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Specifications
Current Rating:
-
DC Resistance(DCR):
-
Mfr. Part #:
CBM321609U330T
Package:
1206
Key Attributes
Model Number:
CBM321609U330T
Product Description
Multilayer Chip Ferrite Ultra-High Current Beads
These multilayer chip ferrite beads offer high impedance and effective EMI/RFI suppression in a compact size. Unlike traditional beads, their leadless design allows for simple PCB mounting. They are suitable for reflow and wave soldering and conform to EIA standards for SMT automatic placement. Ideal for noise suppression in power lines or extra-large current signal lines of electrical equipment such as communication equipment, computers, and LCD TVs.
Product Attributes
- Product Code: CBM
- Product Type: Multilayer Chip Ferrite Ultra-High Current Beads
- Packaging Styles: Tape & Reel (T), Bulk (B)
Technical Specifications
| Part Number | Dimensions (LWT mm) | Impedance () | Tolerance | Test Frequency (MHz) | DCR () Max | Rated Current (mA) Max |
|---|---|---|---|---|---|---|
| CBM060303X220T | 0.60.30.3 | 22 | 25% | 100 | 0.040 | 1800 |
| CBM060303X330T | 0.60.30.3 | 33 | 25% | 100 | 0.055 | 1500 |
| CBM060303X800T | 0.60.30.3 | 80 | 25% | 100 | 0.130 | 1000 |
| CBM060303X121T | 0.60.30.3 | 120 | 25% | 100 | 0.160 | 900 |
| CBM100505U000T | 1.00.50.5 | 0 | 015 | 100 | 0.02 | 2000 |
| CBM100505U050T | 1.00.50.5 | 5 | 015 | 100 | 0.02 | 2000 |
| CBM100505U101T | 1.00.50.5 | 100 | 25% | 100 | 0.15 | 1000 |
| CBM100505U102T | 1.00.50.5 | 1000 | 25% | 100 | 0.65 | 300 |
| CBM160808U000T | 1.60.80.8 | 0 | 015 | 100 | 0.01 | 6000 |
| CBM160808U050T | 1.60.80.8 | 5 | 015 | 100 | 0.01 | 6000 |
| CBM160808U101T | 1.60.80.8 | 100 | 25% | 100 | 0.06 | 2500 |
| CBM160808U102T | 1.60.80.8 | 1000 | 25% | 100 | 0.35 | 700 |
| CBM201209U000T | 2.01.20.9 | 0 | 015 | 100 | 0.01 | 6000 |
| CBM201209U050T | 2.01.20.9 | 5 | 015 | 100 | 0.01 | 6000 |
| CBM201209U101T | 2.01.20.9 | 100 | 25% | 100 | 0.045 | 4000 |
| CBM201209U102T | 2.01.20.9 | 1000 | 25% | 100 | 0.12 | 1500 |
| CBM321609U000T | 3.21.60.9 | 0 | 015 | 100 | 0.01 | 6000 |
| CBM321609U050T | 3.21.60.9 | 5 | 015 | 100 | 0.01 | 6000 |
| CBM321609U101T | 3.21.60.9 | 100 | 25% | 100 | 0.035 | 4000 |
| CBM321609U102T | 3.21.60.9 | 1000 | 25% | 100 | 0.12 | 2100 |
| CBM322513U110T | 3.22.51.3 | 11 | 715 | 100 | 0.02 | 6000 |
| CBM322513U150T | 3.22.51.3 | 15 | 921 | 100 | 0.02 | 6000 |
| CBM322513U121T | 3.22.51.3 | 120 | 25% | 100 | 0.03 | 5000 |
| CBM322513U102T | 3.22.51.3 | 1000 | 25% | 100 | 0.23 | 2500 |
| CBM451616U190T | 4.51.61.6 | 19 | 1225 | 100 | 0.009 | 6000 |
| CBM451616U260T | 4.51.61.6 | 26 | 25% | 100 | 0.009 | 6000 |
| CBM451616U800T | 4.51.61.6 | 80 | 25% | 100 | 0.025 | 3000 |
| CBM453215U190T | 4.53.21.5 | 19 | 1225 | 100 | 0.01 | 6000 |
| CBM453215U260T | 4.53.21.5 | 26 | 25% | 100 | 0.01 | 6000 |
| CBM453215U600T | 4.53.21.5 | 60 | 25% | 100 | 0.01 | 6000 |
| CBM453215U101T | 4.53.21.5 | 100 | 25% | 100 | 0.02 | 6000 |
| CBM453215U501T | 4.53.21.5 | 500 | 25% | 100 | 0.08 | 4000 |
Product Structure
The product consists of an Ag layer, Ni/Sn plating, inner electrodes, and a ferrite body.
Reliability Test Methods
| No. | Item | Requirement | Test Method and Remarks |
|---|---|---|---|
| 1 | Operating Temperature Range | -55+125 | Includes product surface temperature rise |
| 2 | Solder ability | No visible damage; 95% or more of electrode area shall be coated by new solder. | Preheating temperature: 120~ 150, Preheating time: 60s, Solder: 96.5%Sn/3.0%Ag/0.5%Cu, Solder temperature: 2455, Immersion tin depth: 10mm, Duration: 51s, Dip performance to a flux of about: 3 ~ 5 s |
| 3 | Resistance to Soldering Heat | At least 95% of terminal electrode should be covered with solder. No mechanical damage. Impedance change: within 30%. | Preheating temperature: 120~150, Preheating time: 60s, Solder: 96.5%Sn/3.0%Ag/0.5%Cu, Solder temperature: 2605, Immersion tin depth: 10mm, Duration: 101s, Dip performance to a flux of about: 3~5 s |
| 4 | Adhesion of electrode | The termination and body should be no damage. | Applied force: 5N for 1005 series; 7N for 1608 series; 10N for 2012, 3216 series; 15N for 3225, 4532 series. Keep time: 101S |
| 5 | Low temperature resistance | No mechanical damage. Impedance change: within 30%. | Temperature: -552, Testing time: 10000 +24 h |
| 6 | Bending strength | No mechanical damage. | Testing board: glass epoxy-resin substrate, Forcing speed: 0.5mm/s, Bending: 2mm, Holding time: 20s1s |
2411251503_FH-CBM321609U330T_C3032747.pdf
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