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Specifications
Current Rating:
300mA
Inductance:
10nH
Tolerance:
±5%
Frequency - Self Resonant:
2.2GHz
Current - Saturation (Isat):
-
DC Resistance(DCR):
300mΩ
Type:
Multilayer Inductor;High-frequency Inductor
Ratings:
-
Q @ Frequency:
15@100MHz
Mfr. Part #:
VHF201209H10NJT
Package:
0805
Key Attributes
Model Number:
VHF201209H10NJT
Product Description
Product Overview
The VHF201209H Series Chip High Frequency Inductors are designed for high-frequency applications. These multilayer chip inductors feature a ceramic body and are available in various inductance values with tight tolerances. They are suitable for applications requiring reliable performance and compact size.
Product Attributes
- Product Type: Chip high frequency inductors
- Series: VHF201209H
- Construction: Multilayer chip inductor with ceramic body
- Plating: Ni/Sn plating
- Material: Ceramic (Al2O3) body, Silver (Ag) inner electrodes, Silver (Ag) terminal electrodes
- Packaging: Tape & Reel
- Certifications: RoHS compliant (if specified as "Unitary lead free")
Technical Specifications
| Part Number | Inductance (nH) | Tolerance | Q Value (min) | DC Resistance () max | Test Frequency (MHz) | Test Voltage (mV) | SRF (MHz) min | Rated Current (mA) max | Dimensions (LWT) mm |
|---|---|---|---|---|---|---|---|---|---|
| VHF201209H1N5T | 1.5 | S (0.3nH) / D (0.5nH) | 10 | 0.10 | 100 | 50 | 6000 | 500 | 2.01.20.9 |
| VHF201209H1N8T | 1.8 | S (0.3nH) / D (0.5nH) | 10 | 0.10 | 100 | 50 | 6000 | 500 | 2.01.20.9 |
| VHF201209H2N2T | 2.2 | S (0.3nH) / D (0.5nH) | 10 | 0.10 | 100 | 50 | 6000 | 500 | 2.01.20.9 |
| VHF201209H2N7T | 2.7 | S (0.3nH) / D (0.5nH) | 12 | 0.10 | 100 | 50 | 5500 | 500 | 2.01.20.9 |
| VHF201209H3N3T | 3.3 | S (0.3nH) / D (0.5nH) | 12 | 0.13 | 100 | 50 | 5000 | 500 | 2.01.20.9 |
| VHF201209H3N9T | 3.9 | S (0.3nH) / D (0.5nH) | 12 | 0.15 | 100 | 50 | 4500 | 500 | 2.01.20.9 |
| VHF201209H4N3T | 4.3 | S (0.3nH) / D (0.5nH) | 12 | 0.20 | 100 | 50 | 4000 | 500 | 2.01.20.9 |
| VHF201209H4N7T | 4.7 | S (0.3nH) / D (0.5nH) | 12 | 0.20 | 100 | 50 | 4000 | 500 | 2.01.20.9 |
| VHF201209H5N6T | 5.6 | S (0.3nH) / D (0.5nH) | 15 | 0.23 | 100 | 50 | 3500 | 500 | 2.01.20.9 |
| VHF201209H6N8T | 6.8 | J (5%) / K (10%) | 15 | 0.25 | 100 | 50 | 3000 | 500 | 2.01.20.9 |
| VHF201209H8N2T | 8.2 | J (5%) / K (10%) | 15 | 0.28 | 100 | 50 | 2500 | 500 | 2.01.20.9 |
| VHF201209H10NT | 10 | J (5%) / K (10%) | 15 | 0.30 | 100 | 50 | 2200 | 500 | 2.01.20.9 |
| VHF201209H12NT | 12 | J (5%) / K (10%) | 15 | 0.35 | 100 | 50 | 2000 | 500 | 2.01.20.9 |
| VHF201209H15NT | 15 | J (5%) / K (10%) | 15 | 0.40 | 100 | 50 | 1800 | 500 | 2.01.20.9 |
| VHF201209H18NT | 18 | J (5%) / K (10%) | 15 | 0.45 | 100 | 50 | 1600 | 300 | 2.01.20.9 |
| VHF201209H22NT | 22 | J (5%) / K (10%) | 15 | 0.50 | 100 | 50 | 1500 | 300 | 2.01.20.9 |
| VHF201209H27NJT | 27 | J (5%) / K (10%) | 15 | 0.55 | 100 | 50 | 1400 | 300 | 2.01.20.9 |
| VHF201209H33NT | 33 | J (5%) / K (10%) | 15 | 0.60 | 100 | 50 | 1300 | 300 | 2.01.20.9 |
| VHF201209H39NT | 39 | J (5%) / K (10%) | 15 | 0.65 | 100 | 50 | 1100 | 300 | 2.01.20.9 |
| VHF201209H43NT | 43 | J (5%) / K (10%) | 18 | 0.70 | 100 | 50 | 1000 | 300 | 2.01.20.9 |
