Approval Sheet
Customer:
Part Name: Chip Ferrite Beads
Specification: CBG321609U Series
Version No.: 23.01
Date: 2023-9-8
Product Overview
The CBG321609U Series Chip Ferrite Beads are designed for noise suppression applications. They offer a compact solution with various impedance values to meet different filtering requirements. These components are suitable for use in a wide range of electronic circuits.
Product Attributes
- Brand: (Not specified in text)
- Origin: (Not specified in text)
- Material: Ferrite (Ni-Cu-Zn system), Silver (Ag), Ni/Sn plating
- Color: (Not specified in text)
- Certifications: (Not specified in text)
Technical Specifications
| Part NO. | Impedance () | Tolerance | RDC ()max | Test Frequency (MHz) | Test Voltage (mV) | Rated Current (mA)max |
| CBG321609U000T | 0 | 015 | 0.05 | 100 | 50 | 2200 |
| CBG321609U050T | 5 | 015 | 0.05 | 100 | 50 | 2200 |
| CBG321609U070T | 7 | 011 | 0.05 | 100 | 50 | 2200 |
| CBG321609U090T | 9 | 513 | 0.05 | 100 | 50 | 2000 |
| CBG321609U110T | 11 | 715 | 0.05 | 100 | 50 | 2000 |
| CBG321609U150T | 15 | 921 | 0.05 | 100 | 50 | 2000 |
| CBG321609U190T | 19 | 1225 | 0.05 | 100 | 50 | 2000 |
| CBG321609U260T | 26 | 25% | 0.05 | 100 | 50 | 2000 |
| CBG321609U310T | 31 | 25% | 0.05 | 100 | 50 | 2000 |
| CBG321609U600T | 60 | 25% | 0.10 | 100 | 50 | 1000 |
| CBG321609U700T | 70 | 25% | 0.10 | 100 | 50 | 1000 |
| CBG321609U800T | 80 | 25% | 0.10 | 100 | 50 | 1000 |
| CBG321609U101T | 100 | 25% | 0.10 | 100 | 50 | 1000 |
| CBG321609U121T | 120 | 25% | 0.10 | 100 | 50 | 1000 |
| CBG321609U151T | 150 | 25% | 0.15 | 100 | 50 | 1000 |
| CBG321609U181T | 180 | 25% | 0.15 | 100 | 50 | 1000 |
| CBG321609U221T | 220 | 25% | 0.20 | 100 | 50 | 800 |
| CBG321609U301T | 300 | 25% | 0.20 | 100 | 50 | 800 |
| CBG321609U501T | 500 | 25% | 0.30 | 100 | 50 | 600 |
| CBG321609U601T | 600 | 25% | 0.30 | 100 | 50 | 600 |
| CBG321609U801T | 800 | 25% | 0.35 | 100 | 50 | 600 |
| CBG321609U102T | 1000 | 25% | 0.35 | 100 | 50 | 600 |
| CBG321609U122T | 1200 | 25% | 0.60 | 100 | 50 | 300 |
| CBG321609U152T | 1500 | 25% | 0.60 | 50 | 50 | 300 |
| CBG321609U182T | 1800 | 25% | 0.80 | 50 | 50 | 100 |
| CBG321609U202T | 2000 | 25% | 1.00 | 50 | 50 | 100 |
| CBG321609U252T | 2500 | 25% | 1.20 | 50 | 50 | 50 |
| CBG321609U302T | 3000 | 25% | 1.50 | 50 | 50 | 50 |
Note: When operating temperatures exceed +85, derating of current is necessary for chip ferrite beads for which rated current is 1A and over. Please apply the derating curve shown in chart according to the operating temperature.
Reliability Testing Items
| No. | Items | Requirements | Test Methods and Remarks |
| 1 | Operating Temperature Range | -55+125 Includes product surface temperature rise | |
| 2 | Solder ability | At least 95% of terminal electrode should be covered with solder | Preheating temperature:120 to 150 Preheating time: 60s Solder 96.5%Sn/3.0%Ag/0.5%Cu of the Sn solder. Solder temperature: 2455 Immersion tin depth:10mm Duration : 51s Dip performance to a flux of about:3 ~ 5 s |
| 3 | Resistance to Soldering | At least 95% of terminal electrode should be covered with solder. No mechanical damage. Impedance change: within 30% | Preheating temperature: 120 to 150 Preheating time: 60s Solder 96.5%Sn/3.0%Ag/0.5%Cu of the Sn solder. Solder temperature: 2605 Immersion tin depth:10mm Duration : 101s Dip performance to a flux of about:3 ~ 5 s |
| 4 | Adhesion of electrode | The termination and body should be no damage. | Applied force: 10N force for 3216 series. Keep time 101S |
| 5 | Low temperature | No mechanical damage. Impedance change: within 30% | Temperature:-552 Testing time:1000 24 0 h |
| 6 | Bending strength | No mechanical damage | Testing board: glass epoxy-resin substrate For 0.5 mm/s compression speed, curvature: 2mm, hold time 20s1s |
| 7 | Vibration | No mechanical damage. Impedance change: within 30% | Amplitude modulation: 1.5mm Test time: A period of 2h in each of 3 mutually perpendicular directions. Frequency range: 10Hz to 55Hz to 10Hz for 1min. |
| 8 | High temperature | No mechanical damage. Impedance change: within 30% | Testing time: 1000 24 0 h Temperature: 1252 |
| 9 | Static Humidity | No mechanical damage. Impedance change: within 30% | Humidity: 90% to 95% RH Temperature: 602 Testing time: 1000 24 0 h |
| 10 | High temperature load | No mechanical damage. Impedance change: within 30% | impose current: at room Testing time: 1000 24 0 h Temperature: 852 |
| 11 | Temperature Shock | No mechanical damage. Impedance change: within 30% | Temperature: -55 for 303min +125 for 303min Number of cycles: 100 |
Note: When there are questions concerning, measurement shall be made after 242hrs of recovery under the standard condition.
Product Packaging
Packaging Quantity (Unit: Pcs):
321609 Series: 4000 pcs per Reel, 40000 pcs per Box, 240000 pcs per Case.
Recommended Soldering Conditions
Soldering Conditions: Products can be applied to reflow soldering.
Iron soldering: Soldering Iron Temperature: 350 (Max), Power: 30W (Max), Soldering Time: < 5S (Take care not to apply the tip of the soldering iron to the terminal electrodes).
Cleaning
Cleaning Conditions: Cleaning Temperature: 60 max, Cleaning Time: 1 minute min, Ultrasonic output power: 200W max.
Storage Requirements
Storage period: Within 1 year from the ex-factory inspection date of the inductance company, the product can be used. The inspection date can be confirmed by the inspection number marked on the outside of the packaging.
2510270951_FH-CBG321609U070T_C3032651.pdf
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