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Specifications
Mfr. Part #:
CBU160808X221T
Key Attributes
Model Number:
CBU160808X221T
Product Description
Product Overview
Multilayer Chip Ferrite Ultra-High Current Beads (CBU series) are designed for miniature volume applications requiring low DC resistance and large current ratings. They offer low magnetic leakage, preventing cross-coupling between inductors and ensuring high reliability. Leadless and suitable for high-density SMT, these beads boast excellent solderability and resistance to thermal shock, making them ideal for reflow soldering. They are used for noise suppression in power lines or extra-large current signal lines of electrical equipment such as communication equipment, computers, and LCD TVs.
Product Attributes
- Brand: Not specified
- Origin: Not specified
- Material: Ferrite
- Color: Not specified
- Certifications: Not specified
Technical Specifications
| Part Number | Dimensions (mm) (LWT) | Impedance () at 100MHz | DCR () Max | Rated Current (mA) Max |
| CBU100505X100T | 1.00.50.5 | 10 | 0.018 | 3100 |
| CBU100505X330T | 1.00.50.5 | 33 | 0.022 | 3000 |
| CBU100505X600T | 1.00.50.5 | 60 | 0.032 | 2500 |
| CBU100505X800T | 1.00.50.5 | 80 | 0.038 | 2300 |
| CBU100505X121T | 1.00.50.5 | 120 | 0.050 | 2000 |
| CBU100505X181T | 1.00.50.5 | 180 | 0.085 | 1600 |
| CBU100505X221T | 1.00.50.5 | 220 | 0.095 | 1500 |
| CBU100505X331T | 1.00.50.5 | 330 | 0.150 | 1200 |
| CBU100505X471T | 1.00.50.5 | 470 | 0.200 | 1000 |
| CBU100505X601T | 1.00.50.5 | 600 | 0.230 | 900 |
| CBU160808X220T | 1.60.80.8 | 22 | 0.010 | 6000 |
| CBU160808X300T | 1.60.80.8 | 30 | 0.010 | 5000 |
| CBU160808X700T | 1.60.80.8 | 70 | 0.020 | 4000 |
| CBU160808X101T | 1.60.80.8 | 100 | 0.030 | 3000 |
| CBU160808X121T | 1.60.80.8 | 120 | 0.025 | 3000 |
| CBU160808X221T | 1.60.80.8 | 220 | 0.040 | 2500 |
| CBU160808X331T | 1.60.80.8 | 330 | 0.070 | 1700 |
| CBU160808X471T | 1.60.80.8 | 470 | 0.120 | 1500 |
| CBU160808X601T | 1.60.80.8 | 600 | 0.150 | 1300 |
| CBU160808X102T | 1.60.80.8 | 1000 | 0.200 | 1000 |
| CBU160808U600T | 1.60.80.8 | 60 | 0.025 | 3500 |
| CBU160808U800T | 1.60.80.8 | 80 | 0.025 | 3500 |
| CBU160808U101T | 1.60.80.8 | 100 | 0.040 | 3000 |
| CBU160808U121T | 1.60.80.8 | 120 | 0.040 | 2000 |
| CBU160808U181T | 1.60.80.8 | 180 | 0.070 | 2000 |
| CBU160808U221T | 1.60.80.8 | 220 | 0.090 | 2000 |
| CBU160808U301T | 1.60.80.8 | 300 | 0.150 | 2000 |
| CBU160808U501T | 1.60.80.8 | 500 | 0.150 | 1500 |
| CBU160808U601T | 1.60.80.8 | 600 | 0.150 | 1500 |
| CBU160808U801T | 1.60.80.8 | 800 | 0.200 | 1200 |
| CBU160808U102T | 1.60.80.8 | 1000 | 0.300 | 1000 |
| CBU201209U800T | 2.01.20.9 | 80 | 0.025 | 3500 |
| CBU201209U101T | 2.01.20.9 | 100 | 0.025 | 3500 |
| CBU201209U151T | 2.01.20.9 | 150 | 0.050 | 3000 |
| CBU201209U181T | 2.01.20.9 | 180 | 0.050 | 3000 |
| CBU201209U221T | 2.01.20.9 | 220 | 0.050 | 3000 |
| CBU201209U301T | 2.01.20.9 | 300 | 0.050 | 3000 |
