Product Overview
The CMI2012 Series Multilayer Chip Ferrite Inductors are designed for various electronic applications. These inductors are constructed with a ferrite or ceramic body, inner electrodes made of pure silver, and terminal electrodes with silver and Ni/Sn plating. They are available in tape and reel packaging and are suitable for reflow soldering processes. The series offers a range of inductance values with tight tolerances, making them a reliable component for signal filtering and impedance matching.
Product Attributes
- Product Type: Multilayer Chip Ferrite Inductors
- Series: CMI2012 Series
- Material: Ferrite (Ni-Cu-Zn system)
- Inner Electrode Material: Pure Silver (Ag)
- Terminal Electrode Material: Silver layer (Ag layer), Ni/Sn plating
- Packaging: Tape & Reel
- Certifications: RoHS compliant (if specified as "Unitary lead free")
Technical Specifications
| Part Name | Specification | Version No. | Date |
|---|---|---|---|
| Multilayer Chip Ferrite Inductors | CMI2012 Series | 22.01 | 2022-1-7 |
Dimensions & Inner Configuration
| Size | L (mm) | W (mm) | T (mm) | a (mm) |
|---|---|---|---|---|
| 201209 | 2.00.20 | 1.20.20 | 0.90.20 | 0.50.3 |
| 201212 | 2.00.20 | 1.20.20 | 1.20.20 | 0.50.3 |
Product Spec. Model Composition
| Component | Description |
|---|---|
| CMI | Multilayer Chip Ferrite Chip Inductors |
| 201209 / 201212 | Dimensions (LWT) (e.g., 2.01.20.9mm) |
| U | Material code |
| 1R0 (e.g.) | Inductance (e.g., 1.0H) |
| K / M | Tolerance (e.g., K, 10%; M, 20%) |
| T | Packaging (Tape & Reel) |
Electrical Characteristics List
| Part NO. | Tolerance (%) | Inductance (H) | Q Value (min) | RDC () max | Test Frequency (MHz) | Test Voltage (mV) | SRF (MHz) min | Rated Current (mA) max |
|---|---|---|---|---|---|---|---|---|
| CMI201209V47NKT | 10 | 0.047 | 25 | 0.15 | 50 | 50 | 320 | 300 |
| CMI201209V56NKT | 10 | 0.056 | 25 | 0.15 | 50 | 50 | 320 | 300 |
| CMI201209V68NKT | 10 | 0.068 | 25 | 0.20 | 50 | 50 | 280 | 300 |
| CMI201209V82NKT | 10 | 0.082 | 25 | 0.20 | 50 | 50 | 280 | 300 |
| CMI201209VR10KT | 10 | 0.10 | 20 | 0.20 | 25 | 50 | 235 | 250 |
| CMI201209VR12KT | 10 | 0.12 | 20 | 0.25 | 25 | 50 | 220 | 250 |
| CMI201209VR15KT | 10 | 0.15 | 20 | 0.25 | 25 | 50 | 200 | 250 |
| CMI201209VR18KT | 10 | 0.18 | 20 | 0.30 | 25 | 50 | 185 | 250 |
| CMI201209VR22KT | 10 | 0.22 | 20 | 0.30 | 25 | 50 | 170 | 250 |
| CMI201209VR27KT | 10 | 0.27 | 20 | 0.40 | 25 | 50 | 150 | 250 |
| CMI201209VR33KT | 10 | 0.33 | 20 | 0.40 | 25 | 50 | 145 | 250 |
| CMI201209VR39KT | 10 | 0.39 | 25 | 0.50 | 25 | 50 | 135 | 200 |
| CMI201209VR47KT | 10 | 0.47 | 25 | 0.50 | 25 | 50 | 125 | 200 |
| CMI201209VR56KT | 10 | 0.56 | 25 | 0.60 | 25 | 50 | 115 | 150 |
| CMI201209VR68KT | 10 | 0.68 | 25 | 0.65 | 25 | 50 | 105 | 150 |
| CMI201209VR82KT | 10 | 0.82 | 25 | 0.70 | 25 | 50 | 100 | 150 |
| CMI201209U1R0KT | 10 | 1.0 | 35 | 0.40 | 10 | 50 | 75 | 50 |
| CMI201209U1R2KT | 10 | 1.2 | 35 | 0.40 | 10 | 50 | 65 | 50 |
| CMI201209U1R5KT | 10 | 1.5 | 35 | 0.40 | 10 | 50 | 60 | 50 |
| CMI201209U1R8KT | 10 | 1.8 | 35 | 0.40 | 10 | 50 | 55 | 50 |
| CMI201209U2R2KT | 10 | 2.2 | 35 | 0.60 | 10 | 50 | 50 | 50 |
| CMI201209U2R7KT | 10 | 2.7 | 35 | 0.60 | 10 | 50 | 45 | 50 |
| CMI201209U3R3KT | 10 | 3.3 | 35 | 0.60 | 10 | 50 | 41 | 50 |
| CMI201209U3R9KT | 10 | 3.9 | 35 | 0.80 | 10 | 50 | 38 | 50 |
| CMI201209U4R7KT | 10 | 4.7 | 35 | 0.90 | 10 | 50 | 35 | 30 |
