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quality Multilayer Chip Ferrite Ultra High Current Beads FH CBM321609U601T Effective EMI RFI Noise Filtering factory
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quality Multilayer Chip Ferrite Ultra High Current Beads FH CBM321609U601T Effective EMI RFI Noise Filtering factory
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Specifications
Current Rating:
2.2A
Number of Circuits:
1
DC Resistance(DCR):
85mΩ
Tolerance:
±25%
Impedance @ Frequency:
600Ω@100MHz
Mfr. Part #:
CBM321609U601T
Package:
1206
Key Attributes
Model Number: CBM321609U601T
Product Description

Multilayer Chip Ferrite Ultra-High Current Beads

These multilayer chip ferrite beads are designed for high impedance and effective EMI/RFI suppression over a wide frequency range. Their unique terminal electrode structure allows for a maximum current of 6.0A. Unlike traditional beads, these chip components are leadless and can be easily mounted on PCBs using SMT equipment, making them suitable for reflow and wave soldering. They are ideal for noise suppression in power lines or extra-large current signal lines of electrical equipment such as communication devices, computers, and LCD TVs.

Product Attributes

  • Product Code: CBM
  • Product Type: Multilayer Chip Ferrite Ultra-High Current Beads
  • Packaging Styles: Tape & Reel (T), Bulk (B)

Technical Specifications

Part NumberDimensions (LWT mm)Impedance ()Packaging StyleDCR ()MaxRated Current Ir (mA)Max
CBM060303X220T0.60.30.322T0.0401800
CBM060303X330T0.60.30.333T0.0551500
CBM060303X800T0.60.30.380T0.1301000
CBM060303X121T0.60.30.3120T0.160900
CBM100505U000T1.00.50.50T0.022000
CBM100505U050T1.00.50.55T0.022000
CBM100505U101T1.00.50.5100T0.151000
CBM100505U102T1.00.50.51000T0.65300
CBM160808U000T1.60.80.80T0.016000
CBM160808U050T1.60.80.85T0.016000
CBM160808U101T1.60.80.8100T0.062500
CBM160808U102T1.60.80.81000T0.35700
CBM201209U000T2.01.20.90T0.016000
CBM201209U050T2.01.20.95T0.016000
CBM201209U101T2.01.20.9100T0.0454000
CBM201209U102T2.01.20.91000T0.121500
CBM321609U000T3.21.60.90T0.016000
CBM321609U050T3.21.60.95T0.016000
CBM321609U101T3.21.60.9100T0.0354000
CBM321609U102T3.21.60.91000T0.122100
CBM322513U110T3.22.51.311T0.026000
CBM322513U150T3.22.51.315T0.026000
CBM322513U121T3.22.51.3120T0.035000
CBM322513U102T3.22.51.31000T0.232500
CBM451616U190T4.51.61.619T0.0096000
CBM451616U260T4.51.61.626T0.0096000
CBM451616U800T4.51.61.680T0.0253000
CBM453215U190T4.53.21.519T0.016000
CBM453215U260T4.53.21.526T0.016000
CBM453215U101T4.53.21.5100T0.026000
CBM453215U501T4.53.21.5500T0.084000

Reliability Test Method

No.ItemsRequirementsTest Methods and Remarks
1Operating Temperature Range-55+125Includes product surface temperature rise
2Solder abilityNo visible damage; 95% or more of electrode area shall be coated by new solder.Preheating temperature:120~150 Preheating time: 60s Solder (96.5%Sn/3.0%Ag/0.5%Cu) Solder temperature: 2455 Immersion tin depth:10mm Duration : 51s Dip performance to a flux of about:3 ~ 5 s
3Resistance to Soldering HeatAt least 95% of terminal electrode should be covered with solder. No mechanical damage. Impedance change: within 30%Preheating temperature: 120~150 Preheating time: 60s Solder (96.5%Sn/3.0%Ag/0.5%Cu) Solder temperature: 2605 Immersion tin depth:10mm Duration : 101s Dip performance to a flux of about:35 s
4Adhesion of electrodeThe termination and body should be no damage.Applied force: 5N for 1005 series; 7N for 1608 series; 10N for 2012, 3216 series; 15N for 3225, 4532 series. Keep time:101S
5Low temperature resistanceNo mechanical damage. Impedance change: within 30%.Temperature:-552 Testing time: 10000 +24 h
6Bending strengthNo mechanical damageTesting board: glass epoxy-resin substrate. Forcing speed: 0.5mm/s, Deflection: 2mm, Duration: 20s1s

2411251503_FH-CBM321609U601T_C139170.pdf

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