Approval Sheet
Customer Name:
Part Name: Chip Ferrite Beads
Specification: CBG321609U Series
Version No.: 23.01
Date: 2023-9-8
Resume
| Version No. | Modify Details | Date |
|---|---|---|
| 18.01 | Initial issue | 2018-5-21 |
| 20.01 | Modified the bending strength test method and requirements of reliability test items. | 2020-5-28 |
| 21.01 | Modified the reliability test item of bending strength test method, changed the temperature cycling items into temperature shocking. Deleted the drop test item. | 2021-5-6 |
| 21.02 | Modified the working temperature range of reliability test items, modified the temperature conditions of low temperature/high temperature/temperature impact test. Added the usage instructions of rated current derating | 2021-11-8 |
| 22.01 | Modified the electrical characteristics; modified the storage period. | 2022-3-28 |
| 23.01 | Added the spectrum graphs | 2023-9-8 |
Table of Contents
- Dimension & Inner-configuration
- Product Spec. Model
- Electrical Characteristics List
- Reliability Testing Items
- Packaging
- Recommend Soldering Conditions
- Cleaning
- Storage Requirements
- Usage Of ODS
- Notes
1. Dimension & Inner-configuration
Unit: mm (inch)
| No. | Component | Material | Size (LWT) | Tolerance (L) | Tolerance (W) | Tolerance (T) | Tolerance (E) |
|---|---|---|---|---|---|---|---|
| 1 | Body | Ferrite (Ni-Cu-Zn system) | 321609 (1206) | 0.20 (0.008) | 0.20 (0.008) | 0.20 (0.008) | 0.3 (0.012) |
| 2 | Inner electrode | Pure Silver (Ag) | |||||
| 3 | Terminal electrode | Silver layer (Ag layer) + Ni/Sn plating |
2. Product Spec. Model
Product Type: CBG: Chip Ferrite Beads
Material Code: U
Dimensions: (LWT) (3.21.60.9mm)
Packaging: Tape & Reel: T
Model Structure: CBG 321609 U [Impedance] [Tolerance]
Tolerance Range Notes:
- 000T, 050T: 0-15
- 070T: 0-11
- 090T: 5-13
- 110T: 7-15
- 150T: 9-21
- 190T: 12-25
- 260T-302T: 25%
3. Electrical Characteristics List
| Part NO. | Tolerance | Impedance () | RDC ()max | Test frequency (MHz) | Test voltage (mV) | Rated current (mA)max |
|---|---|---|---|---|---|---|
| CBG321609U000T | 015 | 0 | 0.05 | 100 | 50 | 2200 |
| CBG321609U050T | 015 | 5 | 0.05 | 100 | 50 | 2200 |
| CBG321609U070T | 011 | 7 | 0.05 | 100 | 50 | 2200 |
| CBG321609U090T | 513 | 9 | 0.05 | 100 | 50 | 2000 |
| CBG321609U110T | 715 | 11 | 0.05 | 100 | 50 | 2000 |
| CBG321609U150T | 921 | 15 | 0.05 | 100 | 50 | 2000 |
| CBG321609U190T | 1225 | 19 | 0.05 | 100 | 50 | 2000 |
| CBG321609U260T | 25% | 26 | 0.05 | 100 | 50 | 2000 |
| CBG321609U310T | 25% | 31 | 0.05 | 100 | 50 | 2000 |
| CBG321609U600T | 25% | 60 | 0.10 | 100 | 50 | 1000 |
| CBG321609U700T | 25% | 70 | 0.10 | 100 | 50 | 1000 |
| CBG321609U800T | 25% | 80 | 0.10 | 100 | 50 | 1000 |
| CBG321609U101T | 25% | 100 | 0.10 | 100 | 50 | 1000 |
| CBG321609U121T | 25% | 120 | 0.10 | 100 | 50 | 1000 |
| CBG321609U151T | 25% | 150 | 0.15 | 100 | 50 | 1000 |
| CBG321609U181T | 25% | 180 | 0.15 | 100 | 50 | 1000 |
| CBG321609U221T | 25% | 220 | 0.20 | 100 | 50 | 800 |
| CBG321609U301T | 25% | 300 | 0.20 | 100 | 50 | 800 |
| CBG321609U501T | 25% | 500 | 0.30 | 100 | 50 | 600 |
| CBG321609U601T | 25% | 600 | 0.30 | 100 | 50 | 600 |
| CBG321609U801T | 25% | 800 | 0.35 | 100 | 50 | 600 |
| CBG321609U102T | 25% | 1000 | 0.35 | 100 | 50 | 600 |
| CBG321609U122T | 25% | 1200 | 0.60 | 100 | 50 | 300 |
| CBG321609U152T | 25% | 1500 | 0.60 | 50 | 50 | 300 |
| CBG321609U182T | 25% | 1800 | 0.80 | 50 | 50 | 100 |
| CBG321609U202T | 25% | 2000 | 1.00 | 50 | 50 | 100 |
| CBG321609U252T | 25% | 2500 | 1.20 | 50 | 50 | 50 |
| CBG321609U302T | 25% | 3000 | 1.50 | 50 | 50 | 50 |
Note: When operating temperatures exceed +85, derating of current is necessary for chip ferrite beads with rated current of 1A and over. Please apply the derating curve shown in the chart according to the operating temperature.