| CMI201209X5R6KT | 10 | 5.6 | 30 | 1.00 | 4 | 50 | 32 | 15 |
| CMI201209X6R8KT | 10 | 6.8 | 30 | 1.05 | 4 | 50 | 29 | 15 |
| CMI201209X8R2KT | 10 | 8.2 | 30 | 1.05 | 4 | 50 | 26 | 15 |
| CMI201209X100KT | 10 | 10 | 30 | 1.15 | 2 | 50 | 24 | 15 |
| CMI201209X100KT | 10 | 10 | 30 | 1.15 | 2 | 50 | 24 | 15 |
| CMI201209X120KT | 10 | 12 | 30 | 1.15 | 2 | 50 | 22 | 15 |
| CMI201209J150KT | 10 | 15 | 25 | 1.15 | 1 | 50 | 19 | 5 |
| CMI201209J180KT | 10 | 18 | 25 | 1.20 | 1 | 50 | 18 | 5 |
| CMI201209J220KT | 10 | 22 | 25 | 1.20 | 1 | 50 | 16 | 5 |
| CMI201209J270KT | 10 | 27 | 25 | 1.50 | 1 | 50 | 16 | 5 |
| CMI201209J330MT | 20 | 33 | 25 | 1.50 | 1 | 50 | 16 | 5 |
| CMI201212J390MT | 20 | 39 | 25 | 1.50 | 1 | 50 | 16 | 5 |
| CMI201212J470MT | 20 | 47 | 25 | 1.70 | 1 | 50 | 15 | 5 |
| CMI201212J560MT | 20 | 56 | 25 | 2.60 | 1 | 50 | 10 | 5 |
| CMI201212J680MT | 20 | 68 | 25 | 2.60 | 1 | 50 | 10 | 5 |
Reliability Testing Items
| No. | Items | Requirements | Test Methods and Remarks |
|---|---|---|---|
| 1 | Operating Temperature Range | -40+85 | |
| 2 | Solder ability | At least 95% of terminal electrode should be covered with solder. | Preheating temperature: 120 to 150; Preheating time: 60s; Solder: 96.5%Sn/3.0%Ag/0.5%Cu; Solder temperature: 2455; Immersion tin depth: 10mm; Duration: 51s; Dip performance to a flux of about: 3~5 s. |
| 3 | Resistance to Soldering | At least 95% of terminal electrode should be covered with solder. No mechanical damage. Inductance change: V, U:<0xC2><0xB1>20%, X:<0xC2><0xB1>25%, J:<0xC2><0xB1>30%. Q value change(ferrite): <0xC2><0xB1>30%. | Preheating temperature: 120 to 150; Preheating time: 60s; Solder: 96.5%Sn/3.0%Ag/0.5%Cu; Solder temperature: 2605; Immersion tin depth: 10mm; Duration: 101s; Dip performance to a flux of about: 3~5 s. |
| 4 | Adhesion of electrode | The termination and body should be no damage. | Applied force: 10N for 2012 series. Keep time: 101S. |
| 5 | Low temperature resistance | No mechanical damage. Inductance change: <0xC2><0xB1>10%. Q value change(ferrite): <0xC2><0xB1>30%. | Temperature: -402; Testing time: 1000+24-0 h. |
| 6 | Bending strength | No mechanical damage. | Testing board: glass epoxy-resin substrate. For 0.5 mm/s compression speed, curvature: 2mm, hold time 20s1s. |
| 7 | Vibration | No mechanical damage. Inductance change: <0xC2><0xB1>10%. Q value change(ferrite): <0xC2><0xB1>30%. | Amplitude: 1.5mm. Test time: 2h in each of 3 mutually perpendicular directions. Frequency range: 10Hz to 55Hz to 10Hz for 1min. |
| 8 | High temperature resistance | No mechanical damage. Inductance change: <0xC2><0xB1>10%. Q value change(ferrite): <0xC2><0xB1>30%. | Testing time: 1000+24-0 h. Temperature: 852. |
| 9 | Static Humidity | No mechanical damage. Inductance change: <0xC2><0xB1>10%. Q value change(ferrite): <0xC2><0xB1>30%. | Humidity: 90% to 95% RH. Temperature: 602. Testing time: 1000+24-0 h. |
| 10 | High temperature load | No mechanical damage. Inductance change: <0xC2><0xB1>10%. Q value change(ferrite): <0xC2><0xB1>30%. | Impose current: rated current. Testing time: 1000+24-0 h. Temperature: 852. |
| 11 | Temperature Shock | No mechanical damage. Inductance change: <0xC2><0xB1>10%. Q value change(ferrite): <0xC2><0xB1>30%. | Temperature: -40 for 303min +85 for 303min. Number of cycles: 32. |
Note: When there are questions concerning measurement, it shall be made after 242hrs of recovery under the standard condition.
