Product Overview
The CBG321609U Series are multilayer chip ferrite beads designed for noise suppression. They offer a wide range of impedance values and current ratings, suitable for various electronic applications.
Product Attributes
- Brand: Not specified
- Origin: Not specified
- Material: Ferrite (Ni-Cu-Zn system), Silver (Ag), Ni/Sn plating
- Color: Not specified
- Certifications: Not specified
Technical Specifications
| Part NO. | Tolerance | Impedance () | RDC ()max | Test Frequency (MHz) | Test Voltage (mV) | Rated Current (mA)max |
| CBG321609U000T | 015 | 0 | 0.05 | 100 | 50 | 2200 |
| CBG321609U050T | 015 | 5 | 0.05 | 100 | 50 | 2200 |
| CBG321609U070T | 011 | 7 | 0.05 | 100 | 50 | 2200 |
| CBG321609U090T | 513 | 9 | 0.05 | 100 | 50 | 2000 |
| CBG321609U110T | 715 | 11 | 0.05 | 100 | 50 | 2000 |
| CBG321609U150T | 921 | 15 | 0.05 | 100 | 50 | 2000 |
| CBG321609U190T | 1225 | 19 | 0.05 | 100 | 50 | 2000 |
| CBG321609U260T | 25% | 26 | 0.05 | 100 | 50 | 2000 |
| CBG321609U310T | 25% | 31 | 0.05 | 100 | 50 | 2000 |
| CBG321609U600T | 25% | 60 | 0.10 | 100 | 50 | 1000 |
| CBG321609U700T | 25% | 70 | 0.10 | 100 | 50 | 1000 |
| CBG321609U800T | 25% | 80 | 0.10 | 100 | 50 | 1000 |
| CBG321609U101T | 25% | 100 | 0.10 | 100 | 50 | 1000 |
| CBG321609U121T | 25% | 120 | 0.10 | 100 | 50 | 1000 |
| CBG321609U151T | 25% | 150 | 0.15 | 100 | 50 | 1000 |
| CBG321609U181T | 25% | 180 | 0.15 | 100 | 50 | 1000 |
| CBG321609U221T | 25% | 220 | 0.20 | 100 | 50 | 800 |
| CBG321609U301T | 25% | 300 | 0.20 | 100 | 50 | 800 |
| CBG321609U501T | 25% | 500 | 0.30 | 100 | 50 | 600 |
| CBG321609U601T | 25% | 600 | 0.30 | 100 | 50 | 600 |
| CBG321609U801T | 25% | 800 | 0.35 | 100 | 50 | 600 |
| CBG321609U102T | 25% | 1000 | 0.35 | 100 | 50 | 600 |
| CBG321609U122T | 25% | 1200 | 0.60 | 100 | 50 | 300 |
| CBG321609U152T | 25% | 1500 | 0.60 | 50 | 50 | 300 |
| CBG321609U182T | 25% | 1800 | 0.80 | 50 | 50 | 100 |
| CBG321609U202T | 25% | 2000 | 1.00 | 50 | 50 | 100 |
| CBG321609U252T | 25% | 2500 | 1.20 | 50 | 50 | 50 |
| CBG321609U302T | 25% | 3000 | 1.50 | 50 | 50 | 50 |
Dimensions
| Size | L (mm) | W (mm) | T (mm) | a (mm) |
| 321609 (1206) | 3.20.20 | 1.60.20 | 0.90.20 | 0.50.3 |
Reliability Testing Items
| No. | Items | Requirements | Test Methods and Remarks |
| 1 | Operating Temperature Range | -55+125 | Includes product surface temperature rise |
| 2 | Solder ability | At least 95% of terminal electrode should be covered with solder | Preheating temperature:120 to 150; Preheating time: 60s; Solder: 96.5%Sn/3.0%Ag/0.5%Cu; Solder temperature: 2455; Immersion tin depth:10mm; Duration: 51s; Dip performance to a flux of about:3 ~ 5 s |
| 3 | Resistance to Soldering | At least 95% of terminal electrode should be covered with solder. No mechanical damage. Impedance change: within 30% | Preheating temperature: 120 to 150; Preheating time: 60s; Solder: 96.5%Sn/3.0%Ag/0.5%Cu; Solder temperature: 2605; Immersion tin depth:10mm; Duration: 101s; Dip performance to a flux of about:3 ~ 5 s |
| 4 | Adhesion of electrode | The termination and body should be no damage. | Applied force: 10N force for 3216 series. Keep time: 101S |
| 5 | Low temperature | No mechanical damage. Impedance change: within 30% | Temperature:-552; Testing time: 1000 +24 -0 h |
| 6 | Bending strength | No mechanical damage. | Testing board: glass epoxy-resin substrate; For 0.5 mm/s compression speed, curvature: 2mm, hold time 20s1s |
| 7 | Vibration | No mechanical damage. Impedance change: within 30% | Amplitude modulation: 1.5mm; Test time: A period of 2h in each of 3 mutually perpendicular directions. Frequency range: 10Hz to 55Hz to 10Hz for 1min. |
| 8 | High temperature | No mechanical damage. Impedance change: within 30% | Testing time: 1000 +24 -0 h; Temperature: 1252 |
| 9 | Static Humidity | No mechanical damage. Impedance change: within 30% | Humidity: 90% to 95% RH; Temperature: 602; Testing time: 1000 +24 -0 h |
| 10 | High temperature load | No mechanical damage. Impedance change: within 30% | Impose current: rated current; Testing time: 1000 +24 -0 h; Temperature: 852 |
| 11 | Temperature Shock | No mechanical damage. Impedance change: within 30% | Temperature: -55 for 303min +125 for 303min; Number of cycles: 100 |
Packaging
| Size | REEL | BOX | CASE |
| 321609 | 4000 | 40000 | 240000 |
Recommended Soldering Conditions
Products are suitable for reflow soldering.
- Pre-heating should be in such a way that the temperature difference between solder and ferrite surface is limited to 150 max. Also cooling into solvent after soldering should be in such way that the temperature difference is limited to 100 max. Un-enough pre-heating may cause cracks on the ferrite, resulting in the deterioration of product quality.
- Products should be soldered within the allowable range indicated by the slanted line in the reflow soldering profile. The excessive soldering conditions may cause the corrosion of the electrode. When soldering is repeated, allowable time is the accumulated time.
- Manual soldering: Soldering iron temperature: 350 (Max); Power: 30W (Max); Soldering Time: < 5S (Take care not to apply the tip of the soldering iron to the terminal electrodes).
Cleaning Conditions
- Cleaning temperature: 60 max
- Cleaning time: 1 minute min.
- Ultrasonic output power: 200W max
Storage Requirements
Products can be used within 1 year from the factory inspection date. The inspection date can be confirmed by the inspection number marked on the outside of the packaging.
2510270951_FH-CBG321609U800T_C159736.pdf
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