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quality Compact 3216 Size Noise Suppression Chip Ferrite Beads FH CBG321609U122T with Ni Sn Plating factory
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quality Compact 3216 Size Noise Suppression Chip Ferrite Beads FH CBG321609U122T with Ni Sn Plating factory
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Specifications
Current Rating:
1A
DC Resistance(DCR):
250mΩ
Tolerance:
±25%
Impedance @ Frequency:
1.2kΩ@100MHz
Mfr. Part #:
CBG321609U122T
Package:
1206
Key Attributes
Model Number: CBG321609U122T
Product Description

Product Overview

The CBG321609U Series Chip Ferrite Beads are designed for noise suppression. They offer excellent performance in a compact 3216 (1206) size with Ni/Sn plating.

Product Attributes

  • Brand: Not specified
  • Origin: Not specified
  • Material: Ferrite (Ni-Cu-Zn system), Silver (Ag), Ni/Sn plating
  • Color: Not specified
  • Certifications: Not specified

Technical Specifications

Part NO.Nominal Impedance (Ω)DC Resistance (RDC) (Ω) maxTest Frequency (MHz)Test Voltage (mV)Rated Current (mA) maxTolerance
CBG321609U000T00.05100502200015Ω
CBG321609U050T50.05100502200015Ω
CBG321609U070T70.05100502200011Ω
CBG321609U090T90.05100502000513Ω
CBG321609U110T110.05100502000715Ω
CBG321609U150T150.05100502000921Ω
CBG321609U190T190.051005020001225Ω
CBG321609U260T260.05100502000±25%
CBG321609U310T310.05100502000±25%
CBG321609U600T600.10100501000±25%
CBG321609U700T700.10100501000±25%
CBG321609U800T800.10100501000±25%
CBG321609U101T1000.10100501000±25%
CBG321609U121T1200.10100501000±25%
CBG321609U151T1500.15100501000±25%
CBG321609U181T1800.15100501000±25%
CBG321609U221T2200.2010050800±25%
CBG321609U301T3000.2010050800±25%
CBG321609U501T5000.3010050600±25%
CBG321609U601T6000.3010050600±25%
CBG321609U801T8000.3510050600±25%
CBG321609U102T10000.3510050600±25%
CBG321609U122T12000.6010050300±25%
CBG321609U152T15000.605050300±25%
CBG321609U182T18000.805050100±25%
CBG321609U202T20001.005050100±25%
CBG321609U252T25001.20505050±25%
CBG321609U302T30001.50505050±25%

Reliability Testing Items

No.ItemsRequirementsTest Methods and Remarks
1Operating Temperature Range-55+125Includes product surface temperature rise
2Solder abilityAt least 95% of terminal electrode should be covered with solderPreheating temperature:120 to 150 Preheating time: 60s Solder 96.5%Sn/3.0%Ag/0.5%Cu of the Sn solder. Solder temperature: 245±5 Immersion tin depth:10mm Duration : 5±1s Dip performance to a flux of about:3 ~ 5 s
3Resistance to SolderingAt least 95% of terminal electrode should be covered with solder. No mechanical damage. Impedance change: within ±30%Preheating temperature: 120 to 150 Preheating time: 60s Solder 96.5%Sn/3.0%Ag/0.5%Cu of the Sn solder. Solder temperature: 260±5 Immersion tin depth:10mm Duration : 10±1s Dip performance to a flux of about:3 ~ 5 s
4Adhesion of electrodeThe termination and body should be no damage.Applied force: 10N force for 3216 series. Keep time :10±1S
5Low temperatureNo mechanical damage. Impedance change: within ±30%Temperature:-55±2 Testing time:1000 24 0 h
6Bending strengthNo mechanical damageTesting board: glass epoxy-resin substrate For 0.5 mm/s compression speed, curvature: 2mm, hold time 20s±1s
7VibrationNo mechanical damage. Impedance change: within ±30%Amplitude modulation: 1.5mm Test time: A period of 2h in each of 3 mutually perpendicular directions. Frequency range: 10Hz to 55Hz to 10Hz for 1min.
8High temperatureNo mechanical damage. Impedance change: within ±30%Testing time: 1000 24 0 h Temperature: 125±2
9Static HumidityNo mechanical damage. Impedance change: within ±30%Humidity: 90% to 95% RH Temperature: 60±2 Testing time: 1000 24 0 h
10High temperature loadNo mechanical damage. Impedance change: within ±30%impose current: at room Testing time: 1000 24 0 h Temperature: 85±2
11Temperature ShockNo mechanical damage. Impedance change: within ±30%Temperature: -55 for 30±3min +125 for 30±3min Number of cycles: 100

Storage Requirements

Storage period: Within 1 year from the factory inspection date. Product can be used. The inspection number on the outer packaging can confirm the inspection time.


2510270951_FH-CBG321609U122T_C668238.pdf

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