| CBU201209U501T | 2.01.20.9 | 500 | 0.090 | 2500 |
| CBU201209U601T | 2.01.20.9 | 600 | 0.090 | 2500 |
| CBU201209U102T | 2.01.20.9 | 1000 | 0.110 | 2000 |
| CBU201209U122T | 2.01.20.9 | 1200 | 0.180 | 1000 |
Reliability Test Methods
| No. | Items | Requirements | Test Methods and Remarks |
| 1 | Operating Temperature Range | -55+125 | Includes product surface temperature rise |
| 2 | Solder ability | No mechanical damage. 95% or more of electrode area shall be coated by new solder. | Preheating temperature:120 ~ 150, Preheating time: 60s, Solder: (96.5%Sn/3.0%Ag/0.5%Cu) solder, Solder temperature: 2453, Immersion tin depth:10mm, Duration : 30.3s, Dip performance to a flux of about:3 ~ 5 s |
| 3 | Resistance to Soldering Heat | No mechanical damage. Impedance change: within 30%. | Preheating temperature: 120~150, Preheating time: 60s, Solder: (96.5%Sn/3.0%Ag/0.5%Cu) solder, Solder temperature: 2605, Immersion tin depth:10mm, Duration : 101s, Dip performance to a flux of about:35 s |
| 4 | Adhesion of electrode | The termination and body should be no damage. | Applied force: 5N for 1005 series7N for 1608 series10N for 2012 series. Keep time 101S |
| 5 | Low temperature resistance | No mechanical damage. Impedance change: within 30%. | Temperature:-552, Testing time: 10000 +24 h |
| 6 | Bending strength | No mechanical damage | Testing board: glass epoxy-resin substrate, For 10.5 mm/s compression speed, curvature: 2mm, hold time20s1s |
| 7 | Vibration | No mechanical damage. Impedance change: within 30%. | Amplitude modulation: 1.5mm, Test time: A period of 2h in each of 3 mutually perpendicular directions. Frequency range: 10Hz to 55Hz to 10Hz for 1min. |
| 8 | High temperature resistance | No mechanical damage. Impedance change: within 30%. | Testing time: 10000 +24 h, Temperature: 1252 |
| 9 | Static Humidity | No mechanical damage. Impedance change: within 30%. | Humidity: 90% to 95% RH, Temperature: 602, Testing time: 10000 +24 h |
| 10 | High temperature load | No mechanical damage. Impedance change: within 30%. | Impose current: at rated current, Testing time: 10000 +24 h, Temperature: 852 |
| 11 | Temperature Shock | No mechanical damage. Impedance change: within 30%. | Temperature: -55 for 303min +125 for 303min, Number of cycles: 100 |
Packaging
Packaging Quantity:
- 201209: 4000 pcs/REEL, 40000 pcs/BOX, 240000 pcs/CASE
- 160808: 4000 pcs/REEL, 40000 pcs/BOX, 240000 pcs/CASE
- 100505: 10000 pcs/REEL, 100000 pcs/BOX, 600000 pcs/CASE
Recommended Soldering Conditions
Reflow Soldering Profile:
- PREHEAT CONDITION: 150 ~ 200/ 60 ~ 120 SEC
- ALLOWED TIME ABOVE 217: 60~90 SEC
- MAX TEMP: 260
- MAX TIME AT MAX TEMP: 10 SEC
- SOLDER PASTE: SN/3.0AG/0.5CU
- ALLOWED REFLOW TIME: 2X MAX
Hand Soldering:
- Soldering iron temperature: 350 (30W max)
- Time: < 5S (Take care not to apply the tip of the soldering iron to the terminal electrodes)
2510091757_FH-CBU160808X221T_C44345089.pdf
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