4. Reliability Testing Items
| No. | Items | Requirements | Test Methods and Remarks |
|---|---|---|---|
| 1 | Operating Temperature Range | -55+125 | Includes product surface temperature rise |
| 2 | Solder ability | At least 95% of terminal electrode should be covered with solder | Preheating temperature: 120 to 150; Preheating time: 60s; Solder: 96.5%Sn/3.0%Ag/0.5%Cu; Solder temperature: 2455; Immersion tin depth: 10mm; Duration: 51s; Dip performance to a flux of about: 3 ~ 5 s |
| 3 | Resistance to Soldering | At least 95% of terminal electrode should be covered with solder. No mechanical damage. Impedance change: within 30% | Preheating temperature: 120 to 150; Preheating time: 60s; Solder: 96.5%Sn/3.0%Ag/0.5%Cu; Solder temperature: 2605; Immersion tin depth: 10mm; Duration: 101s; Dip performance to a flux of about: 3 ~ 5 s |
| 4 | Adhesion of electrode | The termination and body should be no damage. | Applied force: 10N for 3216 series. Keep time: 101S |
| 5 | Low temperature | No mechanical damage. Impedance change: within 30% | Temperature: -552; Testing time: 1000+24-0 h |
| 6 | Bending strength | No mechanical damage. | Testing board: glass epoxy-resin substrate; For 0.5 mm/s compression speed, curvature: 2mm, hold time 20s1s |
| 7 | Vibration | No mechanical damage. Impedance change: within 30% | Amplitude modulation: 1.5mm; Test time: A period of 2h in each of 3 mutually perpendicular directions. Frequency range: 10Hz to 55Hz to 10Hz for 1min. |
| 8 | High temperature | No mechanical damage. Impedance change: within 30% | Testing time: 1000+24-0 h; Temperature: 1252 |
| 9 | Static Humidity | No mechanical damage. Impedance change: within 30% | Humidity: 90% to 95% RH; Temperature: 602; Testing time: 1000+24-0 h |
| 10 | High temperature load | No mechanical damage. Impedance change: within 30% | Impose current: rated current; Testing time: 1000+24-0 h; Temperature: 852 |
| 11 | Temperature Shock | No mechanical damage. Impedance change: within 30% | Temperature: -55 for 303min +125 for 303min; Number of cycles: 100 |
Note: When there are questions concerning, measurement shall be made after 242hrs of recovery under the standard condition.
5. Packaging
Packaging Number (Unit: Pcs):
| Size | Quantity per REEL | Quantity per BOX | Quantity per CASE |
|---|---|---|---|
| 321609 | 4000 | 40000 | 240000 |
6. Recommend Soldering Conditions
Soldering Conditions: Products can be applied to reflow soldering.
Reflow soldering profile: (Refer to the provided chart in the source document)
Iron soldering:
- Soldering Temperature: 350 (Max)
- Power: 30W (Max)
- Soldering Time: < 5S (Take care not to apply the tip of the soldering iron to the terminal electrodes)
Note: Pre-heating should be in such a way that the temperature difference between solder and ferrite surface is limited to 150 max. Also cooling into solvent after soldering should be in such a way that the temperature difference is limited to 100 max. Un-enough pre-heating may cause cracks on the ferrite, resulting in the deterioration of product quality. Products should be soldered within the allowable range indicated by the slanted line. The excessive soldering conditions may cause the corrosion of the electrode. When soldering is repeated, allowable time is the accumulated time.
7. Cleaning
Cleaning Conditions:
- Cleaning temperature: 60 (max)
- Cleaning time: 1 minute (min)
- Ultrasonic output power: 200W (max)
8. Storage Requirements
Storage period: Products can be used within 1 year from the factory inspection date. The inspection date can be confirmed by the inspection number marked on the outside of the packaging.
2510270951_FH-CBG321609U102T_C361667.pdf
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