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Specifications
Current Rating:
800mA
Number of Circuits:
1
DC Resistance(DCR):
200mΩ
Tolerance:
±25%
Impedance @ Frequency:
150Ω@100MHz
Mfr. Part #:
CBG321609U151T
Package:
1206
Key Attributes
Model Number:
CBG321609U151T
Product Description
Approval Sheet
Customer Name: Customer
Part Name: Chip Ferrite Beads
Specification: CBG321609U Series
Version No.: 23.01
Date: 2023-9-8
Product Overview
The CBG321609U Series Chip Ferrite Beads are designed for high-frequency noise suppression. They feature a multilayer ceramic body with inner electrodes and terminal electrodes plated with Ni/Sn. These components are suitable for various electronic applications requiring effective filtering of unwanted signals.
Product Attributes
- Brand: Not specified
- Origin: Not specified
- Material: Ferrite (Ni-Cu-Zn system), Silver (Ag), Ni/Sn plating
- Color: Not specified
- Certifications: Not specified
Technical Specifications
| Part NO. | Impedance () | Tolerance | RDC ()max | Test frequency (MHz) | Test voltage (mV) | Rated current (mA)max | Dimensions (LWT mm) |
| CBG321609U000T | 0 | 015 | 0.05 | 100 | 50 | 2200 | 3.20.201.60.200.90.20 |
| CBG321609U050T | 5 | 015 | 0.05 | 100 | 50 | 2200 | 3.20.201.60.200.90.20 |
| CBG321609U070T | 7 | 011 | 0.05 | 100 | 50 | 2200 | 3.20.201.60.200.90.20 |
| CBG321609U090T | 9 | 513 | 0.05 | 100 | 50 | 2000 | 3.20.201.60.200.90.20 |
| CBG321609U110T | 11 | 715 | 0.05 | 100 | 50 | 2000 | 3.20.201.60.200.90.20 |
| CBG321609U150T | 15 | 921 | 0.05 | 100 | 50 | 2000 | 3.20.201.60.200.90.20 |
| CBG321609U190T | 19 | 1225 | 0.05 | 100 | 50 | 2000 | 3.20.201.60.200.90.20 |
| CBG321609U260T | 26 | 25% | 0.05 | 100 | 50 | 2000 | 3.20.201.60.200.90.20 |
| CBG321609U310T | 31 | 25% | 0.05 | 100 | 50 | 2000 | 3.20.201.60.200.90.20 |
| CBG321609U600T | 60 | 25% | 0.10 | 100 | 50 | 1000 | 3.20.201.60.200.90.20 |
| CBG321609U700T | 70 | 25% | 0.10 | 100 | 50 | 1000 | 3.20.201.60.200.90.20 |
| CBG321609U800T | 80 | 25% | 0.10 | 100 | 50 | 1000 | 3.20.201.60.200.90.20 |
| CBG321609U101T | 100 | 25% | 0.10 | 100 | 50 | 1000 | 3.20.201.60.200.90.20 |
| CBG321609U121T | 120 | 25% | 0.10 | 100 | 50 | 1000 | 3.20.201.60.200.90.20 |
| CBG321609U151T | 150 | 25% | 0.15 | 100 | 50 | 1000 | 3.20.201.60.200.90.20 |
| CBG321609U181T | 180 | 25% | 0.15 | 100 | 50 | 1000 | 3.20.201.60.200.90.20 |
| CBG321609U221T | 220 | 25% | 0.20 | 100 | 50 | 800 | 3.20.201.60.200.90.20 |
| CBG321609U301T | 300 | 25% | 0.20 | 100 | 50 | 800 | 3.20.201.60.200.90.20 |
| CBG321609U501T | 500 | 25% | 0.30 | 100 | 50 | 600 | 3.20.201.60.200.90.20 |
| CBG321609U601T | 600 | 25% | 0.30 | 100 | 50 | 600 | 3.20.201.60.200.90.20 |
| CBG321609U801T | 800 | 25% | 0.35 | 100 | 50 | 600 | 3.20.201.60.200.90.20 |
| CBG321609U102T | 1000 | 25% | 0.35 | 100 | 50 | 600 | 3.20.201.60.200.90.20 |
| CBG321609U122T | 1200 | 25% | 0.60 | 100 | 50 | 300 | 3.20.201.60.200.90.20 |
| CBG321609U152T | 1500 | 25% | 0.60 | 50 | 50 | 300 | 3.20.201.60.200.90.20 |
| CBG321609U182T | 1800 | 25% | 0.80 | 50 | 50 | 100 | 3.20.201.60.200.90.20 |
