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Specifications
Current Rating:
-
Number of Circuits:
1
DC Resistance(DCR):
-
Tolerance:
±25%
Impedance @ Frequency:
120Ω@100MHz
Mfr. Part #:
CBM100505U121T
Package:
0402
Key Attributes
Model Number:
CBM100505U121T
Product Description
Multilayer Chip Ferrite Ultra-High Current Beads
These multilayer chip ferrite beads offer high impedance and effective EMI/RFI suppression over a wide frequency range, suitable for various electronic equipment. Their chip design allows for simple PCB mounting and compatibility with SMT equipment for automatic placement. They are designed for noise suppression in power lines or extra-large current signal lines of communication equipment, computers, and LCD TVs.
Product Attributes
- Product Code: CBM
- Material: Ferrite
- Packaging Styles: Tape & Reel (T), Bulk (B)
Technical Specifications
| Part Number | Dimensions (LWT mm) | Impedance () | Packaging Style | DC Resistance ()Max | Rated Current (mA)Max |
| CBM060303X220T | 0.60.30.3 | 22 | T | 0.040 | 1800 |
| CBM060303X330T | 0.60.30.3 | 33 | T | 0.055 | 1500 |
| CBM060303X800T | 0.60.30.3 | 80 | T | 0.130 | 1000 |
| CBM060303X121T | 0.60.30.3 | 120 | T | 0.160 | 900 |
| CBM100505U000T | 1.00.50.5 | 0 | T | 0.02 | 2000 |
| CBM100505U050T | 1.00.50.5 | 5 | T | 0.02 | 2000 |
| CBM100505U101T | 1.00.50.5 | 100 | T | 0.15 | 1000 |
| CBM100505U102T | 1.00.50.5 | 1000 | T | 0.65 | 300 |
| CBM160808U000T | 1.60.80.8 | 0 | T | 0.01 | 6000 |
| CBM160808U050T | 1.60.80.8 | 5 | T | 0.01 | 6000 |
| CBM160808U101T | 1.60.80.8 | 100 | T | 0.06 | 2500 |
| CBM160808U102T | 1.60.80.8 | 1000 | T | 0.35 | 700 |
| CBM201209U000T | 2.01.20.9 | 0 | T | 0.01 | 6000 |
| CBM201209U050T | 2.01.20.9 | 5 | T | 0.01 | 6000 |
| CBM201209U101T | 2.01.20.9 | 100 | T | 0.045 | 4000 |
| CBM201209U102T | 2.01.20.9 | 1000 | T | 0.12 | 1500 |
| CBM321609U000T | 3.21.60.9 | 0 | T | 0.01 | 6000 |
| CBM321609U050T | 3.21.60.9 | 5 | T | 0.01 | 6000 |
| CBM321609U101T | 3.21.60.9 | 100 | T | 0.035 | 4000 |
| CBM321609U102T | 3.21.60.9 | 1000 | T | 0.12 | 2100 |
| CBM322513U110T | 3.22.51.3 | 11 | T | 0.02 | 6000 |
| CBM322513U150T | 3.22.51.3 | 15 | T | 0.02 | 6000 |
| CBM322513U121T | 3.22.51.3 | 120 | T | 0.03 | 5000 |
| CBM322513U102T | 3.22.51.3 | 1000 | T | 0.23 | 2500 |
| CBM451616U190T | 4.51.61.6 | 19 | T | 0.009 | 6000 |
| CBM451616U260T | 4.51.61.6 | 26 | T | 0.009 | 6000 |
| CBM451616U800T | 4.51.61.6 | 80 | T | 0.025 | 3000 |
| CBM453215U190T | 4.53.21.5 | 19 | T | 0.01 | 6000 |
| CBM453215U260T | 4.53.21.5 | 26 | T | 0.01 | 6000 |
| CBM453215U500T | 4.53.21.5 | 50 | T | 0.01 | 6000 |
| CBM453215U101T | 4.53.21.5 | 100 | T | 0.02 | 6000 |
| CBM453215U501T | 4.53.21.5 | 500 | T | 0.08 | 4000 |
Reliability Test Method
| No. | Items | Requirements | Test Methods and Remarks |
| 1 | Operating Temperature Range | -55+125 | Includes product surface temperature rise |
| 2 | Solder ability | No visible damage; 95% or more of electrode area shall be coated by new solder. | Preheating temperature:120~150, Preheating time: 60s, Solder: (96.5%Sn/3.0%Ag/0.5%Cu), Solder temperature: 2455, Immersion tin depth:10mm, Duration: 51s, Dip performance to a flux of about:3 ~ 5 s |
| 3 | Resistance to Soldering Heat | At least 95% of terminal electrode should be covered with solder. No mechanical damage. Impedance change: within 30% | Preheating temperature: 120~150, Preheating time: 60s, Solder: (96.5%Sn/3.0%Ag/0.5%Cu), Solder temperature: 2605, Immersion tin depth:10mm, Duration: 101s, Dip performance to a flux of about:35 s |
| 4 | Adhesion of electrode | The termination and body should be no damage. | Applied force: 5N for 1005 series; 7N for 1608 series; 10N for 2012, 3216 series; 15N for 3225, 4532 series. Keep time: 101S |
| 5 | Low temperature resistance | No mechanical damage. Impedance change: within 30%. | Temperature:-552, Testing time: 10000 +24 h |
| 6 | Bending strength | No mechanical damage | Testing board: glass epoxy-resin substrate, Forcing speed: 0.5mm/s, Deflection: 2mm, Duration: 20s1s |
2411251503_FH-CBM100505U121T_C316452.pdf
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