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Specifications
Current Rating:
25mA
Inductance:
2.2uH
Tolerance:
±10%
Frequency - Self Resonant:
50MHz
Current - Saturation (Isat):
-
DC Resistance(DCR):
800mΩ
Type:
Multilayer Inductor;High-frequency Inductor
Ratings:
-
Q @ Frequency:
25@10MHz
Mfr. Part #:
CMI160808U2R2KT
Package:
0603
Key Attributes
Model Number:
CMI160808U2R2KT
Product Description
Product Overview
The CMI160808 Series Multilayer Chip Ferrite Inductors are designed for various electronic applications. These inductors feature a ferrite or ceramic body with silver inner electrodes and terminal electrodes plated with Ni/Sn. They offer a range of inductance values from 0.047 H to 22 H with tight tolerances and specified Q values, DC resistance, and self-resonant frequencies. The products are suitable for reflow soldering and manual soldering, with recommended conditions provided to ensure optimal performance and reliability. They are designed to meet stringent reliability testing requirements, including resistance to soldering heat, adhesion, low temperature, bending, vibration, high temperature, static humidity, and high-temperature load.
Product Attributes
- Product Type: Multilayer Chip Ferrite Inductors
- Series: CMI160808 Series
- Material: Ferrite (Ni-Cu-Zn system) / Ceramic Body, Silver Inner Electrode, Ni/Sn Plated Terminal Electrode
- Packaging: Tape & Reel
- Certifications: RoHS compliant (if specified as 'Unitary lead free')
Technical Specifications
| Part NO. | Tolerance (%) | Inductance (H) | Q Value (min) | RDC ()max | Test Frequency (MHz) | Test Voltage (mV) | SRF (MHz) min | Rated Current (mA)max |
|---|---|---|---|---|---|---|---|---|
| CMI160808V47NKT | 10 | 0.047 | 15 | 0.20 | 50 | 50 | 260 | 50 |
| CMI160808V56NKT | 10 | 0.056 | 15 | 0.20 | 50 | 50 | 260 | 50 |
| CMI160808V68NKT | 10 | 0.068 | 15 | 0.20 | 50 | 50 | 250 | 50 |
| CMI160808V82NKT | 10 | 0.082 | 15 | 0.20 | 50 | 50 | 245 | 50 |
| CMI160808VR10KT | 10 | 0.10 | 20 | 0.25 | 25 | 50 | 240 | 50 |
| CMI160808VR12KT | 10 | 0.12 | 20 | 0.30 | 25 | 50 | 205 | 50 |
| CMI160808VR15KT | 10 | 0.15 | 20 | 0.30 | 25 | 50 | 180 | 50 |
| CMI160808VR18KT | 10 | 0.18 | 20 | 0.30 | 25 | 50 | 165 | 50 |
| CMI160808VR22KT | 10 | 0.22 | 20 | 0.40 | 25 | 50 | 150 | 50 |
| CMI160808VR27KT | 10 | 0.27 | 20 | 0.45 | 25 | 50 | 136 | 50 |
| CMI160808VR33KT | 10 | 0.33 | 20 | 0.50 | 25 | 50 | 125 | 50 |
| CMI160808VR39KT | 10 | 0.39 | 20 | 0.60 | 25 | 50 | 110 | 50 |
| CMI160808VR47KT | 10 | 0.47 | 20 | 0.70 | 25 | 50 | 105 | 50 |
| CMI160808VR56KT | 10 | 0.56 | 20 | 0.70 | 25 | 50 | 95 | 50 |
| CMI160808VR68KT | 10 | 0.68 | 20 | 0.90 | 25 | 50 | 90 | 50 |
| CMI160808VR82KT | 10 | 0.82 | 20 | 1.00 | 25 | 50 | 85 | 50 |
| CMI160808U1R0KT | 10 | 1.0 | 25 | 0.50 | 10 | 50 | 75 | 25 |
| CMI160808U1R2KT | 10 | 1.2 | 25 | 0.55 | 10 | 50 | 65 | 25 |
| CMI160808U1R5KT | 10 | 1.5 | 25 | 0.70 | 10 | 50 | 60 | 25 |
| CMI160808U1R8KT | 10 | 1.8 | 25 | 0.75 | 10 | 50 | 55 | 25 |
| CMI160808U2R2KT | 10 | 2.2 | 25 | 0.80 | 10 | 50 | 50 | 25 |
| CMI160808U2R7KT | 10 | 2.7 | 25 | 0.90 | 10 | 50 | 45 | 15 |
| CMI160808U3R3KT | 10 | 3.3 | 25 | 1.00 | 10 | 50 | 40 | 15 |
| CMI160808U3R9KT | 10 | 3.9 | 25 | 1.30 | 10 | 50 | 35 | 15 |
| CMI160808U4R7KT | 10 | 4.7 | 25 | 1.50 | 10 | 50 | 33 | 15 |
| CMI160808J5R6KT | 10 | 5.6 | 12 | 1.55 | 4 | 50 | 22 | 5 |
| CMI160808J6R8KT | 10 | 6.8 | 12 | 1.55 | 4 | 50 | 20 | 5 |
| CMI160808J8R2KT | 10 | 8.2 | 12 | 1.65 | 4 | 50 | 18 | 5 |
| CMI160808J100KT | 10 | 10 | 20 | 1.75 | 2 | 50 | 17 | 3 |
| CMI160808J120KT | 10 | 12 | 20 | 1.85 | 2 | 50 | 15 | 3 |
| CMI160808J150MT | 20 | 15 | 20 | 2.50 | 1 | 50 | 14 | 1 |
| CMI160808J180MT | 20 | 18 | 20 | 2.70 | 1 | 50 | 13 | 1 |
| CMI160808J220MT | 20 | 22 | 20 | 3.00 | 1 | 50 | 12 | 1 |
| Item | Requirements | Test Methods and Remarks |
|---|---|---|
| Operating Temperature Range | -40+85 | |