Packaging
| Size | REEL (Pcs) | BOX (Pcs) | CASE (Pcs) |
|---|---|---|---|
| 201212 | 3000 | 30000 | 180000 |
| 201209 | 4000 | 40000 | 240000 |
Taping Dimensions (Embossed Tape) (Unit: mm)
| Size | A0 | B0 | W | F | E | P1 | P2 | P0 | D0 | T |
|---|---|---|---|---|---|---|---|---|---|---|
| 201209 | 1.500.2 | 2.300.2 | 8.00.2 | 3.50.1 | 1.750.2 | 4.00.2 | 2.00.1 | 4.00.2 | 1.550.1 | 0.950.1 |
| 201212 | 1.520.10 | 2.410.10 | 8.00+/-0.2 | 3.50+/-0.10 | 1.75+/-0.10 | 4.00+/-0.10 | 2.00+/-0.10 | 4.00+/-0.20 | 1.50+/-0.10 | 0.23+/-0.20 |
Peeling Off Force (Cover Tape)
- Peeling force: 0.1N0.7N (pulling in the direction of arrow).
- Speed of peeling off: 300mm/min.
- The cover bond should not be damaged and should not bond the tape when it peeled off.
Recommended Soldering Conditions (Reflow Soldering)
Soldering Conditions:
- Pre-heating: Temperature difference between solder and ferrite surface should be limited to 150 max.
- Cooling: Temperature difference between product surface and solvent after soldering should be limited to 100 max.
- Insufficient pre-heating may cause cracks on the ferrite, leading to product quality deterioration.
- Products should be soldered within the allowable range indicated by the profile curve. Excessive conditions may cause electrode corrosion.
- When soldering is repeated, allowable time is the accumulated time.
Manual Soldering
- Soldering Iron Temperature: 350 (Max)
- Power: 30W (Max)
- Soldering Time: < 5S (Take care not to apply the tip of the soldering iron to the terminal electrodes).
Cleaning Conditions
- Cleaning Temperature: 60 (Max)
- Cleaning Time: 1 minute (Min)
- Ultrasonic Output Power: 200W (Max)
Storage Requirements
- Storage Period: Within 1 year from the inspection date at the inductor company. If exceeding 1 year, solder ability should be checked before use.
- Storage Conditions:
- Warehouse Conditions: Temperature: -10 to +40, Relative Humidity: 30% to 70%.
- Prohibited Storage: Do not store in corrosive substances (sulfur, chlorine gas, acid) to prevent electrode oxidation and poor solderability.
- Placement: Store on a shelf to prevent influence from humidity and dust.
- Environment: Avoid heat shock, vibration, and direct sunlight.
- Packaging: Products should be stored under airtight packaged condition.
Usage Of ODS (Ozone Depleting Substances)
The company does not use ODS such as CCl4 (Carbon Tetrachloride) and HCFC in its production process.
Notes
- If the product is labeled "Unitary lead free", it complies with RoHS directive requirements.
- This product specification guarantees the quality of our product as a single unit. Please ensure your product has been evaluated and confirmed against your specifications when our product is mounted to your product.
- The company cannot warrant against failure caused by any use of our product that deviates from the intended use as described in this product specification.
2410121256_FH-CMI201209U1R0KT_C99367.pdf
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