Product Approval Sheet
Customer: [Customer Name Not Specified]
Product Name: Multilayer Chip Ferrite Large Current Beads
Product Specification: CBW201209U470T
Version No.: 21.01
Date: 2021-7-19
Product Overview
The CBW201209U470T is a multilayer chip ferrite large current bead designed for effective noise suppression. It features a compact 2012 size (2.0x1.2x0.9mm) and is constructed with a Ni-Cu-Zn ferrite body, pure silver inner electrodes, and silver/Ni/Sn plating for terminal electrodes. This component is suitable for various electronic applications requiring efficient impedance characteristics.
Product Attributes
- Brand: [Brand Not Specified]
- Material: Ni-Cu-Zn Ferrite, Silver, Ni/Sn Plating
- Color: Not Specified
- Certifications: RoHS (implied for "Unitary lead free" products)
Technical Specifications
| Part No. | Size (L x W x T) | Impedance () @ 100MHz | Tolerance (%) | RDC () max | Rated Current (mA) max | Test Voltage (mV) |
|---|---|---|---|---|---|---|
| CBW201209U470T | 2.00.20 x 1.20.20 x 0.90.20 mm | 47 | 25 | 0.06 | 3000 | 50 |
Reliability Testing Items
| Item | Requirements | Test Methods and Remarks |
|---|---|---|
| Operating Temperature Range | -40+85 | |
| Solder ability | At least 95% of terminal electrode should be covered with solder | Preheating temperature: 120 to 150; Preheating time: 60s; Solder: 96.5%Sn/3.0%Ag/0.5%Cu; Solder temperature: 2455; Immersion tin depth: 10mm; Duration: 51s; Dip performance to a flux of about: 3 ~ 5 s |
| Resistance to Soldering Heat | At least 95% of terminal electrode should be covered with solder. No mechanical damage. Impedance change: within 30% | Preheating temperature: 120 to 150; Preheating time: 60s; Solder: 96.5%Sn/3.0%Ag/0.5%Cu; Solder temperature: 2605; Immersion tin depth: 10mm; Duration: 101s; Dip performance to a flux of about: 3 ~ 5 s |
| Adhesion of electrode | The termination and body should be no damage. | Applied force: 10N for 2012 series. Keep time: 101S |
| Low temperature resistance | No mechanical damage. Impedance change: within 30% | Temperature: -402; Testing time: 1000 +24/-0 h |
| Bending strength | No mechanical damage. | Testing board: glass epoxy-resin substrate; For 0.5 mm/s compression speed, curvature: 2mm, hold time 20s1s |
| Vibration | No mechanical damage. Impedance change: within 30% | Amplitude: 1.5mm; Test time: 2h in each of 3 mutually perpendicular directions. Frequency range: 10Hz to 55Hz to 10Hz for 1min. |
| High temperature resistance | No mechanical damage. Impedance change: within 30% | Testing time: 1000 +24/-0 h; Temperature: 852 |
| Static Humidity | No mechanical damage. Impedance change: within 30% | Humidity: 90% to 95% RH; Temperature: 602; Testing time: 1000 +24/-0 h |
| High temperature load | No mechanical damage. Impedance change: within 30% | Impose current: rated current; Testing time: 1000 +24/-0 h; Temperature: 852 |
| Temperature Shock | No mechanical damage. Impedance change: within 30% | Temperature: -40 for 303min +85 for 303min; Number of cycles: 32 |
Product Packaging
Taping Drawings: [Refer to image in source document]
Reel Dimensions: [Refer to table in source document]
Taping Dimensions: [Refer to table in source document]
Peeling off force: Cover tape peeling force: 0.1N0.7N; Speed of peeling off: 300mm/min.
Packaging Quantity:
- 201209 Size: 4000 Pcs/Reel, 40000 Pcs/Box, 240000 Pcs/Case
Label Stick Station: [Refer to diagrams in source document]
Recommended Soldering Conditions
Reflow Soldering: Products can be applied to reflow soldering. Temperature difference between solder and ferrite surface should be limited to 150 max during pre-heating. Temperature difference between product surface and solvent after soldering should be limited to 100 max. Ensure soldering within the allowable range indicated by the curve.
Iron Soldering: Soldering iron temperature: 350 (Max), Power: 30W (Max), Soldering Time: < 5S. Avoid applying the soldering iron tip to the terminal electrodes.
Cleaning
Cleaning Conditions: Cleaning temperature: 60 (max); Cleaning time: 1 minute (min); Ultrasonic output power: 200W (max).
Storage Requirements
Storage Period: Within 6 months from the factory inspection date. If exceeded, check solder ability before use.
Storage Conditions:
- Warehouse temperature: -10 to +40, relative humidity: 30% to 70%.
- Do not store in corrosive substances (sulfur, chlorine gas, acid).
- Store on a palette to prevent influence from humidity and dust.
- Avoid heat shock, vibration, and direct sunlight.
- Products should be stored under airtight packaged condition.
Usage Of ODS (Ozone Depleting Substances)
The company does not use ODS such as CCl4 (carbon tetrachloride) and HCFC in the production process.
Notes
- If the product is labeled "Unitary lead free", it complies with RoHS directive requirements.
- This specification guarantees the quality of the product as a single unit. Ensure your product has been evaluated and confirmed against your specifications when our product is mounted.
- The company cannot warrant against failure caused by any use of our product that deviates from the intended use as described in this product specification.
2511261006_FH-CBW201209U470T_C394488.pdf
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