Product Overview
The FHW0805UF Series Wire Wound Chip Inductors are designed for various electronic applications. These inductors feature a ferrite core construction and are available in the 0805 size. They offer a range of inductance values with specified tolerances and are suitable for reflow soldering processes. The series is manufactured to meet stringent reliability standards, ensuring consistent performance in demanding environments.
Product Attributes
- Product Type: Wire Wound Chip Inductor
- Series: FHW0805UF Series
- Core Material: Ferrite (Ni-Zn ferrite)
- Terminal Material: Tin (Sn)
- Packaging Type: Reel Tape
- Compliance: RoHS compliant
Technical Specifications
Dimensions & Inner Configuration
| Component | Material | Unit (mm/inch) | L (Max) | W (Max) | T (Max) | A | B | C | D | E |
|---|---|---|---|---|---|---|---|---|---|---|
| Core | Ferrite Core (Ni-Zn ferrite) | mm | 2.30 (0.091) | 1.70 (0.067) | 1.52 (0.060) | 1.27 (0.050) | 0.50 (0.020) | 1.78 (0.070) | 1.02 (0.040) | 0.76 (0.030) |
| Electrode (Bottom) | Silver (Ag), Nickel (Ni), Tin (Sn) | |||||||||
| Wire | Copper (Cu) | |||||||||
| Encapsulation Layer | Resin (UV Adhesive) | |||||||||
| Marking | Ink (UV printing ink) |
Product Model Composition
FHW 0805 UF R33 J S T
- FHW: Wire Wound Inductor Series
- 0805: Dimensions
- UF: Core Material (Ferrite core)
- R33: Nominal Inductance (e.g., 0.33H)
- J: Tolerance (e.g., 5%)
- S: Terminal Material (Tin)
- T: Packaging Type (Reel tape)
Electrical Characteristics
| Part NO. | Accuracy Grade | Inductance (H) | Ls Test Frequency (MHz) | Q Value (Min) | Q Test Frequency (MHz) | Rdc () Max | Test Voltage (mV) | SRF (MHz) Min | Idc (mA) Max |
|---|---|---|---|---|---|---|---|---|---|
| FHW0805UFR12ST | J, K | 0.12 | 25.2 | 15 | 25.2 | 0.20 | 500 | 1000 | 800 |
| FHW0805UFR15ST | J, K | 0.15 | 25.2 | 15 | 25.2 | 0.30 | 500 | 600 | 600 |
| FHW0805UFR18ST | J, K | 0.18 | 25.2 | 15 | 25.2 | 0.25 | 500 | 550 | 750 |
| FHW0805UFR22ST | J, K | 0.22 | 25.2 | 15 | 25.2 | 0.30 | 500 | 500 | 700 |
| FHW0805UFR27ST | J, K | 0.27 | 25.2 | 15 | 25.2 | 0.35 | 500 | 550 | 550 |
| FHW0805UFR33ST | J, K | 0.33 | 25.2 | 15 | 25.2 | 0.40 | 500 | 500 | 500 |
| FHW0805UFR47ST | J, K | 0.47 | 25.2 | 10 | 25.2 | 0.40 | 500 | 450 | 500 |
| FHW0805UFR53ST | J, K | 0.53 | 25.2 | 10 | 25.2 | 0.40 | 500 | 450 | 500 |
| FHW0805UFR56ST | J, K | 0.56 | 25.2 | 10 | 25.2 | 0.40 | 500 | 450 | 500 |
| FHW0805UF6R8ST | J, K | 6.8 | 7.96 | 10 | 7.96 | 2.60 | 500 | 55 | 220 |
| FHW0805UF7R5ST | J, K | 7.5 | 7.96 | 10 | 7.96 | 2.80 | 500 | 55 | 210 |
| FHW0805UF8R2ST | J, K | 8.2 | 7.96 | 10 | 7.96 | 3.00 | 500 | 50 | 180 |
| FHW0805UF100ST | J, K | 10 | 2.52 | 8 | 2.52 | 3.20 | 500 | 30 | 150 |
| FHW0805UF120ST | J, K | 12 | 2.52 | 8 | 2.52 | 3.50 | 500 | 17 | 110 |
| FHW0805UF150ST | J, K | 15 | 2.52 | 8 | 2.52 | 4.20 | 500 | 16 | 100 |
| FHW0805UF180ST | J, K | 18 | 2.52 | 8 | 2.52 | 4.50 | 500 | 15 | 95 |
| FHW0805UF220ST | J, K | 22 | 2.52 | 8 | 2.52 | 6.00 | 500 | 14 | 80 |
represents the nominal inductance accuracy level: J (5%); K (10%).
