Multilayer Chip Ferrite Ultra-High Current Beads
These multilayer chip ferrite beads are designed for high impedance and effective EMI/RFI suppression over a wide frequency range. Their unique terminal electrode structure allows for a maximum current of 6.0A. Unlike traditional beads, these chip components are leadless and can be easily mounted on PCBs using SMT equipment, making them suitable for reflow and wave soldering. They are ideal for noise suppression in power lines or extra-large current signal lines of electrical equipment such as communication devices, computers, and LCD TVs.
Product Attributes
- Product Code: CBM
- Product Type: Multilayer Chip Ferrite Ultra-High Current Beads
- Packaging Styles: Tape & Reel (T), Bulk (B)
Technical Specifications
| Part Number | Dimensions (LWT mm) | Impedance () | Packaging Style | DCR ()Max | Rated Current Ir (mA)Max |
| CBM060303X220T | 0.60.30.3 | 22 | T | 0.040 | 1800 |
| CBM060303X330T | 0.60.30.3 | 33 | T | 0.055 | 1500 |
| CBM060303X800T | 0.60.30.3 | 80 | T | 0.130 | 1000 |
| CBM060303X121T | 0.60.30.3 | 120 | T | 0.160 | 900 |
| CBM100505U000T | 1.00.50.5 | 0 | T | 0.02 | 2000 |
| CBM100505U050T | 1.00.50.5 | 5 | T | 0.02 | 2000 |
| CBM100505U101T | 1.00.50.5 | 100 | T | 0.15 | 1000 |
| CBM100505U102T | 1.00.50.5 | 1000 | T | 0.65 | 300 |
| CBM160808U000T | 1.60.80.8 | 0 | T | 0.01 | 6000 |
| CBM160808U050T | 1.60.80.8 | 5 | T | 0.01 | 6000 |
| CBM160808U101T | 1.60.80.8 | 100 | T | 0.06 | 2500 |
| CBM160808U102T | 1.60.80.8 | 1000 | T | 0.35 | 700 |
| CBM201209U000T | 2.01.20.9 | 0 | T | 0.01 | 6000 |
| CBM201209U050T | 2.01.20.9 | 5 | T | 0.01 | 6000 |
| CBM201209U101T | 2.01.20.9 | 100 | T | 0.045 | 4000 |
| CBM201209U102T | 2.01.20.9 | 1000 | T | 0.12 | 1500 |
| CBM321609U000T | 3.21.60.9 | 0 | T | 0.01 | 6000 |
| CBM321609U050T | 3.21.60.9 | 5 | T | 0.01 | 6000 |
| CBM321609U101T | 3.21.60.9 | 100 | T | 0.035 | 4000 |
| CBM321609U102T | 3.21.60.9 | 1000 | T | 0.12 | 2100 |
| CBM322513U110T | 3.22.51.3 | 11 | T | 0.02 | 6000 |
| CBM322513U150T | 3.22.51.3 | 15 | T | 0.02 | 6000 |
| CBM322513U121T | 3.22.51.3 | 120 | T | 0.03 | 5000 |
| CBM322513U102T | 3.22.51.3 | 1000 | T | 0.23 | 2500 |
| CBM451616U190T | 4.51.61.6 | 19 | T | 0.009 | 6000 |
| CBM451616U260T | 4.51.61.6 | 26 | T | 0.009 | 6000 |
| CBM451616U800T | 4.51.61.6 | 80 | T | 0.025 | 3000 |
| CBM453215U190T | 4.53.21.5 | 19 | T | 0.01 | 6000 |
| CBM453215U260T | 4.53.21.5 | 26 | T | 0.01 | 6000 |
| CBM453215U101T | 4.53.21.5 | 100 | T | 0.02 | 6000 |
| CBM453215U501T | 4.53.21.5 | 500 | T | 0.08 | 4000 |
Reliability Test Method
| No. | Items | Requirements | Test Methods and Remarks |
| 1 | Operating Temperature Range | -55+125 | Includes product surface temperature rise |
| 2 | Solder ability | No visible damage; 95% or more of electrode area shall be coated by new solder. | Preheating temperature:120~150 Preheating time: 60s Solder (96.5%Sn/3.0%Ag/0.5%Cu) Solder temperature: 2455 Immersion tin depth:10mm Duration : 51s Dip performance to a flux of about:3 ~ 5 s |
| 3 | Resistance to Soldering Heat | At least 95% of terminal electrode should be covered with solder. No mechanical damage. Impedance change: within 30% | Preheating temperature: 120~150 Preheating time: 60s Solder (96.5%Sn/3.0%Ag/0.5%Cu) Solder temperature: 2605 Immersion tin depth:10mm Duration : 101s Dip performance to a flux of about:35 s |
| 4 | Adhesion of electrode | The termination and body should be no damage. | Applied force: 5N for 1005 series; 7N for 1608 series; 10N for 2012, 3216 series; 15N for 3225, 4532 series. Keep time:101S |
| 5 | Low temperature resistance | No mechanical damage. Impedance change: within 30%. | Temperature:-552 Testing time: 10000 +24 h |
| 6 | Bending strength | No mechanical damage | Testing board: glass epoxy-resin substrate. Forcing speed: 0.5mm/s, Deflection: 2mm, Duration: 20s1s |
2411251503_FH-CBM321609U601T_C139170.pdf
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