 0.65 | 1 | 50 | 19 | 100 |
Reliability Testing Items
| No. | Items | Requirements | Test Methods and Remarks |
|---|---|---|---|
| 1 | Operating Temperature Range | -40+85 | |
| 2 | Solder ability | At least 95% of terminal electrode should be covered with solder | Preheating temperature:120 to 150; Preheating time: 60s; Solder: 96.5%Sn/3.0%Ag/0.5%Cu; Solder temperature: 2455; Immersion tin depth:10mm; Duration: 51s; Dip performance to a flux of about:3 ~ 5 s |
| 3 | Resistance to Soldering | At least 95% of terminal electrode should be covered with solder. No mechanical damage. Inductance: VD, UD: change within 20%; JD: change within 30% | Preheating temperature: 120~150; Preheating time: 60s; Solder: 96.5%Sn/3.0%Ag/0.5%Cu; Solder temperature: 2605; Immersion tin depth:10mm; Duration: 101s; Dip performance to a flux of about:3 ~ 5 s |
| 4 | Adhesion of electrode | The termination and body should be no damage. | Applied force: 10N force for 2012 series. Keep time: 101S |
| 5 | Low temperature resistance | No mechanical damage. Inductance change: within 10% | Temperature:-402; Testing time: 1000 +240/-0 h |
| 6 | Bending strength | No mechanical damage. | Testing board: glass epoxy-resin substrate; Compression speed: 0.5 mm/s; Curvature: 2mm; Hold time: 20s1s |
| 7 | Vibration | No mechanical damage. Inductance change: within 10% | Amplitude: 1.5mm; Test time: 2h in each of 3 mutually perpendicular directions; Frequency range: 10Hz to 55Hz to 10Hz for 1min. |
| 8 | High temperature resistance | No mechanical damage. Inductance change: within 10% | Testing time: 1000 +240/-0 h; Temperature: 852 |
| 9 | Static Humidity | No mechanical damage. Inductance change: within 10% | Humidity: 90% to 95% RH; Temperature: 602; Testing time: 1000 +240/-0 h |
| 10 | High temperature load | No mechanical damage. Inductance change: within 10% | Impose current: rated current; Testing time: 1000 +240/-0 h; Temperature: 852 |
| 11 | Temperature Shock | No mechanical damage. Inductance change: within 10% | Temperature: -40 for 303min +85 for 303min; Number of cycles: 32 |
Note: When there are questions concerning, measurement shall be made after 242hrs of recovery under the standard condition.
Packaging
| Size | Quantity per REEL | Quantity per BOX | Quantity per CASE |
|---|---|---|---|
| 201209 | 4000 | 40000 | 240000 |
Recommended Soldering Conditions
Products can be applied to reflow soldering.
- Pre-heating: Temperature difference between solder and ferrite surface limited to 150 max.
- Cooling: Temperature difference between product surface and solvent after soldering limited to 100 max.
- Iron soldering: Tip temperature: 350 max; Power: 30W max; Duration: < 5S.
Cleaning Conditions
- Cleaning temperature: 60 max
- Cleaning time: 1 minute min.
- Ultrasonic output power: 200W max
Storage Requirements
- Storage period: Within 1 year from the inspection date by the inductor company. If exceeded, solder ability should be checked.
- Storage conditions: Temperature: -10 ~ +40, Relative humidity: 30 ~ 70%. Avoid corrosive substances, moisture, dust, heat shock, vibration, and direct sunlight. Products should be stored in airtight packaging.
Usage Of ODS (Ozone Depleting Substances)
The company does not use ODS such as CCl4, HCFC in the production process.
Notes
- If the product is marked "Unitary lead free", it complies with RoHS directive requirements.
- This product specification guarantees the quality of the product as a single unit. Ensure your product has been evaluated and confirmed against your specifications when this product is mounted.
- The company cannot warrant against failure caused by any use of the product that deviates from the intended use described in this specification.
2410121310_FH-CMP201209UD2R7MT_C395015.pdf
Request A Quote
Please Use Our Online Inquiry Contact Form Below If You Have Any Questions, Our Team Will Get Back To You As Soon As Possible
