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Specifications
Current Rating:
50mA
DC Resistance(DCR):
50mΩ
Impedance @ Frequency:
5Ω@100MHz
Mfr. Part #:
CBG160808U050T
Package:
0603
Key Attributes
Model Number:
CBG160808U050T
Product Description
Product Overview
The CBG160808U Series Chip Ferrite Beads are designed for noise suppression. They are manufactured with a ferrite or ceramic body and feature Ni/Sn plating on terminal electrodes. These components are suitable for various electronic applications requiring effective filtering.
Product Attributes
- Brand: Inductor Company (implied)
- Material: Ferrite (Ni-Cu-Zn system), Silver (Ag), Ni/Sn plating
- Color: Not specified
- Certifications: Not specified
Technical Specifications
| Part NO. | Impedance () | Tolerance | RDC ()max | Test Frequency (MHz) | Test Voltage (mV) | Rated Current (mA)max | Dimensions (LWT mm) |
| CBG160808U000T | 0 | 015 | 0.05 | 100 | 50 | 2000 | 1.60.80.8 |
| CBG160808U050T | 5 | 015 | 0.05 | 100 | 50 | 2000 | 1.60.80.8 |
| CBG160808U070T | 7 | 011 | 0.05 | 100 | 50 | 2000 | 1.60.80.8 |
| CBG160808U090T | 9 | 513 | 0.05 | 100 | 50 | 2000 | 1.60.80.8 |
| CBG160808U110T | 11 | 715 | 0.05 | 100 | 50 | 2000 | 1.60.80.8 |
| CBG160808U150T | 15 | 921 | 0.05 | 100 | 50 | 2000 | 1.60.80.8 |
| CBG160808U190T | 19 | 1225 | 0.05 | 100 | 50 | 2000 | 1.60.80.8 |
| CBG160808U260T | 26 | 25% | 0.05 | 100 | 50 | 2000 | 1.60.80.8 |
| CBG160808U310T | 31 | 25% | 0.05 | 100 | 50 | 1000 | 1.60.80.8 |
| CBG160808U600T | 60 | 25% | 0.15 | 100 | 50 | 400 | 1.60.80.8 |
| CBG160808U700T | 70 | 25% | 0.15 | 100 | 50 | 400 | 1.60.80.8 |
| CBG160808U800T | 80 | 25% | 0.15 | 100 | 50 | 400 | 1.60.80.8 |
| CBG160808U101T | 100 | 25% | 0.20 | 100 | 50 | 300 | 1.60.80.8 |
| CBG160808U121T | 120 | 25% | 0.20 | 100 | 50 | 300 | 1.60.80.8 |
| CBG160808U151T | 150 | 25% | 0.20 | 100 | 50 | 300 | 1.60.80.8 |
| CBG160808U181T | 180 | 25% | 0.30 | 100 | 50 | 300 | 1.60.80.8 |
| CBG160808U221T | 220 | 25% | 0.30 | 100 | 50 | 300 | 1.60.80.8 |
| CBG160808U301T | 300 | 25% | 0.35 | 100 | 50 | 200 | 1.60.80.8 |
| CBG160808U501T | 500 | 25% | 0.45 | 100 | 50 | 200 | 1.60.80.8 |
| CBG160808U601T | 600 | 25% | 0.45 | 100 | 50 | 200 | 1.60.80.8 |
| CBG160808U801T | 800 | 25% | 0.60 | 100 | 50 | 200 | 1.60.80.8 |
| CBG160808U102T | 1000 | 25% | 0.60 | 100 | 50 | 200 | 1.60.80.8 |
| CBG160808U122T | 1200 | 25% | 0.70 | 100 | 50 | 200 | 1.60.80.8 |
| CBG160808U152T | 1500 | 25% | 0.70 | 100 | 50 | 200 | 1.60.80.8 |
| CBG160808U182T | 1800 | 25% | 0.90 | 100 | 50 | 150 | 1.60.80.8 |
| CBG160808U202T | 2000 | 25% | 1.10 | 100 | 50 | 150 | 1.60.80.8 |
| CBG160808U222T | 2200 | 25% | 1.20 | 100 | 50 | 100 | 1.60.80.8 |
| CBG160808U252T | 2500 | 25% | 1.30 | 100 | 50 | 50 | 1.60.80.8 |
Reliability Testing Items
| No. | Items | Requirements | Test Methods and Remarks |
| 1 | Operating Temperature Range | -55+125 | Includes product surface temperature rise |
| 2 | Solder ability | At least 95% of terminal electrode should be covered with solder | Preheating temperature:120 to 150 Preheating time: 60s Solder 96.5%Sn/3.0%Ag/0.5%Cu of the Sn solder. Solder temperature: 2455 Immersion tin depth:10mm Duration : 51s Dip performance to a flux of about:3 ~ 5 s |
| 3 | Resistance to Soldering Heat | At least 95% of terminal electrode should be covered with solder. No mechanical damage. Impedance change: within 30% | Preheating temperature: 120 to 150 Preheating time: 60s Solder 96.5%Sn/3.0%Ag/0.5%Cu of the Sn solder. Solder temperature: 2605 Immersion tin depth:10mm Duration : 101s Dip performance to a flux of about:3 ~ 5 s |
