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Quality Tape Reel Multilayer Chip Ferrite Inductors FH CMI201209U1R0KT NiCuZn Ferrite Body Silver Electrodes factory
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Quality Tape Reel Multilayer Chip Ferrite Inductors FH CMI201209U1R0KT NiCuZn Ferrite Body Silver Electrodes factory
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Specifications
Current Rating:
50mA
Inductance:
1uH
Tolerance:
±10%
Frequency - Self Resonant:
75MHz
Current - Saturation (Isat):
-
DC Resistance(DCR):
400mΩ
Ratings:
-
Q @ Frequency:
35@10MHz
Mfr. Part #:
CMI201209U1R0KT
Package:
0805
Key Attributes
Model Number: CMI201209U1R0KT
Product Description

Product Overview

The CMI2012 Series Multilayer Chip Ferrite Inductors are designed for various electronic applications. These inductors are constructed with a ferrite or ceramic body, inner electrodes made of pure silver, and terminal electrodes with silver and Ni/Sn plating. They are available in tape and reel packaging and are suitable for reflow soldering processes. The series offers a range of inductance values with tight tolerances, making them a reliable component for signal filtering and impedance matching.

Product Attributes

  • Product Type: Multilayer Chip Ferrite Inductors
  • Series: CMI2012 Series
  • Material: Ferrite (Ni-Cu-Zn system)
  • Inner Electrode Material: Pure Silver (Ag)
  • Terminal Electrode Material: Silver layer (Ag layer), Ni/Sn plating
  • Packaging: Tape & Reel
  • Certifications: RoHS compliant (if specified as "Unitary lead free")

Technical Specifications

Part Name Specification Version No. Date
Multilayer Chip Ferrite Inductors CMI2012 Series 22.01 2022-1-7

Dimensions & Inner Configuration

Size L (mm) W (mm) T (mm) a (mm)
201209 2.00.20 1.20.20 0.90.20 0.50.3
201212 2.00.20 1.20.20 1.20.20 0.50.3

Product Spec. Model Composition

Component Description
CMI Multilayer Chip Ferrite Chip Inductors
201209 / 201212 Dimensions (LWT) (e.g., 2.01.20.9mm)
U Material code
1R0 (e.g.) Inductance (e.g., 1.0H)
K / M Tolerance (e.g., K, 10%; M, 20%)
T Packaging (Tape & Reel)

Electrical Characteristics List

Part NO. Tolerance (%) Inductance (H) Q Value (min) RDC () max Test Frequency (MHz) Test Voltage (mV) SRF (MHz) min Rated Current (mA) max
CMI201209V47NKT 10 0.047 25 0.15 50 50 320 300
CMI201209V56NKT 10 0.056 25 0.15 50 50 320 300
CMI201209V68NKT 10 0.068 25 0.20 50 50 280 300
CMI201209V82NKT 10 0.082 25 0.20 50 50 280 300
CMI201209VR10KT 10 0.10 20 0.20 25 50 235 250
CMI201209VR12KT 10 0.12 20 0.25 25 50 220 250
CMI201209VR15KT 10 0.15 20 0.25 25 50 200 250
CMI201209VR18KT 10 0.18 20 0.30 25 50 185 250
CMI201209VR22KT 10 0.22 20 0.30 25 50 170 250
CMI201209VR27KT 10 0.27 20 0.40 25 50 150 250
CMI201209VR33KT 10 0.33 20 0.40 25 50 145 250
CMI201209VR39KT 10 0.39 25 0.50 25 50 135 200
CMI201209VR47KT 10 0.47 25 0.50 25 50 125 200
CMI201209VR56KT 10 0.56 25 0.60 25 50 115 150
CMI201209VR68KT 10 0.68 25 0.65 25 50 105 150
CMI201209VR82KT 10 0.82 25 0.70 25 50 100 150
CMI201209U1R0KT 10 1.0 35 0.40 10 50 75 50
CMI201209U1R2KT 10 1.2 35 0.40 10 50 65 50
CMI201209U1R5KT 10 1.5 35 0.40 10 50 60 50
CMI201209U1R8KT 10 1.8 35 0.40 10 50 55 50
CMI201209U2R2KT 10 2.2 35 0.60 10 50 50 50
CMI201209U2R7KT 10 2.7 35 0.60 10 50 45 50
CMI201209U3R3KT 10 3.3 35 0.60 10 50 41 50
CMI201209U3R9KT 10 3.9 35 0.80 10 50 38 50
CMI201209U4R7KT 10 4.7 35 0.90 10 50 35 30
CMI201209X5R6KT 10 5.6 30 1.00 4 50 32 15
CMI201209X6R8KT 10 6.8 30 1.05 4 50 29 15
CMI201209X8R2KT 10 8.2 30 1.05 4 50 26 15
CMI201209X100KT 10 10 30 1.15 2 50 24 15
CMI201209X100KT 10 10 30 1.15 2 50 24 15
CMI201209X120KT 10 12 30 1.15 2 50 22 15
CMI201209J150KT 10 15 25 1.15 1 50 19 5
CMI201209J180KT 10 18 25 1.20 1 50 18 5
CMI201209J220KT 10 22 25 1.20 1 50 16 5
CMI201209J270KT 10 27 25 1.50 1 50 16 5
CMI201209J330MT 20 33 25 1.50 1 50 16 5
CMI201212J390MT 20 39 25 1.50 1 50 16 5
CMI201212J470MT 20 47 25 1.70 1 50 15 5
CMI201212J560MT 20 56 25 2.60 1 50 10 5
CMI201212J680MT 20 68 25 2.60 1 50 10 5

