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quality Magnetically Shielded Chip Common Mode Choke Coil FH CMC1206S-102T with Copper Wire and Epoxy Resin factory
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quality Magnetically Shielded Chip Common Mode Choke Coil FH CMC1206S-102T with Copper Wire and Epoxy Resin factory
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Specifications
Insulation Resistance(IR):
10MΩ
Operating Temperature:
-40℃~+85℃
DC Resistance(DCR):
Voltage Rating - DC:
50V
Number of Lines:
2
Voltage Withstand:
-
Mfr. Part #:
CMC1206S-102T
Package:
SMD-4P,3.2x1.6mm
Key Attributes
Model Number: CMC1206S-102T
Product Description

Product Overview

The Chip Common Mode Choke Coils, specifically the CMC0805S and CMC1206S Series, are wire-wound chip common mode chokes designed for various electronic applications. These magnetically shielded inductors offer reliable performance with a range of impedance values. They are manufactured using Ni-Zn ferrite cores and Ni-Zn ferrite cover plates, with copper wires and silver/nickel/tin electrodes.

Product Attributes

  • Product Type: Chip Common Mode Choke Coils
  • Series: CMC0805S, CMC1206S
  • Core Material: Ni-Zn ferrite
  • Cover Plate Material: Ni-Zn ferrite
  • Electrode Material: Silver (Ag), Nickel (Ni), Tin (Sn)
  • Wire Material: Copper (Cu)
  • Adhesive Material: Epoxy Resin
  • Design: Magnetically Shielded
  • Packaging Options: Tape & Reel (T), Bulk (B)
  • RoHS Compliance: Yes

Technical Specifications

Part Name Dimensions (L x W x T) (mm) Impedance () Test Frequency (MHz) Rdc () max Rated Voltage (Vdc) max Rated Current Idc (mA) max Insulation Resistance (M) min
CMC0805S Series
CMC0805S-670T 2.00.2 x 1.20.2 x 1.20.2 67 100 0.25 50 400 10
CMC0805S-700T 2.00.2 x 1.20.2 x 1.20.2 70 100 0.30 50 400 10
CMC0805S-750T 2.00.2 x 1.20.2 x 1.20.2 75 100 0.30 50 400 10
CMC0805S-900T 2.00.2 x 1.20.2 x 1.20.2 90 100 0.35 50 330 10
CMC0805S-121T 2.00.2 x 1.20.2 x 1.20.2 120 100 0.30 50 370 10
CMC0805S-161T 2.00.2 x 1.20.2 x 1.20.2 160 100 0.35 50 330 10
CMC0805S-181T 2.00.2 x 1.20.2 x 1.20.2 180 100 0.35 50 330 10
CMC0805S-261T 2.00.2 x 1.20.2 x 1.20.2 260 100 0.40 50 300 10
CMC0805S-301T 2.00.2 x 1.20.2 x 1.20.2 300 100 0.42 50 290 10
CMC0805S-361T 2.00.2 x 1.20.2 x 1.20.2 360 100 0.45 50 280 10
CMC0805S-371T 2.00.2 x 1.20.2 x 1.20.2 370 100 0.45 50 280 10
CMC0805S-451T 2.00.2 x 1.20.2 x 1.20.2 450 100 0.50 50 250 10
CMC0805S-601T 2.00.2 x 1.20.2 x 1.20.2 600 100 0.60 50 220 10
CMC0805S-901T 2.00.2 x 1.20.2 x 1.20.2 900 100 0.90 50 150 10
CMC1206S Series
CMC1206S-900T 3.20.2 x 1.60.2 x 1.80.2 90 100 0.30 50 370 10
CMC1206S-161T 3.20.2 x 1.60.2 x 1.80.2 160 100 0.40 50 340 10
CMC1206S-261T 3.20.2 x 1.60.2 x 1.80.2 260 100 0.50 50 310 10
CMC1206S-371T 3.20.2 x 1.60.2 x 1.80.2 370 100 0.50 50 300 10
CMC1206S-601T 3.20.2 x 1.60.2 x 1.80.2 600 100 0.80 50 260 10
CMC1206S-801T 3.20.2 x 1.60.2 x 1.80.2 800 100 0.90 50 240 10
CMC1206S-102T 3.20.2 x 1.60.2 x 1.80.2 1000 100 1.00 50 230 10
CMC1206S-142T 3.20.2 x 1.60.2 x 1.80.2 1400 100 1.00 50 220 10
CMC1206S-202T 3.20.2 x 1.60.2 x 1.80.2 2000 100 1.20 50 200 10
CMC1206S-222T 3.20.2 x 1.60.2 x 1.80.2 2200 100 1.20 50 200 10
Reliability Data
Operating Temperature Range -40~+85
Solder ability CMC series: 80% electrode surface solder coverage.
Resistance to Soldering Heat Impedance shall not change more than 20%.
Insulation Resistance CMC series: 10 M
Vibration Impedance shall not change more than 20%.
Adhesion of electrode CMC0805 Series: 5 N; CMC1206 Series: 10 N
Low temperature resistance Impedance shall not change more than 20%. (Stored at -402 for 1000h)
High Temperature resistance Impedance shall not change more than 20%. (Stored at 852 for 1000h)
Temperature Characteristic Impedance shall not change more than 20%.
Thermal Shock Impedance shall not change more than 20%. (+85 60 min -40 60 min, 32 Cycles)
High temperature load Impedance shall not change more than 20%. (Rated current applied, stored at 852 for 1000h)
Static Humidity Impedance shall not change more than 20%. (Stored at 90%95%RH at 602 for 1000h)
Bending strength No visible mechanical damage.
Solvent Resistance Impedance shall not change more than 20%.

Packaging

Part NO. Per Reel Per Box Per Case
0805 3000 9000 (3 boxes) 45000 (5 cases)
1206 2000 6000 (3 boxes) 30000 (5 cases)

Notes

  • Recommended soldering process: Reflow soldering.
  • Flux: Rosin-based flux, avoid highly acidic flux with halide content exceeding 0.2(wt)%.
  • Solder: Lead-free solder (96.5Sn /3.0Ag/0.5Cu).
  • Soldering conditions: Temperature difference between solder and ferrite surface limited to 150 max during pre-heating; cooling into solvent limited to 100 max.
  • Manual soldering: Iron temperature 350 (Max), 30W max, soldering time < 5S.
  • Cleaning conditions: Temperature 60 (Max), time 5 minutes (Max), ultrasonic power 200W max.
  • Storage period: Use within 6 months from factory inspection date. For longer periods, check solderability.
  • Storage conditions: Temperature -10 to +40, relative humidity 30-70%. Avoid corrosive substances, moisture, dust, heat shock, vibration, and direct sunlight. Store in airtight packaging.
  • ODS (Ozone Depleting Substances) such as CCl4, HCFC are not used in the production process.

2410121258_FH-CMC1206S-102T_C394933.pdf

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