Product Overview
The CBG321609U Series Chip Ferrite Beads are designed for noise suppression. They are suitable for various electronic applications requiring effective filtering and impedance matching.
Product Attributes
- Brand: Not specified
- Origin: Not specified
- Material: Ferrite (Ni-Cu-Zn system), Silver (Ag), Ni/Sn plating
- Color: Not specified
- Certifications: Not specified
Technical Specifications
| Part NO. | Tolerance | Impedance () | RDC ()max | Test Frequency (MHz) | Test Voltage (mV) | Rated Current (mA)max |
| CBG321609U000T | 015 | 0 | 0.05 | 100 | 50 | 2200 |
| CBG321609U050T | 015 | 5 | 0.05 | 100 | 50 | 2200 |
| CBG321609U070T | 011 | 7 | 0.05 | 100 | 50 | 2200 |
| CBG321609U090T | 513 | 9 | 0.05 | 100 | 50 | 2000 |
| CBG321609U110T | 715 | 11 | 0.05 | 100 | 50 | 2000 |
| CBG321609U150T | 921 | 15 | 0.05 | 100 | 50 | 2000 |
| CBG321609U190T | 1225 | 19 | 0.05 | 100 | 50 | 2000 |
| CBG321609U260T | 25% | 26 | 0.05 | 100 | 50 | 2000 |
| CBG321609U310T | 25% | 31 | 0.05 | 100 | 50 | 2000 |
| CBG321609U600T | 25% | 60 | 0.10 | 100 | 50 | 1000 |
| CBG321609U700T | 25% | 70 | 0.10 | 100 | 50 | 1000 |
| CBG321609U800T | 25% | 80 | 0.10 | 100 | 50 | 1000 |
| CBG321609U101T | 25% | 100 | 0.10 | 100 | 50 | 1000 |
| CBG321609U121T | 25% | 120 | 0.10 | 100 | 50 | 1000 |
| CBG321609U151T | 25% | 150 | 0.15 | 100 | 50 | 1000 |
| CBG321609U181T | 25% | 180 | 0.15 | 100 | 50 | 1000 |
| CBG321609U221T | 25% | 220 | 0.20 | 100 | 50 | 800 |
| CBG321609U301T | 25% | 300 | 0.20 | 100 | 50 | 800 |
| CBG321609U501T | 25% | 500 | 0.30 | 100 | 50 | 600 |
| CBG321609U601T | 25% | 600 | 0.30 | 100 | 50 | 600 |
| CBG321609U801T | 25% | 800 | 0.35 | 100 | 50 | 600 |
| CBG321609U102T | 25% | 1000 | 0.35 | 100 | 50 | 600 |
| CBG321609U122T | 25% | 1200 | 0.60 | 100 | 50 | 300 |
| CBG321609U152T | 25% | 1500 | 0.60 | 50 | 50 | 300 |
| CBG321609U182T | 25% | 1800 | 0.80 | 50 | 50 | 100 |
| CBG321609U202T | 25% | 2000 | 1.00 | 50 | 50 | 100 |
| CBG321609U252T | 25% | 2500 | 1.20 | 50 | 50 | 50 |
| CBG321609U302T | 25% | 3000 | 1.50 | 50 | 50 | 50 |
Dimensions
| Size | L (mm) | W (mm) | T (mm) | A (mm) |
| 321609 (1206) | 3.20.20 | 1.60.20 | 0.90.20 | 0.50.3 |
Reliability Testing Items
| No. | Items | Requirements | Test Methods and Remarks |
| 1 | Operating Temperature Range | -55+125 | Includes product surface temperature rise |
| 2 | Solder ability | At least 95% of terminal electrode should be covered with solder | Preheating temperature:120 to 150; Preheating time: 60s; Solder: 96.5%Sn/3.0%Ag/0.5%Cu; Solder temperature: 2455; Immersion tin depth:10mm; Duration : 51s; Dip performance to a flux of about:3 ~ 5 s |
| 3 | Resistance to Soldering | At least 95% of terminal electrode should be covered with solder. No mechanical damage. Impedance change: within 30% | Preheating temperature: 120 to 150; Preheating time: 60s; Solder: 96.5%Sn/3.0%Ag/0.5%Cu; Solder temperature: 2605; Immersion tin depth:10mm; Duration : 101s; Dip performance to a flux of about:3 ~ 5 s |
| 4 | Adhesion of electrode | The termination and body should be no damage. | Applied force: 10N force for 3216 series. Keep time 101S |
| 5 | Low temperature | No mechanical damage. Impedance change: within 30% | Temperature:-552; Testing time:1000 24 0 h |
| 6 | Bending strength | No mechanical damage | Testing board: glass epoxy-resin substrate; For 0.5 mm/s compression speed, curvature: 2mm, hold time 20s1s |
| 7 | Vibration | No mechanical damage. Impedance change: within 30% | Amplitude modulation: 1.5mm; Test time: A period of 2h in each of 3 mutually perpendicular directions. Frequency range: 10Hz to 55Hz to 10Hz for 1min. |
| 8 | High temperature | No mechanical damage. Impedance change: within 30% | Testing time: 1000 24 0 h; Temperature: 1252 |
| 9 | Static Humidity | No mechanical damage. Impedance change: within 30% | Humidity: 90% to 95% RH; Temperature: 602; Testing time: 1000 24 0 h |
| 10 | High temperature load | No mechanical damage. Impedance change: within 30% | Impose current: rated current; Testing time: 1000 24 0 h; Temperature: 852 |
| 11 | Temperature Shock | No mechanical damage. Impedance change: within 30% | Temperature: -55 for 303min +125 for 303min; Number of cycles: 100 |
Packaging
| Size | REEL | BOX | CASE |
| 321609 | 4000 | 40000 | 240000 |
Recommended Soldering Conditions
Reflow Soldering: Products can be applied to reflow soldering. Pre-heating should be in such a way that the temperature difference between solder and ferrite surface is limited to 150 max. Cooling into solvent after soldering should be limited to 100 max. Products should be soldered within the allowable range indicated by the reflow soldering profile curve.
Iron Soldering: Soldering Iron Temperature: 350 (Max); Power: 30W (Max); Soldering Time: < 5S (Take care not to apply the tip of the soldering iron to the terminal electrodes).
Cleaning Conditions
Cleaning Temperature: 60 max; Cleaning Time: 1 minute min.; Ultrasonic Output Power: 200W max.
Storage Requirements
Storage Period: Product can be used within 1 year from the factory inspection date. The inspection number can be confirmed by the marking on the outer packaging.
2510270951_FH-CBG321609U000T_C94305.pdf
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