| VHF201209H47NT | 47 | J (5%) / K (10%) | 18 | 0.70 | 100 | 50 | 1000 | 300 | 2.01.20.9 |
| VHF201209H56NT | 56 | J (5%) / K (10%) | 18 | 0.75 | 100 | 50 | 900 | 300 | 2.01.20.9 |
| VHF201209H68NT | 68 | J (5%) / K (10%) | 18 | 0.80 | 100 | 50 | 850 | 300 | 2.01.20.9 |
| VHF201209H82NT | 82 | J (5%) / K (10%) | 18 | 0.90 | 100 | 50 | 800 | 300 | 2.01.20.9 |
| VHF201209HR10T | 100 | J (5%) / K (10%) | 18 | 0.90 | 100 | 50 | 700 | 300 | 2.01.20.9 |
| VHF201209HR12T | 120 | J (5%) / K (10%) | 13 | 0.95 | 50 | 50 | 600 | 300 | 2.01.20.9 |
| VHF201209HR15T | 150 | J (5%) / K (10%) | 13 | 1.20 | 50 | 50 | 550 | 300 | 2.01.20.9 |
| VHF201209HR18T | 180 | J (5%) / K (10%) | 13 | 1.30 | 50 | 50 | 500 | 300 | 2.01.20.9 |
| VHF201209HR22T | 220 | J (5%) / K (10%) | 12 | 1.50 | 50 | 50 | 400 | 300 | 2.01.20.9 |
| VHF201209HR27T | 270 | J (5%) / K (10%) | 12 | 1.80 | 50 | 50 | 350 | 300 | 2.01.20.9 |
| VHF201209HR33T | 330 | J (5%) / K (10%) | 12 | 2.00 | 50 | 50 | 300 | 300 | 2.01.20.9 |
| VHF201209HR39T | 390 | J (5%) / K (10%) | 10 | 2.00 | 50 | 50 | 250 | 300 | 2.01.20.9 |
| VHF201209HR47T | 470 | J (5%) / K (10%) | 10 | 2.00 | 50 | 50 | 200 | 300 | 2.01.20.9 |
Reliability Testing Items
| No. | Item | Requirements | Test Methods and Remarks |
|---|---|---|---|
| 1 | Operating Temperature Range | -40+85 | |
| 2 | Solder ability | At least 95% of terminal electrode should be covered with solder | Preheating temperature: 120 to 150; Preheating time: 60s; Solder: 96.5%Sn/3.0%Ag/0.5%Cu; Solder temperature: 2455; Immersion tin depth: 10mm; Duration: 51s; Dip performance to a flux of about: 3 ~ 5 s |
| 3 | Resistance to Soldering | At least 95% of terminal electrode should be covered with solder. No mechanical damage. Inductance change: H: 10%; Q value change (ceramic): 20% | Preheating temperature: 120 to 150; Preheating time: 60s; Solder: 96.5%Sn/3.0%Ag/0.5%Cu; Solder temperature: 2605; Immersion tin depth: 10mm; Duration: 101s; Dip performance to a flux of about: 3 ~ 5 s |
| 4 | Adhesion of electrode | The termination and body should be no damage. | Applied force: 10N for 2012 series; Keep time: 101S |
| 5 | Low temperature resistance | No mechanical damage. Inductance change: 10%; Q value change (ceramic): 20% | Temperature: -402; Testing time: 1000 +24/-0 h |
| 6 | Bending strength | No mechanical damage. | Testing board: glass epoxy-resin substrate; For 0.5 mm/s compression speed, curvature: 2mm, hold time 20s1s |
| 7 | Vibration | No mechanical damage. Inductance change: 10%; Q value change (ceramic): 20% | Amplitude modulation: 1.5mm; Test time: A period of 2h in each of 3 mutually perpendicular directions. Frequency range: 10Hz to 55Hz to 10Hz for 1min. |
| 8 | High temperature resistance | No mechanical damage. Inductance change: 10%; Q value change (ceramic): 20% | Testing time: 1000 +24/-0 h; Temperature: 852 |
| 9 | Static Humidity | No mechanical damage. Inductance change: 10%; Q value change (ceramic): 20% | Humidity: 90% to 95% RH; Temperature: 602; Testing time: 1000 +24/-0 h |
| 10 | High temperature load | No mechanical damage. Inductance change: 10%; Q value change (ceramic): 20% | Impose current: at rated current; Testing time: 1000 +24/-0 h; Temperature: 852 |
