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Specifications
Current Rating:
600mA
Inductance:
2.2uH
Tolerance:
±10%
Frequency - Self Resonant:
80MHz
DC Resistance(DCR):
730mΩ
Type:
Wire-wound Chip Inductor
Mfr. Part #:
FHW0603PF2R2KST
Package:
0603
Key Attributes
Model Number:
FHW0603PF2R2KST
Product Description
Product Overview
The FHW0603PF Series is a range of wire wound chip inductors designed for various electronic applications. These inductors feature a ferrite core and are constructed with high-quality materials including copper wire and silver/nickel/tin electrodes. They are available in the compact 0603 size and are suitable for reflow soldering processes. The series offers a range of inductance values with tight tolerances and is manufactured to meet stringent reliability and performance standards.
Product Attributes
- Product Type: Wire Wound Chip Inductor
- Series: FHW0603PF Series
- Core Material: Ferrite Core (Ni-Zn ferrite)
- Wire Material: Copper
- Electrode Material: Silver (Ag), Nickel (Ni), Tin (Sn)
- Encapsulation: UV Adhesive
- Termination: Tin (Sn)
- Packaging: Tape & Reel
- RoHS Compliance: Yes
Technical Specifications
| Part NO. | Inductance (H) | LS Test Frequency (MHz) | RDC () max | Test Voltage (mV) | SRF (MHz) min | IDC (mA) max | Tolerance |
|---|---|---|---|---|---|---|---|
| FHW0603PF1R0ST | 1.0 | 7.9 | 0.32 | 500 | 200 | 860 | K, M |
| FHW0603PF1R5ST | 1.5 | 7.9 | 0.40 | 500 | 100 | 720 | K, M |
| FHW0603PF1R8ST | 1.8 | 7.9 | 0.56 | 500 | 95 | 640 | K, M |
| FHW0603PF2R2ST | 2.2 | 7.9 | 0.73 | 500 | 80 | 600 | K, M |
| FHW0603PF4R7ST | 4.7 | 7.9 | 1.26 | 500 | 40 | 400 | K, M |
| FHW0603PF5R6ST | 5.6 | 7.9 | 1.70 | 500 | 37 | 380 | K, M |
| FHW0603PF6R8ST | 6.8 | 7.9 | 1.95 | 500 | 34 | 340 | K, M |
| FHW0603PF100ST | 10 | 2.5 | 2.4 | 500 | 25 | 280 | K, M |
| FHW0603PF150ST | 15 | 2.5 | 3.4 | 500 | 23 | 240 | K, M |
| FHW0603PF220ST | 22 | 2.5 | 4.7 | 500 | 19 | 200 | K, M |
| FHW0603PF270ST | 27 | 2.5 | 6.4 | 500 | 18 | 100 | K, M |
| Dimension | Size | L (Max) | W (Max) | T (Max) | A | B | C | D | E |
|---|---|---|---|---|---|---|---|---|---|
| FHW0603PF | 1.80(0.071) | 1.20(0.047) | 1.00(0.039) | 0.90(0.035) | 0.35(0.014) | 1.02(0.040) | 0.64(0.025) | 0.70(0.028) |
| Item | Requirements | Test Methods and Remarks |
|---|---|---|
| Operating Temperature Range | -40+85 | FHW-PF series |
| Solder ability | 80% electrode surface solder coverage | Dip in solder pot (96.5Sn/3.0Ag/0.5Cu) at 2455 for 51s. |
| Resistance to Soldering Heat | Inductance shall not change more than 5% | Dip in solder pot (96.5Sn/3.0Ag/0.5Cu) at 2605 for 101s. |
| Vibration | Inductance shall not change more than 5% | Amplitude 1.5mm, frequency 10~55Hz, 2h in each of X, Y, Z axes. |
| Adhesion of electrode | The end electrode did not fall off after the test. | Weld the product on PCB, apply force of 7 N for 101s. |
| Low temperature resistance | Inductance shall not change more than 5% | Subjected to -402 for 1000+240-0 h. |
| High temperature resistance | Inductance shall not change more than 5% | Subjected to +855 for 1000+240-0 h. |
| Temperature Shock | Inductance shall not change more than 5% | +85 30min -40 30min, 100 Cycles. |
| High temperature load | Inductance shall not change more than 5% | Store at 852 for 1000+240-0 h with rated current applied. |
| Static Humidity | Inductance shall not change more than 5% | Subjected to 90%95%RH at 602 for 1000+240-0 h. |
| Bending strength | No visible mechanical damage. | Bend substrate down to (20.2) mm at a rate of (10.5) mm/s, hold for (201) sec. |
| Solvent Resistance | Inductance shall not change more than 5% | Soak in isopropyl alcohol solution at 235 for 50.5 min. |
| Size | Pieces Per Reel | Reels Per Box | Pieces Per Box | Boxes Per Case | Pieces Per Case |
|---|---|---|---|---|---|
| 0603 | 4000 | 3 | 12000 | 1.5 | 60000 |
| 5 | 20000 | 2 | 80000 | ||
| 3 | 120000 | ||||
| 4 | 160000 | ||||
| 6 | 240000 |
| Soldering Method | Temperature | Time | Notes |
|---|---|---|---|
| Reflow Soldering | Refer to Reflow Soldering Profile | Refer to Reflow Soldering Profile | Ensure temperature difference between solder and ferrite surface is limited to 150 max during pre-heating and 100 max during cooling. |
| Hand Soldering | 350 (Max) | < 5S | Max power 30W. Avoid touching coil and encapsulation layer. |
| Cleaning Condition | Parameter | Value |
|---|---|---|
| Temperature | Max | 60 |
| Time | Max | 5 minutes |
| Ultrasonic Output Power | Max | 200W |
| Storage Condition | Parameter | Requirement |
|---|---|---|
| Storage Period | 1 year from inspection date. Check solder ability if exceeded. | |
| Warehouse Conditions | Temperature | -10 ~ +40 |
| Relative Humidity | 30 ~ 70% | |
| Storage Environment | Corrosive Substances | Avoid sulfur, chlorine gas, or acid. |
| Placement | Store on pallets. | |
| Environmental Factors | Avoid heat shock, vibration, and direct sunlight. | |
| Packaging | Airtight packaging required. |
Usage Of ODS (Ozone Depleting Substances): The company does not use ODS such as CCl4 (Carbon Tetrachloride) and HCFC in its production processes.
Notes:
- Products are RoHS compliant.
- Ensure thorough evaluation and confirmation of your product specifications when integrating these components.
- The company does not warrant against failures caused by use deviating from the intended application as described in this specification.
- Do not touch the coil with sharp objects such as tweezers to prevent wire breakage.
2410121311_FH-FHW0603PF2R2KST_C5137246.pdf
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