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Specifications
Current Rating:
-
Number of Circuits:
1
DC Resistance(DCR):
-
Tolerance:
±25%
Impedance @ Frequency:
120Ω@100MHz
Mfr. Part #:
CBM321611U121T
Package:
1206
Key Attributes
Model Number:
CBM321611U121T
Product Description
Multilayer Chip Ferrite Ultra-High Current Beads
These multilayer chip ferrite beads offer high impedance and effective EMI/RFI suppression over a wide frequency range, suitable for various electronic devices. Their compact size and SMD compatibility allow for easy integration into PCB designs. They are designed for noise suppression in power lines and high-current signal lines of communication equipment, computers, and LCD TVs.
Features
- Higher impedance compared to plug-in beads in the same size.
- Effective EMI and RFI suppression due to their chip form factor without leads, simplifying PCB mounting.
- Conforms to EIA standards for shape and size, enabling automatic mounting with SMT equipment.
Applications
- Noise suppression in power lines or ultra-high current signal lines of electrical equipment such as communication equipment, computers, and LCD TVs.
Part Numbering System
CBM (Product Code) - 201209 (Dimensions LWT in mm) - U (Material Code) - 121 (Impedance in ) - T (Packaging Style: Tape & Reel)
Product Structure
- a. Silver layer (Ag layer)
- b. Plating (Ni/Sn plating)
- c. Inner electrode
- d. Body
Technical Specifications
| Part No | Dimensions (LWT mm) | Impedance () | Tolerance | Test Frequency (MHz) | DCR () Max | Rated Current Ir (mA) Max |
| CBM060303X220T | 0.60.30.3 | 22 | 25% | 100 | 0.040 | 1800 |
| CBM060303X330T | 0.60.30.3 | 33 | 25% | 100 | 0.055 | 1500 |
| CBM060303X800T | 0.60.30.3 | 80 | 25% | 100 | 0.130 | 1000 |
| CBM060303X121T | 0.60.30.3 | 120 | 25% | 100 | 0.160 | 900 |
| CBM100505U000T | 1.00.50.5 | 0 | 015 | 100 | 0.02 | 2000 |
| CBM100505U050T | 1.00.50.5 | 5 | 015 | 100 | 0.02 | 2000 |
| CBM100505U101T | 1.00.50.5 | 100 | 25% | 100 | 0.15 | 1000 |
| CBM100505U102T | 1.00.50.5 | 1000 | 25% | 100 | 0.65 | 300 |
| CBM160808U000T | 1.60.80.8 | 0 | 015 | 100 | 0.01 | 6000 |
| CBM160808U050T | 1.60.80.8 | 5 | 015 | 100 | 0.01 | 6000 |
| CBM160808U101T | 1.60.80.8 | 100 | 25% | 100 | 0.06 | 2500 |
| CBM160808U102T | 1.60.80.8 | 1000 | 25% | 100 | 0.35 | 700 |
| CBM201209U000T | 2.01.20.9 | 0 | 015 | 100 | 0.01 | 6000 |
| CBM201209U050T | 2.01.20.9 | 5 | 015 | 100 | 0.01 | 6000 |
| CBM201209U101T | 2.01.20.9 | 100 | 25% | 100 | 0.045 | 4000 |
| CBM201209U102T | 2.01.20.9 | 1000 | 25% | 100 | 0.12 | 1500 |
| CBM321609U000T | 3.21.60.9 | 0 | 015 | 100 | 0.01 | 6000 |
| CBM321609U050T | 3.21.60.9 | 5 | 015 | 100 | 0.01 | 6000 |
| CBM321609U101T | 3.21.60.9 | 100 | 25% | 100 | 0.035 | 4000 |
| CBM321609U102T | 3.21.60.9 | 1000 | 25% | 100 | 0.12 | 2100 |
| CBM322513U110T | 3.22.51.3 | 11 | 715 | 100 | 0.02 | 6000 |
| CBM322513U150T | 3.22.51.3 | 15 | 921 | 100 | 0.02 | 6000 |
| CBM322513U102T | 3.22.51.3 | 1000 | 25% | 100 | 0.23 | 2500 |
| CBM451616U190T | 4.51.61.6 | 19 | 1225 | 100 | 0.009 | 6000 |
| CBM451616U600T | 4.51.61.6 | 60 | 25% | 100 | 0.009 | 6000 |
| CBM453215U190T | 4.53.21.5 | 19 | 1225 | 100 | 0.01 | 6000 |
| CBM453215U300T | 4.53.21.5 | 30 | 25% | 100 | 0.01 | 6000 |
| CBM453215U101T | 4.53.21.5 | 100 | 25% | 100 | 0.02 | 6000 |
| CBM453215U501T | 4.53.21.5 | 500 | 25% | 100 | 0.08 | 4000 |
Reliability Test Method
| No. | Items | Requirements | Test Methods and Remarks |
| 1 | Operating Temperature Range | -55+125 | Includes product surface temperature rise |
| 2 | Solder ability | No visible damage; 95% or more of electrode area shall be coated by new solder. | Preheating temperature: 120~150, Preheating time: 60s, Solder: 96.5%Sn/3.0%Ag/0.5%Cu, Solder temperature: 2455, Immersion tin depth: 10mm, Duration: 51s, Dip performance to a flux of about: 3~5s |
| 3 | Resistance to Soldering Heat | At least 95% of terminal electrode should be covered with solder. No mechanical damage. Impedance change: within 30%. | Preheating temperature: 120~150, Preheating time: 60s, Solder: 96.5%Sn/3.0%Ag/0.5%Cu, Solder temperature: 2605, Immersion tin depth: 10mm, Duration: 101s, Dip performance to a flux of about: 3~5s |
| 4 | Adhesion of electrode | The termination and body should be no damage. | Applied force: 5N for 1005 series; 7N for 1608 series; 10N for 2012, 3216 series; 15N for 3225, 4532 series. Keep time: 101S |
| 5 | Low temperature resistance | No mechanical damage. Impedance change: within 30%. | Temperature: -552, Testing time: 10000 +24 h |
| 6 | Bending strength | No mechanical damage | Testing board: glass epoxy-resin substrate, For 0.5mm/s pressing speed, bending: 2mm, holding time: 20s1s |
2411251503_FH-CBM321611U121T_C394447.pdf
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