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quality Multilayer chip ferrite beads FH CBG321609U800T with nickel copper zinc ferrite material and plating factory
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quality Multilayer chip ferrite beads FH CBG321609U800T with nickel copper zinc ferrite material and plating factory
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Specifications
Current Rating:
400mA
Number of Circuits:
1
DC Resistance(DCR):
350mΩ
Tolerance:
±25%
Impedance @ Frequency:
80Ω@100MHz
Mfr. Part #:
CBG321609U800T
Package:
1206
Key Attributes
Model Number: CBG321609U800T
Product Description

Product Overview

The CBG321609U Series are multilayer chip ferrite beads designed for noise suppression. They offer a wide range of impedance values and current ratings, suitable for various electronic applications.

Product Attributes

  • Brand: Not specified
  • Origin: Not specified
  • Material: Ferrite (Ni-Cu-Zn system), Silver (Ag), Ni/Sn plating
  • Color: Not specified
  • Certifications: Not specified

Technical Specifications

Part NO.ToleranceImpedance ()RDC ()maxTest Frequency (MHz)Test Voltage (mV)Rated Current (mA)max
CBG321609U000T01500.05100502200
CBG321609U050T01550.05100502200
CBG321609U070T01170.05100502200
CBG321609U090T51390.05100502000
CBG321609U110T715110.05100502000
CBG321609U150T921150.05100502000
CBG321609U190T1225190.05100502000
CBG321609U260T25%260.05100502000
CBG321609U310T25%310.05100502000
CBG321609U600T25%600.10100501000
CBG321609U700T25%700.10100501000
CBG321609U800T25%800.10100501000
CBG321609U101T25%1000.10100501000
CBG321609U121T25%1200.10100501000
CBG321609U151T25%1500.15100501000
CBG321609U181T25%1800.15100501000
CBG321609U221T25%2200.2010050800
CBG321609U301T25%3000.2010050800
CBG321609U501T25%5000.3010050600
CBG321609U601T25%6000.3010050600
CBG321609U801T25%8000.3510050600
CBG321609U102T25%10000.3510050600
CBG321609U122T25%12000.6010050300
CBG321609U152T25%15000.605050300
CBG321609U182T25%18000.805050100
CBG321609U202T25%20001.005050100
CBG321609U252T25%25001.20505050
CBG321609U302T25%30001.50505050

Dimensions

SizeL (mm)W (mm)T (mm)a (mm)
321609 (1206)3.20.201.60.200.90.200.50.3

Reliability Testing Items

No.ItemsRequirementsTest Methods and Remarks
1Operating Temperature Range-55+125Includes product surface temperature rise
2Solder abilityAt least 95% of terminal electrode should be covered with solderPreheating temperature:120 to 150; Preheating time: 60s; Solder: 96.5%Sn/3.0%Ag/0.5%Cu; Solder temperature: 2455; Immersion tin depth:10mm; Duration: 51s; Dip performance to a flux of about:3 ~ 5 s
3Resistance to SolderingAt least 95% of terminal electrode should be covered with solder. No mechanical damage. Impedance change: within 30%Preheating temperature: 120 to 150; Preheating time: 60s; Solder: 96.5%Sn/3.0%Ag/0.5%Cu; Solder temperature: 2605; Immersion tin depth:10mm; Duration: 101s; Dip performance to a flux of about:3 ~ 5 s
4Adhesion of electrodeThe termination and body should be no damage.Applied force: 10N force for 3216 series. Keep time: 101S
5Low temperatureNo mechanical damage. Impedance change: within 30%Temperature:-552; Testing time: 1000 +24 -0 h
6Bending strengthNo mechanical damage.Testing board: glass epoxy-resin substrate; For 0.5 mm/s compression speed, curvature: 2mm, hold time 20s1s
7VibrationNo mechanical damage. Impedance change: within 30%Amplitude modulation: 1.5mm; Test time: A period of 2h in each of 3 mutually perpendicular directions. Frequency range: 10Hz to 55Hz to 10Hz for 1min.
8High temperatureNo mechanical damage. Impedance change: within 30%Testing time: 1000 +24 -0 h; Temperature: 1252
9Static HumidityNo mechanical damage. Impedance change: within 30%Humidity: 90% to 95% RH; Temperature: 602; Testing time: 1000 +24 -0 h
10High temperature loadNo mechanical damage. Impedance change: within 30%Impose current: rated current; Testing time: 1000 +24 -0 h; Temperature: 852
11Temperature ShockNo mechanical damage. Impedance change: within 30%Temperature: -55 for 303min +125 for 303min; Number of cycles: 100

Packaging

SizeREELBOXCASE
321609400040000240000

Recommended Soldering Conditions

Products are suitable for reflow soldering.

  • Pre-heating should be in such a way that the temperature difference between solder and ferrite surface is limited to 150 max. Also cooling into solvent after soldering should be in such way that the temperature difference is limited to 100 max. Un-enough pre-heating may cause cracks on the ferrite, resulting in the deterioration of product quality.
  • Products should be soldered within the allowable range indicated by the slanted line in the reflow soldering profile. The excessive soldering conditions may cause the corrosion of the electrode. When soldering is repeated, allowable time is the accumulated time.
  • Manual soldering: Soldering iron temperature: 350 (Max); Power: 30W (Max); Soldering Time: < 5S (Take care not to apply the tip of the soldering iron to the terminal electrodes).

Cleaning Conditions

  • Cleaning temperature: 60 max
  • Cleaning time: 1 minute min.
  • Ultrasonic output power: 200W max

Storage Requirements

Products can be used within 1 year from the factory inspection date. The inspection date can be confirmed by the inspection number marked on the outside of the packaging.


2510270951_FH-CBG321609U800T_C159736.pdf

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