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Specifications
Current Rating:
2.5A
Number of Circuits:
1
DC Resistance(DCR):
80mΩ
Tolerance:
±25%
Impedance @ Frequency:
500Ω@100MHz
Mfr. Part #:
CBM321609U501T
Package:
1206
Key Attributes
Model Number:
CBM321609U501T
Product Description
Multilayer Chip Ferrite Ultra-High Current Beads
These multilayer chip ferrite beads offer high impedance and effective EMI/RFI suppression over a wide frequency range, suitable for high-current applications. Their chip form factor allows for simple PCB mounting and automated SMT processing, making them ideal for noise suppression in power lines and signal lines of electronic equipment.
Features
- Higher impedance compared to leaded beads in the same size.
- Effective EMI and RFI suppression due to chip design.
- Conforms to EIA standards for SMT compatibility.
- Unique terminal electrode structure allows for high permissible current (up to 6.0A max).
Applications
- Noise suppression in power lines or extra-large current signal lines of electrical equipment such as communication equipment, computers, and LCD TVs.
Product Structure
- Silver layer (Ag layer)
- Ni/Sn plating
- Inner electrode
- Body
Technical Specifications
| Part Number | Dimensions (LWT mm) | Impedance () | Packaging Style | DCR ()Max | Rated Current Ir (mA)Max |
| CBM060303X220T | 0.60.30.3 | 22 | Tape & Reel | 0.040 | 1800 |
| CBM060303X330T | 0.60.30.3 | 33 | Tape & Reel | 0.055 | 1500 |
| CBM060303X800T | 0.60.30.3 | 80 | Tape & Reel | 0.130 | 1000 |
| CBM060303X121T | 0.60.30.3 | 120 | Tape & Reel | 0.160 | 900 |
| CBM100505U000T | 1.00.50.5 | 0 | Tape & Reel | 0.02 | 2000 |
| CBM100505U050T | 1.00.50.5 | 5 | Tape & Reel | 0.02 | 2000 |
| CBM100505U101T | 1.00.50.5 | 100 | Tape & Reel | 0.15 | 1000 |
| CBM100505U102T | 1.00.50.5 | 1000 | Tape & Reel | 0.65 | 300 |
| CBM160808U000T | 1.60.80.8 | 0 | Tape & Reel | 0.01 | 6000 |
| CBM160808U050T | 1.60.80.8 | 5 | Tape & Reel | 0.01 | 6000 |
| CBM160808U101T | 1.60.80.8 | 100 | Tape & Reel | 0.06 | 2500 |
| CBM160808U102T | 1.60.80.8 | 1000 | Tape & Reel | 0.35 | 700 |
| CBM201209U000T | 2.01.20.9 | 0 | Tape & Reel | 0.01 | 6000 |
| CBM201209U050T | 2.01.20.9 | 5 | Tape & Reel | 0.01 | 6000 |
| CBM201209U101T | 2.01.20.9 | 100 | Tape & Reel | 0.045 | 4000 |
| CBM201209U102T | 2.01.20.9 | 1000 | Tape & Reel | 0.12 | 1500 |
| CBM321609U000T | 3.21.60.9 | 0 | Tape & Reel | 0.01 | 6000 |
| CBM321609U050T | 3.21.60.9 | 5 | Tape & Reel | 0.01 | 6000 |
| CBM321609U101T | 3.21.60.9 | 100 | Tape & Reel | 0.035 | 4000 |
| CBM321609U102T | 3.21.60.9 | 1000 | Tape & Reel | 0.12 | 2100 |
| CBM322513U110T | 3.22.51.3 | 11 | Tape & Reel | 0.02 | 6000 |
| CBM322513U150T | 3.22.51.3 | 15 | Tape & Reel | 0.02 | 6000 |
| CBM322513U102T | 3.22.51.3 | 1000 | Tape & Reel | 0.23 | 2500 |
| CBM451616U190T | 4.51.61.6 | 19 | Tape & Reel | 0.009 | 6000 |
| CBM451616U600T | 4.51.61.6 | 60 | Tape & Reel | 0.009 | 6000 |
| CBM453215U190T | 4.53.21.5 | 19 | Tape & Reel | 0.01 | 6000 |
| CBM453215U600T | 4.53.21.5 | 60 | Tape & Reel | 0.01 | 6000 |
| CBM453215U101T | 4.53.21.5 | 100 | Tape & Reel | 0.02 | 6000 |
Reliability Test Method
| No. | Items | Requirements | Test Methods and Remarks |
| 1 | Operating Temperature Range | -55+125 | Includes product surface temperature rise |
| 2 | Solder ability | No visible damage; 95% or more of electrode area shall be coated by new solder. | Preheating temperature:120~150, Preheating time: 60s, Solder: 96.5%Sn/3.0%Ag/0.5%Cu, Solder temperature: 2455, Immersion tin depth:10mm, Duration: 51s, Dip performance to a flux of about:3 ~ 5 s |
| 3 | Resistance to Soldering Heat | At least 95% of terminal electrode should be covered with solder. No mechanical damage. Impedance change: within 30%. | Preheating temperature: 120~150, Preheating time: 60s, Solder: 96.5%Sn/3.0%Ag/0.5%Cu, Solder temperature: 2605, Immersion tin depth:10mm, Duration: 101s, Dip performance to a flux of about:35 s |
| 4 | Adhesion of electrode | The termination and body should be no damage. | Applied force: 5N for 1005 series; 7N for 1608 series; 10N for 2012, 3216 series; 15N for 3225, 4532 series. Keep time: 101S |
| 5 | Low temperature resistance | No mechanical damage. Impedance change: within 30%. | Temperature: -552, Testing time: 10000 +24 h |
| 6 | Bending strength | No mechanical damage. | Testing board: glass epoxy-resin substrate, Bending: 2mm, Keep time: 20s1s |
2411251503_FH-CBM321609U501T_C391190.pdf
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