Reliability Testing Items
| No. | Item | Requirements | Test Methods and Remarks |
|---|---|---|---|
| 1 | Test Standard Conditions | a) Temperature: 15+35 ; b) Relative humidity: 25%75%; c) Pressure: 86 kPa106 kPa. For disputes: a) Temperature: 201; b) Relative humidity: 63%67%; c) Pressure: 86 kPa106 kPa. | |
| 2 | Operating Temperature Range | -40+85 | FHW-UF series |
| 3 | Solder ability | No visible mechanical damage; Electrode surface solder coverage 80%. | Dip in flux and solder pot (96.5Sn/3.0Ag/0.5Cu) at 2455 for 51s. |
| 4 | Resistance to Soldering | No visible mechanical damage; Inductance change 5%; Q value change 10%. | Dip in flux and solder pot (96.5Sn/3.0Ag/0.5Cu) at 2605 for 101s. |
| 5 | Vibration | No visible mechanical damage; Inductance change 5%; Q value change 10%. | Amplitude 1.5mm, frequency 10~55Hz, 2 hours per direction (X, Y, Z). |
| 6 | End Electrode Strength | No visible mechanical damage; No electrode detachment. | Weld on PCB, apply force as shown in diagram. 0805UF Series: 13 N, Keep time: (101)s, Speed: 1.0 mm/s. |
| 7 | Low temperature resistance | No visible mechanical damage; Inductance change 5%; Q value change 10%. | Subjected to -402 for 1000 (+240/-0) h. |
| 8 | High temperature resistance | No visible mechanical damage; Inductance change 5%; Q value change 10%. | Subjected to +855 for 1000 (+240/-0) h. |
| 9 | Temperature Shock | No visible mechanical damage; Inductance change 5%; Q value change 10%. | +85 30 min -40 30 min, 100 Cycles. |
| 10 | High temperature load | No visible mechanical damage; Inductance change 5%; Q value change 10%. | Store at 852 for 1000 (+240/-0) h with rated current applied. |
| 11 | Static Humidity | No visible mechanical damage; Inductance change 5%; Q value change 10%. | Subjected to 90%95%RH at 602 for 1000 (+240/-0) h. |
| 12 | Bending strength | No visible mechanical damage. | Install on test substrate; apply force in vertical direction. Bend down (20.2) mm at rate of (10.5) mm/s, hold for (201) s. |
| 13 | Solvent Resistance | No visible mechanical damage; Inductance change 5%; Q value change 10%. | Soak in isopropyl alcohol at 235 for 50.5 min. |
Note: Electrical performance tests should be conducted within 48 h after placing at room temperature for at least 2 h.
Product Packaging
| Size | Pieces per Reel | Pieces per Box | Pieces per Case |
|---|---|---|---|
| 0805 | 3000 | 9000 (3 Reels) | 45000 (1.5 Cases) |
| 15000 (5 Reels) | 60000 (2 Cases) | ||
| 90000 (3 Cases) | |||
| 120000 (4 Cases) | |||
| 180000 (6 Cases) |
Recommended Soldering Conditions
Method: Reflow soldering.
- Flux: Rosin-based flux. Avoid highly acidic flux with halide content exceeding 0.2(wt)%.
- Solder: Lead-free solder (96.5Sn /3.0Ag/0.5Cu).
- Temperature Difference: Max 150 during pre-heating; Max 100 during cooling after soldering.
Cleaning
- Temperature: 60 (Max)
- Time: 5 minutes (Max)
- Ultrasonic Power: 200W (Max)
Storage Requirements
- Storage Period: Within 1 year from the ex-factory inspection date. If exceeded, check solderability before use.
- Storage Conditions: Temperature: -10 +40, Relative Humidity: 30 70%. Store in a warehouse, avoid corrosive substances, humidity, dust, heat shock, vibration, and direct sunlight. Keep in airtight packaging.
Usage Of ODS (Ozone Depleting Substances)
The company does not use ODS such as CCl4 (Carbon Tetrachloride) and HCFC in its production process.
Notes
- Products are RoHS compliant.
- This specification guarantees the quality of the product as a single unit. Ensure your product has been evaluated and confirmed against your specifications when integrating our product.
- The company does not warrant against failure caused by any use deviating from the intended use described in this specification.
- Do not touch the coil with sharp objects such as tweezers to prevent wire breakage.
2409271833_FH-FHW0805UFR56JST_C304279.pdf
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