| 4 | Adhesion of electrode | The termination and body should be no damage. | Applied force: 7N force for 1608 series. Keep time 101S |
| 5 | Low temperature resistance | No mechanical damage. Impedance change: within 30% | Temperature:-552 Testing time:1000 24 0 h |
| 6 | Bending strength | No mechanical damage. | Testing board: glass epoxy-resin substrate For 0.5 mm/s compression speed, curvature: 2mm, hold time 20s1s |
| 7 | Vibration | No mechanical damage. Impedance change: within 30% | Amplitude modulation: 1.5mm Test time: A period of 2h in each of 3 mutually perpendicular directions. Frequency range: 10Hz to 55Hz to 10Hz for 1min. |
| 8 | High temperature resistance | No mechanical damage. Impedance change: within 30% | Testing time: 1000 24 0 h Temperature: 1252 |
| 9 | Static Humidity | No mechanical damage. Impedance change: within 30% | Humidity: 90% to 95% RH Temperature: 602 Testing time: 1000 24 0 h |
| 10 | High temperature load | No mechanical damage. Impedance change: within 30% | Impose current: at room Temperature: 852 Testing time: 1000 24 0 h |
| 11 | Temperature Shock | No mechanical damage. Impedance change: within 30% | Temperature: -55 for 303min +125 for 303min Number of cycles: 100 |
Product Packaging
Taping Drawings: See source document for visual representation.
Reel Dimensions (Unit: mm):
| Size | A | B | C | N | G |
| CF-8 | 1782.0 | 22.02.0 | 12.51.5 | 572.0 | 8 |
Leader and blank portion: See source document for visual representation.
Taping Dimensions (Unit: mm): See source document for visual representation of Paper tape.
Peeling off force:
- Cover tape peeling force: 0.1N0.7N (pulling in the direction of arrow).
- Speed of peeling off: 300mm/min.
- The cover tape should not be damaged and should not bond the paper tape when peeled off.
Packaging number (Unit: Pcs):
| Size | 160808 REEL | BOX | CASE |
| Quantity | 4000 | 40000 | 240000 |
Label stick station: See source document for visual representation of Reel label, Carton label, and Outer box label.
Recommended Soldering Conditions
Products are suitable for reflow soldering.
Soldering conditions:
- The temperature difference between the product surface and the solder temperature should not exceed 150 during preheating. The temperature difference between the product surface and the solvent temperature should not exceed 100 during cooling after soldering. Insufficient preheating may cause cracks on the product surface, leading to deterioration of product quality.
- Products should be soldered within the allowable range indicated by the curve in the source document. Excessive soldering conditions may cause corrosion of the electrode. When soldering is repeated, the allowable time is the accumulated time.
Reflow soldering profile:
See source document for visual representation.
Iron soldering:
- Soldering iron temperature: 350 max
- Power: 30W max
- Soldering iron dwell time: < 5S (Take care not to apply the tip of the soldering iron to the terminal electrodes)
Cleaning
Cleaning Conditions:
- Cleaning temperature: 60 max
- Cleaning time: 1 minute min.
- Ultrasonic output power: 200W max
Storage Requirements
Storage period:
Products inspected over 1 year ago from the inductor company's factory inspection date should be examined and used. The inspection date can be confirmed by the inspection number marked on the outside of the packaging. If the time exceeds 1 year, the soldering performance should be checked before use.
2410121311_FH-CBG160808U050T_C962234.pdf
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