| Solder ability | At least 95% of terminal electrode should be covered with solder. | Preheating temperature:120 to 150; Preheating time: 60s; Solder: 96.5%Sn/3.0%Ag/0.5%Cu; Solder temperature: 2455; Immersion tin depth:10mm; Duration: 51s; Dip performance to a flux of about:3 ~ 5 s |
| Resistance to Soldering Heat | At least 95% of terminal electrode should be covered with solder. No mechanical damage. Inductance change: V,U: 20%; X: 25%; J: 30%; Q value change(ferrite): within 30% | Preheating temperature: 120 to 150; Preheating time: 60s; Solder: 96.5%Sn/3.0%Ag/0.5%Cu; Solder temperature: 2605; Immersion tin depth:10mm; Duration: 101s; Dip performance to a flux of about:3 ~ 5 s |
| Adhesion of electrode | The termination and body should be no damage. | Applied force: 7N for 1608 series. Keep time: 101S |
| Low temperature resistance | No mechanical damage. Inductance change: within 10%; Q value change(ferrite): within 30% | Temperature: -402; Testing time: 1000 +240/-0 h |
| Bending strength | No mechanical damage. | Testing board: glass epoxy-resin substrate; For 0.5 mm/s compression speed, curvature: 2mm, hold time: 20s1s |
| Vibration | No mechanical damage. Inductance change: within 10%; Q value change(ferrite): within 30% | Amplitude modulation: 1.5mm; Test time: 2h in each of 3 mutually perpendicular directions; Frequency range: 10Hz to 55Hz to 10Hz for 1min. |
| High temperature resistance | No mechanical damage. Inductance change: within 10%; Q value change(ferrite): within 30% | Testing time: 1000 +240/-0 h; Temperature: 852 |
| Static Humidity | No mechanical damage. Inductance change: within 10%; Q value change(ferrite): within 30% | Humidity: 90% to 95% RH; Temperature: 602; Testing time: 1000 +240/-0 h |
| High temperature load | No mechanical damage. Inductance change: within 10%; Q value change(ferrite): within 30% | Impose current: at rated current; Testing time: 1000 +240/-0 h; Temperature: 852 |
| Temperature Shock | No mechanical damage. Inductance change: within 10%; Q value change(ferrite): within 30% | Temperature: -40 for 303min +85 for 303min; Number of cycles: 32 |
| Size | REEL | BOX | CASE |
|---|---|---|---|
| 160808 | 4000 | 40000 | 240000 |
| Item | Soldering Conditions | Remarks |
|---|---|---|
| Reflow Soldering | Products should be soldered within the allowable range indicated by the slanted line in the reflow soldering profile. | Temperature difference between solder and ferrite surface during pre-heating: max 150. Temperature difference during cooling into solvent: max 100. Un-enough pre-heating may cause cracks. |
| Iron Soldering | Temperature: 350 (Max); Power: 30W (Max); Soldering Time: < 5S | Take care not to apply the tip of the soldering iron to the terminal electrodes. |
| Item | Conditions |
|---|---|
| Cleaning | Cleaning temperature: 60 max; Cleaning time: 1 minute min; Ultrasonic output power: 200W max |
| Storage Period | Within 1 year from the inspection date by the inductor company. If exceeding 1 year, solder ability should be checked. |
| Storage Conditions | Temperature: -10~+40; Humidity: 30~70% relative humidity; Avoid corrosive gases, humidity, dust, heat shock, vibration, and direct sunlight. Store in airtight packaged condition. |
| ODS Usage | The company does not use ODS such as CCl4, HCFC in the production process. |
Notes
- If the product is designated as 'Unitary lead free', it complies with RoHS directive requirements.
- This specification guarantees the quality of the product as a single unit. Ensure your product has been evaluated and confirmed when mounting our product.
- The company does not warrant against failure caused by any use of our product that deviates from the intended use as described in this product specification.
2410121258_FH-CMI160808U2R2KT_C284875.pdf
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