| 11 | Temperature Shock | No mechanical damage. Inductance change: 10%; Q value change (ceramic): 20% | Temperature: -55 for 303min +125 for 303min; Number of cycles: 100 |
Packaging
Taping Drawings: Refer to provided diagrams.
Reel Dimensions:
| Size | A (mm) | B (mm) | C (mm) | N (mm) | G (mm) |
|---|---|---|---|---|---|
| 201209 | 1782.0 | 22.02.0 | 12.51.5 | 572.0 | 8 |
Taping Dimensions: Refer to provided diagrams.
Peeling off force:
- Cover tape peeling force: 0.1N0.7N (pulling in the direction of arrow)
- Speed of peeling off: 300mm/min
- The cover bond should not be damaged and bond the tape when it peeled off.
Packaging quantity (Unit: Pcs):
| Size | Quantity per REEL | Quantity per BOX | Quantity per CASE |
|---|---|---|---|
| 201209 | 4000 | 40000 | 240000 |
Label stick station: Refer to provided diagrams for Reel label, Carton label, and Outer box label.
Recommended Soldering Conditions
Products are suitable for reflow soldering.
Soldering Conditions:
- Temperature difference between product surface and solder during pre-heating should not exceed 150. Temperature difference between product surface and solvent during cooling after soldering should not exceed 100. Insufficient pre-heating may cause cracks on the ferrite surface, leading to product quality deterioration.
- Products should be soldered within the allowable range indicated by the slanted line in the reflow soldering profile. Excessive soldering conditions may cause corrosion of the electrode. When soldering is repeated, allowable time is the accumulated time.
Reflow soldering profile: Refer to provided diagram.
Hand soldering:
- Soldering Iron Temperature: 350 (Max)
- Power: 30W max
- Soldering Time: < 5S (Take care not to apply the tip of the soldering iron to the terminal electrodes)
Cleaning
Cleaning Conditions:
- Cleaning temperature: 60 max
- Cleaning time: 1 minute min.
- Ultrasonic output power: 200W max
Storage Requirements
Storage period: Within 1 year from the inductor company's factory inspection date. If the period exceeds 1 year, solderability should be checked before use.
Storage conditions:
- Warehouse conditions: Temperature: -10+40, Relative humidity: 3070%.
- Do not store products in corrosive gases such as sulfur, chlorine gas or acid, as it may cause oxidation of electrodes, resulting in poor solderability.
- Products should be stored on a palette to prevent influence from humidity, dust, etc.
- Avoid heat shock, vibration, and direct sunlight when storing products in the warehouse.
- Products should be stored under airtight packaged conditions.
Usage Of ODS (Ozone Depleting Substances)
The company does not use ODS such as CCl4 (carbon tetrachloride) and HCFC in the production process.
Notes
- If the product is designated as "Unitary lead free", it complies with RoHS directive requirements.
- This product specification guarantees the quality of our product as a single unit. Please ensure that your product has been evaluated and confirmed against your specifications when our product is mounted to your product.
- The company cannot warrant against failure caused by any use of our product that deviates from the intended use as described in this product specification.
2411220522_FH-VHF201209H10NJT_C98987.pdf
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