Product Overview
The CBG321609U Series Chip Ferrite Beads are designed for noise suppression. These components are manufactured using a nickel-copper-zinc ferrite system with pure silver inner electrodes and silver/Ni-Sn plating terminal electrodes. They are available in various impedance values and are suitable for reflow soldering.
Product Attributes
- Brand: Not specified
- Origin: Not specified
- Material: Ferrite (Ni-Cu-Zn system), Silver (Ag), Nickel/Tin (Ni/Sn) plating
- Color: Not specified
- Certifications: Not specified
Technical Specifications
| Part NO. | Impedance () | Tolerance | RDC ()max | Test Frequency (MHz) | Test Voltage (mV) | Rated Current (mA)max |
| CBG321609U000T | 0 | 015 | 0.05 | 100 | 50 | 2200 |
| CBG321609U050T | 5 | 015 | 0.05 | 100 | 50 | 2200 |
| CBG321609U070T | 7 | 011 | 0.05 | 100 | 50 | 2200 |
| CBG321609U090T | 9 | 513 | 0.05 | 100 | 50 | 2000 |
| CBG321609U110T | 11 | 715 | 0.05 | 100 | 50 | 2000 |
| CBG321609U150T | 15 | 921 | 0.05 | 100 | 50 | 2000 |
| CBG321609U190T | 19 | 1225 | 0.05 | 100 | 50 | 2000 |
| CBG321609U260T | 26 | 25% | 0.05 | 100 | 50 | 2000 |
| CBG321609U310T | 31 | 25% | 0.05 | 100 | 50 | 2000 |
| CBG321609U600T | 60 | 25% | 0.10 | 100 | 50 | 1000 |
| CBG321609U700T | 70 | 25% | 0.10 | 100 | 50 | 1000 |
| CBG321609U800T | 80 | 25% | 0.10 | 100 | 50 | 1000 |
| CBG321609U101T | 100 | 25% | 0.10 | 100 | 50 | 1000 |
| CBG321609U121T | 120 | 25% | 0.10 | 100 | 50 | 1000 |
| CBG321609U151T | 150 | 25% | 0.15 | 100 | 50 | 1000 |
| CBG321609U181T | 180 | 25% | 0.15 | 100 | 50 | 1000 |
| CBG321609U221T | 220 | 25% | 0.20 | 100 | 50 | 800 |
| CBG321609U301T | 300 | 25% | 0.20 | 100 | 50 | 800 |
| CBG321609U501T | 500 | 25% | 0.30 | 100 | 50 | 600 |
| CBG321609U601T | 600 | 25% | 0.30 | 100 | 50 | 600 |
| CBG321609U801T | 800 | 25% | 0.35 | 100 | 50 | 600 |
| CBG321609U102T | 1000 | 25% | 0.35 | 100 | 50 | 600 |
| CBG321609U122T | 1200 | 25% | 0.60 | 100 | 50 | 300 |
| CBG321609U152T | 1500 | 25% | 0.60 | 50 | 50 | 300 |
| CBG321609U182T | 1800 | 25% | 0.80 | 50 | 50 | 100 |
| CBG321609U202T | 2000 | 25% | 1.00 | 50 | 50 | 100 |
| CBG321609U252T | 2500 | 25% | 1.20 | 50 | 50 | 50 |
| CBG321609U302T | 3000 | 25% | 1.50 | 50 | 50 | 50 |
Dimensions
Size: 321609 (1206)
L: 3.20.20 mm (0.1260.008 inch)
W: 1.60.20 mm (0.0630.008 inch)
T: 0.90.20 mm (0.0350.008 inch)
Internal structure plating thickness: 0.50.3 mm (0.0200.012 inch)
Reliability Testing
| Item | Requirements | Test Methods and Remarks |
| Operating Temperature Range | -55+125 | Includes product surface temperature rise |
| Solder ability | At least 95% of terminal electrode should be covered with solder | Preheating temperature: 120 to 150; Preheating time: 60s; Solder: 96.5%Sn/3.0%Ag/0.5%Cu; Solder temperature: 2455; Immersion tin depth: 10mm; Duration: 51s |
| Resistance to Soldering Heat | At least 95% of terminal electrode should be covered with solder. No mechanical damage. Impedance change: within 30% | Preheating temperature: 120 to 150; Preheating time: 60s; Solder: 96.5%Sn/3.0%Ag/0.5%Cu; Solder temperature: 2605; Immersion tin depth: 10mm; Duration: 101s |
| Adhesion of electrode | The termination and body should be no damage. | Applied force: 10N for 3216 series. Keep time: 101S |
| Low temperature | No mechanical damage. Impedance change: within 30% | Temperature: -552; Testing time: 1000+24-0 h |
| Bending strength | No mechanical damage. | Testing board: glass epoxy-resin substrate; For 0.5 mm/s compression speed, curvature: 2mm, hold time 20s1s |
| Vibration | No mechanical damage. Impedance change: within 30% | Amplitude modulation: 1.5mm; Test time: 2h in each of 3 mutually perpendicular directions. Frequency range: 10Hz to 55Hz to 10Hz for 1min. |
| High temperature | No mechanical damage. Impedance change: within 30% | Testing time: 1000+24-0 h; Temperature: 1252 |
| Static Humidity | No mechanical damage. Impedance change: within 30% | Humidity: 90% to 95% RH; Temperature: 602; Testing time: 1000+24-0 h |
| High temperature load | No mechanical damage. Impedance change: within 30% | Impose current: rated current; Testing time: 1000+24-0 h; Temperature: 852 |
| Temperature Shock | No mechanical damage. Impedance change: within 30% | Temperature: -55 for 303min +125 for 303min; Number of cycles: 100 |
Packaging
Packaging quantity (Unit: Pcs):
321609 Size: 4000 per REEL, 40000 per BOX, 240000 per CASE.
Recommended Soldering Conditions
Products are suitable for reflow soldering.
Soldering Conditions:
- Pre-heating should be in such a way that the temperature difference between solder and ferrite surface is limited to 150 max. Cooling into solvent after soldering should be limited to 100 max.
- Products should be soldered within the allowable range indicated by the reflow soldering profile curve.
Iron soldering:
- Soldering temperature: 350 (Max)
- Power: 30W (Max)
- Soldering Time: < 5S (Take care not to apply the tip of the soldering iron to the terminal electrodes).
Cleaning
Cleaning Conditions:
- Cleaning temperature: 60 max
- Cleaning time: 1 minute min.
- Ultrasonic output power: 200W max
Storage Requirements
Storage period:
Products can be used within 1 year from the factory inspection date. The inspection date can be confirmed by the inspection number marked on the outside of the packaging.
2510270951_FH-CBG321609U302T_C668241.pdf
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