Reliability Testing Items

No. Items Requirements Test Methods and Remarks
1 Operating Temperature Range -40+85
2 Solder ability At least 95% of terminal electrode should be covered with solder. Preheating temperature: 120 to 150; Preheating time: 60s; Solder: 96.5%Sn/3.0%Ag/0.5%Cu; Solder temperature: 2455; Immersion tin depth: 10mm; Duration: 51s; Dip performance to a flux of about: 3~5 s.
3 Resistance to Soldering At least 95% of terminal electrode should be covered with solder. No mechanical damage. Inductance change: V, U:<0xC2><0xB1>20%, X:<0xC2><0xB1>25%, J:<0xC2><0xB1>30%. Q value change(ferrite): <0xC2><0xB1>30%. Preheating temperature: 120 to 150; Preheating time: 60s; Solder: 96.5%Sn/3.0%Ag/0.5%Cu; Solder temperature: 2605; Immersion tin depth: 10mm; Duration: 101s; Dip performance to a flux of about: 3~5 s.
4 Adhesion of electrode The termination and body should be no damage. Applied force: 10N for 2012 series. Keep time: 101S.
5 Low temperature resistance No mechanical damage. Inductance change: <0xC2><0xB1>10%. Q value change(ferrite): <0xC2><0xB1>30%. Temperature: -402; Testing time: 1000+24-0 h.
6 Bending strength No mechanical damage. Testing board: glass epoxy-resin substrate. For 0.5 mm/s compression speed, curvature: 2mm, hold time 20s1s.
7 Vibration No mechanical damage. Inductance change: <0xC2><0xB1>10%. Q value change(ferrite): <0xC2><0xB1>30%. Amplitude: 1.5mm. Test time: 2h in each of 3 mutually perpendicular directions. Frequency range: 10Hz to 55Hz to 10Hz for 1min.
8 High temperature resistance No mechanical damage. Inductance change: <0xC2><0xB1>10%. Q value change(ferrite): <0xC2><0xB1>30%. Testing time: 1000+24-0 h. Temperature: 852.
9 Static Humidity No mechanical damage. Inductance change: <0xC2><0xB1>10%. Q value change(ferrite): <0xC2><0xB1>30%. Humidity: 90% to 95% RH. Temperature: 602. Testing time: 1000+24-0 h.
10 High temperature load No mechanical damage. Inductance change: <0xC2><0xB1>10%. Q value change(ferrite): <0xC2><0xB1>30%. Impose current: rated current. Testing time: 1000+24-0 h. Temperature: 852.
11 Temperature Shock No mechanical damage. Inductance change: <0xC2><0xB1>10%. Q value change(ferrite): <0xC2><0xB1>30%. Temperature: -40 for 303min +85 for 303min. Number of cycles: 32.

Note: When there are questions concerning measurement, it shall be made after 242hrs of recovery under the standard condition.

Packaging

Size REEL (Pcs) BOX (Pcs) CASE (Pcs)
201212 3000 30000 180000
201209 4000 40000 240000

Taping Dimensions (Embossed Tape) (Unit: mm)

Size A0 B0 W F E P1 P2 P0 D0 T
201209 1.500.2 2.300.2 8.00.2 3.50.1 1.750.2 4.00.2 2.00.1 4.00.2 1.550.1 0.950.1
201212 1.520.10 2.410.10 8.00+/-0.2 3.50+/-0.10 1.75+/-0.10 4.00+/-0.10 2.00+/-0.10 4.00+/-0.20 1.50+/-0.10 0.23+/-0.20

Peeling Off Force (Cover Tape)

  • Peeling force: 0.1N0.7N (pulling in the direction of arrow).
  • Speed of peeling off: 300mm/min.
  • The cover bond should not be damaged and should not bond the tape when it peeled off.

Recommended Soldering Conditions (Reflow Soldering)

Soldering Conditions:

  • Pre-heating: Temperature difference between solder and ferrite surface should be limited to 150 max.
  • Cooling: Temperature difference between product surface and solvent after soldering should be limited to 100 max.
  • Insufficient pre-heating may cause cracks on the ferrite, leading to product quality deterioration.
  • Products should be soldered within the allowable range indicated by the profile curve. Excessive conditions may cause electrode corrosion.
  • When soldering is repeated, allowable time is the accumulated time.

Manual Soldering

  • Soldering Iron Temperature: 350 (Max)
  • Power: 30W (Max)
  • Soldering Time: < 5S (Take care not to apply the tip of the soldering iron to the terminal electrodes).

Cleaning Conditions

  • Cleaning Temperature: 60 (Max)
  • Cleaning Time: 1 minute (Min)
  • Ultrasonic Output Power: 200W (Max)

Storage Requirements

  • Storage Period: Within 1 year from the inspection date at the inductor company. If exceeding 1 year, solder ability should be checked before use.
  • Storage Conditions:
  • Warehouse Conditions: Temperature: -10 to +40, Relative Humidity: 30% to 70%.
  • Prohibited Storage: Do not store in corrosive substances (sulfur, chlorine gas, acid) to prevent electrode oxidation and poor solderability.
  • Placement: Store on a shelf to prevent influence from humidity and dust.
  • Environment: Avoid heat shock, vibration, and direct sunlight.
  • Packaging: Products should be stored under airtight packaged condition.

Usage Of ODS (Ozone Depleting Substances)

The company does not use ODS such as CCl4 (Carbon Tetrachloride) and HCFC in its production process.

Notes

  • If the product is labeled "Unitary lead free", it complies with RoHS directive requirements.
  • This product specification guarantees the quality of our product as a single unit. Please ensure your product has been evaluated and confirmed against your specifications when our product is mounted to your product.
  • The company cannot warrant against failure caused by any use of our product that deviates from the intended use as described in this product specification.

2410121256_FH-CMI201209U1R0KT_C99367.pdf

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