Product Overview
The Chip Common Mode Choke Coils, specifically the CMC0805S and CMC1206S Series, are wire-wound chip common mode chokes designed for various electronic applications. These magnetically shielded inductors offer reliable performance with a range of impedance values. They are manufactured using Ni-Zn ferrite cores and Ni-Zn ferrite cover plates, with copper wires and silver/nickel/tin electrodes.
Product Attributes
- Product Type: Chip Common Mode Choke Coils
- Series: CMC0805S, CMC1206S
- Core Material: Ni-Zn ferrite
- Cover Plate Material: Ni-Zn ferrite
- Electrode Material: Silver (Ag), Nickel (Ni), Tin (Sn)
- Wire Material: Copper (Cu)
- Adhesive Material: Epoxy Resin
- Design: Magnetically Shielded
- Packaging Options: Tape & Reel (T), Bulk (B)
- RoHS Compliance: Yes
Technical Specifications
| Part Name | Dimensions (L x W x T) (mm) | Impedance () | Test Frequency (MHz) | Rdc () max | Rated Voltage (Vdc) max | Rated Current Idc (mA) max | Insulation Resistance (M) min |
|---|---|---|---|---|---|---|---|
| CMC0805S Series | |||||||
| CMC0805S-670T | 2.00.2 x 1.20.2 x 1.20.2 | 67 | 100 | 0.25 | 50 | 400 | 10 |
| CMC0805S-700T | 2.00.2 x 1.20.2 x 1.20.2 | 70 | 100 | 0.30 | 50 | 400 | 10 |
| CMC0805S-750T | 2.00.2 x 1.20.2 x 1.20.2 | 75 | 100 | 0.30 | 50 | 400 | 10 |
| CMC0805S-900T | 2.00.2 x 1.20.2 x 1.20.2 | 90 | 100 | 0.35 | 50 | 330 | 10 |
| CMC0805S-121T | 2.00.2 x 1.20.2 x 1.20.2 | 120 | 100 | 0.30 | 50 | 370 | 10 |
| CMC0805S-161T | 2.00.2 x 1.20.2 x 1.20.2 | 160 | 100 | 0.35 | 50 | 330 | 10 |
| CMC0805S-181T | 2.00.2 x 1.20.2 x 1.20.2 | 180 | 100 | 0.35 | 50 | 330 | 10 |
| CMC0805S-261T | 2.00.2 x 1.20.2 x 1.20.2 | 260 | 100 | 0.40 | 50 | 300 | 10 |
| CMC0805S-301T | 2.00.2 x 1.20.2 x 1.20.2 | 300 | 100 | 0.42 | 50 | 290 | 10 |
| CMC0805S-361T | 2.00.2 x 1.20.2 x 1.20.2 | 360 | 100 | 0.45 | 50 | 280 | 10 |
| CMC0805S-371T | 2.00.2 x 1.20.2 x 1.20.2 | 370 | 100 | 0.45 | 50 | 280 | 10 |
| CMC0805S-451T | 2.00.2 x 1.20.2 x 1.20.2 | 450 | 100 | 0.50 | 50 | 250 | 10 |
| CMC0805S-601T | 2.00.2 x 1.20.2 x 1.20.2 | 600 | 100 | 0.60 | 50 | 220 | 10 |
| CMC0805S-901T | 2.00.2 x 1.20.2 x 1.20.2 | 900 | 100 | 0.90 | 50 | 150 | 10 |
| CMC1206S Series | |||||||
| CMC1206S-900T | 3.20.2 x 1.60.2 x 1.80.2 | 90 | 100 | 0.30 | 50 | 370 | 10 |
| CMC1206S-161T | 3.20.2 x 1.60.2 x 1.80.2 | 160 | 100 | 0.40 | 50 | 340 | 10 |
| CMC1206S-261T | 3.20.2 x 1.60.2 x 1.80.2 | 260 | 100 | 0.50 | 50 | 310 | 10 |
| CMC1206S-371T | 3.20.2 x 1.60.2 x 1.80.2 | 370 | 100 | 0.50 | 50 | 300 | 10 |
| CMC1206S-601T | 3.20.2 x 1.60.2 x 1.80.2 | 600 | 100 | 0.80 | 50 | 260 | 10 |
| CMC1206S-801T | 3.20.2 x 1.60.2 x 1.80.2 | 800 | 100 | 0.90 | 50 | 240 | 10 |
| CMC1206S-102T | 3.20.2 x 1.60.2 x 1.80.2 | 1000 | 100 | 1.00 | 50 | 230 | 10 |
| CMC1206S-142T | 3.20.2 x 1.60.2 x 1.80.2 | 1400 | 100 | 1.00 | 50 | 220 | 10 |
| CMC1206S-202T | 3.20.2 x 1.60.2 x 1.80.2 | 2000 | 100 | 1.20 | 50 | 200 | 10 |
| CMC1206S-222T | 3.20.2 x 1.60.2 x 1.80.2 | 2200 | 100 | 1.20 | 50 | 200 | 10 |
| Reliability Data | |||||||
| Operating Temperature Range | -40~+85 | ||||||
| Solder ability | CMC series: 80% electrode surface solder coverage. | ||||||
| Resistance to Soldering Heat | Impedance shall not change more than 20%. | ||||||
| Insulation Resistance | CMC series: 10 M | ||||||
| Vibration | Impedance shall not change more than 20%. | ||||||
| Adhesion of electrode | CMC0805 Series: 5 N; CMC1206 Series: 10 N | ||||||
| Low temperature resistance | Impedance shall not change more than 20%. (Stored at -402 for 1000h) | ||||||
| High Temperature resistance | Impedance shall not change more than 20%. (Stored at 852 for 1000h) | ||||||
| Temperature Characteristic | Impedance shall not change more than 20%. | ||||||
| Thermal Shock | Impedance shall not change more than 20%. (+85 60 min -40 60 min, 32 Cycles) | ||||||
| High temperature load | Impedance shall not change more than 20%. (Rated current applied, stored at 852 for 1000h) | ||||||
| Static Humidity | Impedance shall not change more than 20%. (Stored at 90%95%RH at 602 for 1000h) | ||||||
| Bending strength | No visible mechanical damage. | ||||||
| Solvent Resistance | Impedance shall not change more than 20%. | ||||||
Packaging
| Part NO. | Per Reel | Per Box | Per Case |
|---|---|---|---|
| 0805 | 3000 | 9000 (3 boxes) | 45000 (5 cases) |
| 1206 | 2000 | 6000 (3 boxes) | 30000 (5 cases) |
Notes
- Recommended soldering process: Reflow soldering.
- Flux: Rosin-based flux, avoid highly acidic flux with halide content exceeding 0.2(wt)%.
- Solder: Lead-free solder (96.5Sn /3.0Ag/0.5Cu).
- Soldering conditions: Temperature difference between solder and ferrite surface limited to 150 max during pre-heating; cooling into solvent limited to 100 max.
- Manual soldering: Iron temperature 350 (Max), 30W max, soldering time < 5S.
- Cleaning conditions: Temperature 60 (Max), time 5 minutes (Max), ultrasonic power 200W max.
- Storage period: Use within 6 months from factory inspection date. For longer periods, check solderability.
- Storage conditions: Temperature -10 to +40, relative humidity 30-70%. Avoid corrosive substances, moisture, dust, heat shock, vibration, and direct sunlight. Store in airtight packaging.
- ODS (Ozone Depleting Substances) such as CCl4, HCFC are not used in the production process.
2410121258_FH-CMC1206S-102T_C394933.pdf
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