| CBG321609U202T | 2000 | 25% | 1.00 | 50 | 50 | 100 | 3.20.201.60.200.90.20 |
| CBG321609U252T | 2500 | 25% | 1.20 | 50 | 50 | 50 | 3.20.201.60.200.90.20 |
| CBG321609U302T | 3000 | 25% | 1.50 | 50 | 50 | 50 | 3.20.201.60.200.90.20 |
Reliability Testing Items
| Item | Requirements | Test Methods and Remarks |
| Operating Temperature Range | -55+125 | Includes product surface temperature rise |
| Solder ability | At least 95% of terminal electrode should be covered with solder | Preheating temperature:120 to 150; Preheating time: 60s; Solder: 96.5%Sn/3.0%Ag/0.5%Cu; Solder temperature: 2455; Immersion tin depth:10mm; Duration: 51s |
| Resistance to Soldering | At least 95% of terminal electrode should be covered with solder. No mechanical damage. Impedance change: within 30% | Preheating temperature: 120 to 150; Preheating time: 60s; Solder: 96.5%Sn/3.0%Ag/0.5%Cu; Solder temperature: 2605; Immersion tin depth:10mm; Duration: 101s |
| Adhesion of electrode | The termination and body should be no damage. | Applied force: 10N force for 3216 series. Keep time: 101S |
| Low temperature | No mechanical damage. Impedance change: within 30% | Temperature: -552; Testing time: 1000+240/-0 h |
| Bending strength | No mechanical damage. | Testing board: glass epoxy-resin substrate; For 0.5 mm/s compression speed, curvature: 2mm, hold time 20s1s |
| Vibration | No mechanical damage. Impedance change: within 30% | Amplitude modulation: 1.5mm; Test time: A period of 2h in each of 3 mutually perpendicular directions. Frequency range: 10Hz to 55Hz to 10Hz for 1min. |
| High temperature | No mechanical damage. Impedance change: within 30% | Testing time: 1000+240/-0 h; Temperature: 1252 |
| Static Humidity | No mechanical damage. Impedance change: within 30% | Humidity: 90% to 95% RH; Temperature: 602; Testing time: 1000+240/-0 h |
| High temperature load | No mechanical damage. Impedance change: within 30% | Impose current: rated current; Testing time: 1000+240/-0 h; Temperature: 852 |
| Temperature Shock | No mechanical damage. Impedance change: within 30% | Temperature: -55 for 303min +125 for 303min; Number of cycles: 100 |
Product Packaging
| Item | Details |
| Taping drawings | Available |
| Reel dimensions (Unit: mm) | Size: CF-8; A: 1782.0; B: 22.02.0; C: 12.51.5; N: 572.0; G: 8 |
| Taping dimensions (Unit: mm) | Paper tape |
| Peeling off force | Cover tape peeling force: 0.1N0.7N; Peeling speed: 300mm/min. Cover bond should not be damaged. |
| Packaging number (Unit: Pcs) | 321609: 4000 per REEL, 40000 per BOX, 240000 per CASE |
Recommended Soldering Conditions
Suitable for reflow soldering. Ensure temperature differences during pre-heating and cooling are within limits to prevent product damage. Manual soldering: Iron temperature: 350 (Max), Power: 30W (Max), Soldering time: < 5S.
Cleaning
Cleaning temperature: 60 (max); Cleaning time: 1 minute (min.); Ultrasonic output power: 200W (max).
Storage Requirements
Product can be used within 1 year from the factory inspection date. Inspection number can be found on the outer packaging.
2510270951_FH-CBG321609U151T_C74484.pdf
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