<
>
Specifications
Current Rating:
1A
Number of Circuits:
1
DC Resistance(DCR):
150mΩ
Tolerance:
±25%
Impedance @ Frequency:
120Ω@100MHz
Mfr. Part #:
CBG321609U121T
Package:
1206
Key Attributes
Model Number:
CBG321609U121T
Product Description
Product Approval Sheet
Customer: [Customer Name]
Part Name: Chip Ferrite Beads
Specification: CBG321609U Series
Version No.: 23.01
Date: 2023-9-8
Product Overview
The CBG321609U Series are multilayer chip ferrite beads designed for EMI suppression. They offer a wide range of impedance values and current ratings, suitable for various electronic applications. The product features a ceramic body with inner and terminal electrodes, plated with Ni/Sn for good solderability.
Product Attributes
- Brand: Not specified
- Origin: Not specified
- Material: Ferrite (Ni-Cu-Zn system), Silver (Ag), Ni/Sn plating
- Color: Not specified
- Certifications: Not specified
Technical Specifications
| Part NO. | Size (LWT mm) | Tolerance | Impedance () | RDC ()max | Rated Current (mA)max |
|---|---|---|---|---|---|
| CBG321609U000T | 3.21.60.9 | 015 | 0 | 0.05 | 2200 |
| CBG321609U050T | 3.21.60.9 | 015 | 5 | 0.05 | 2200 |
| CBG321609U070T | 3.21.60.9 | 011 | 7 | 0.05 | 2200 |
| CBG321609U090T | 3.21.60.9 | 513 | 9 | 0.05 | 2000 |
| CBG321609U110T | 3.21.60.9 | 715 | 11 | 0.05 | 2000 |
| CBG321609U150T | 3.21.60.9 | 921 | 15 | 0.05 | 2000 |
| CBG321609U190T | 3.21.60.9 | 1225 | 19 | 0.05 | 2000 |
| CBG321609U260T | 3.21.60.9 | 25% | 26 | 0.05 | 2000 |
| CBG321609U310T | 3.21.60.9 | 25% | 31 | 0.05 | 2000 |
| CBG321609U600T | 3.21.60.9 | 25% | 60 | 0.10 | 1000 |
| CBG321609U700T | 3.21.60.9 | 25% | 70 | 0.10 | 1000 |
| CBG321609U800T | 3.21.60.9 | 25% | 80 | 0.10 | 1000 |
| CBG321609U101T | 3.21.60.9 | 25% | 100 | 0.10 | 1000 |
| CBG321609U121T | 3.21.60.9 | 25% | 120 | 0.10 | 1000 |
| CBG321609U151T | 3.21.60.9 | 25% | 150 | 0.15 | 1000 |
| CBG321609U181T | 3.21.60.9 | 25% | 180 | 0.15 | 1000 |
| CBG321609U221T | 3.21.60.9 | 25% | 220 | 0.20 | 800 |
| CBG321609U301T | 3.21.60.9 | 25% | 300 | 0.20 | 800 |
| CBG321609U501T | 3.21.60.9 | 25% | 500 | 0.30 | 600 |
| CBG321609U601T | 3.21.60.9 | 25% | 600 | 0.30 | 600 |
| CBG321609U801T | 3.21.60.9 | 25% | 800 | 0.35 | 600 |
| CBG321609U102T | 3.21.60.9 | 25% | 1000 | 0.35 | 600 |
| CBG321609U122T | 3.21.60.9 | 25% | 1200 | 0.60 | 300 |
| CBG321609U152T | 3.21.60.9 | 25% | 1500 | 0.60 | 300 |
| CBG321609U182T | 3.21.60.9 | 25% | 1800 | 0.80 | 100 |
| CBG321609U202T | 3.21.60.9 | 25% | 2000 | 1.00 | 100 |
| CBG321609U252T | 3.21.60.9 | 25% | 2500 | 1.20 | 50 |
| CBG321609U302T | 3.21.60.9 | 25% | 3000 | 1.50 | 50 |
Reliability Testing Items
| No. | Items | Requirements | Test Methods and Remarks |
|---|---|---|---|
| 1 | Operating Temperature Range | -55+125 | Includes product surface temperature rise |
| 2 | Solder ability | At least 95% of terminal electrode should be covered with solder | Preheating temperature:120 to 150; Preheating time: 60s; Solder: 96.5%Sn/3.0%Ag/0.5%Cu; Solder temperature: 2455; Immersion tin depth:10mm; Duration : 51s |
| 3 | Resistance to Soldering | At least 95% of terminal electrode should be covered with solder. No mechanical damage. Impedance change: within 30% | Preheating temperature: 120 to 150; Preheating time: 60s; Solder: 96.5%Sn/3.0%Ag/0.5%Cu; Solder temperature: 2605; Immersion tin depth:10mm; Duration : 101s |
| 4 | Adhesion of electrode | The termination and body should be no damage. | Applied force: 10N force for 3216 series. Keep time 101S |
| 5 | Low temperature | No mechanical damage. Impedance change: within 30% | Temperature:-552; Testing time:1000 +240/-0 h |
| 6 | Bending strength | No mechanical damage | Testing board: glass epoxy-resin substrate; For 0.5 mm/s compression speed, curvature: 2mm, hold time 20s1s |
| 7 | Vibration | No mechanical damage. Impedance change: within 30% | Amplitude modulation: 1.5mm; Test time: A period of 2h in each of 3 mutually perpendicular directions. Frequency range: 10Hz to 55Hz to 10Hz for 1min. |
| 8 | High temperature | No mechanical damage. Impedance change: within 30% | Testing time: 1000 +240/-0 h; Temperature: 1252 |
| 9 | Static Humidity | No mechanical damage. Impedance change: within 30% | Humidity: 90% to 95% RH; Temperature: 602; Testing time: 1000 +240/-0 h |
| 10 | High temperature load | No mechanical damage. Impedance change: within 30% | Impose current: rated current; Testing time: 1000 +240/-0 h; Temperature: 852 |
| 11 | Temperature Shock | No mechanical damage. Impedance change: within 30% | Temperature: -55 for 303min +125 for 303min; Number of cycles: 100 |
Packaging
Packaging quantity (Unit: Pcs):
| Size | Quantity per REEL | Quantity per BOX | Quantity per CASE |
|---|---|---|---|
| 321609 | 4000 | 40000 | 240000 |
Recommended Soldering Conditions
Soldering Conditions: Products can be applied to reflow soldering.
Reflow soldering profile: [Profile details not provided in text]
Iron soldering:
- Soldering temperature: 350 (Max)
- Power: 30W (Max)
- Soldering Time: < 5S (Take care not to apply the tip of the soldering iron to the terminal electrodes)
Cleaning
Cleaning Conditions:
- Cleaning temperature: 60 (max)
- Cleaning time: 1 minute (min.)
- Ultrasonic output power: 200W (max)
Storage Requirements
Storage period: Products can be used within 1 year from the factory inspection date. The inspection date can be confirmed by the inspection number marked on the outside of the package.
2510270951_FH-CBG321609U121T_C39279.pdf
Request A Quote
Please Use Our Online Inquiry Contact Form Below If You Have Any Questions, Our Team Will Get Back To You As Soon As Possible
