Product Overview
The GH-ZD4132C MLCC Arrays (C-ARRAY SERIES) offer significant space savings on PCBs, improving assembly density and efficiency. Each unit is equivalent to four 0603 chip capacitors, reducing placement times, manufacturing time, equipment management costs, and PCB expenses. They are suitable for SMT packaging and high-speed pick-and-place operations, enhancing printed board working efficiency by reducing printed circuits and increasing operational speed. These components adhere to GH/T 21041-2007 and GH/T 21042-2007 standards.
Product Attributes
- Product Name: MLCC_Arrays ( )
- Type: C-ARRAY SERIES
- Manufacturer: (Implied, not explicitly stated)
- Certifications: GH/T 21041-2007, GH/T 21042-2007
Applications
- PCBs with strict component space requirements (e.g., notebook computers, PDAs, cordless phones).
- Input and output interface circuits.
Advantages
- Space Saving: Up to 50% PCB space reduction.
- Higher Volumetric Capacitance: One CA unit equals four 0603 chip capacitors.
- Cost Saving: Reduced placement times, manufacturing time, equipment management, and PCB costs.
- Easy Installation: SMT package for high-speed mounting.
- Improved Working Efficiency: Reduced printed circuits and increased board speed.
Technical Specifications
| Model | Product Size & Type Code | Dielectric Style | Nominal Capacitance (pF) | Capacitance Tolerance | Rated Voltage (V) | Terminal Material | Package Style | Temperature Coefficient / Characteristics | Dimensions (mm) L x W x T |
| 6124 | 6124 (0.06" L x 0.12" W, 4 Elements) | COG, X7R, X5R, Z5U, Y5V | 0.5pF to 100nF | 0.05pF, 0.10pF, 0.25pF, 0.5pF, 1.0%, 2.0%, 5.0%, 10%, 20%, +50%/-20%, +80%/-20% | 6.3V to 100V | S (Silver), C (Copper), N (Nickel Barrier) | B (Bulk Bag), T (Taping Package) | COG (030 ppm/, -55~125), X7R (15%, -55~125), X5R (15%, -55~85), Z5U (-56%~+22%, 10~85), Y5V (-80%~+30%, -25~85) | 1.600.20 x 3.200.20 x 0.800.10 |
| 5084 | 5084 (0.05" L x 0.08" W, 4 Elements) | COG, X7R, Y5V | 0.5pF to 220nF | 0.05pF, 0.10pF, 0.25pF, 0.5pF, 1.0%, 2.0%, 5.0%, 10%, 20%, +50%/-20%, +80%/-20% | 16V to 50V | S (Silver), C (Copper), N (Nickel Barrier) | B (Bulk Bag), T (Taping Package) | COG (030 ppm/, -55~125), X7R (15%, -55~125), Y5V (-80%~+30%, -25~85) | 1.250.20 x 2.000.20 x 0.800.10 |
| 5082 | 5082 (0.05" L x 0.08" W, 2 Elements) | COG, X7R, Y5V | 0.5pF to 220nF | 0.05pF, 0.10pF, 0.25pF, 0.5pF, 1.0%, 2.0%, 5.0%, 10%, 20%, +50%/-20%, +80%/-20% | 16V to 50V | S (Silver), C (Copper), N (Nickel Barrier) | B (Bulk Bag), T (Taping Package) | COG (030 ppm/, -55~125), X7R (15%, -55~125), Y5V (-80%~+30%, -25~85) | 1.250.20 x 2.000.20 x 0.800.10 |
Reliability Test Summary
| Item | Technical Specification | Test Method and Remarks |
| Capacitance | Class : Within specified tolerance. Class : Within specified tolerance. | Measuring Frequency: 1MHz10% (1000pF), 1KHz10% (1000pF). Measuring Voltage: 1.00.2Vrms. Test Temperature: 253. For C>10F: Test Frequency: 12024 Hz, Test Voltage: 0.50.1Vrms. |
| Dissipation Factor (DF, tan) | Class : 0.56% (Cr<5pF), 1.5[(150/Cr)+7]10-4 (5pFCr<50pF), 0.15% (50pFCr1000pF), 0.15% (1000pF). Class (X7R): 2.5% (50V), 3.5% (25V), 5.0% (16V), 5.0% (10V), 7.5% (6.3V). Class (Y5V): 7.0% (C<1.0F, 25V), 9.0% (C1.0F, 25V), 15% (16V), 15% (10V), 15% (6.3V). | Measuring Frequency: 1KHz10% (C10F), 12024 Hz (C>10F). Measuring Voltage: 1.00.2Vrms (C10F), 0.50.1Vrms (C>10F). |
| Insulation Resistance (IR) | Class : C10 nF, Ri50000M; C10 nF, Ri CR500S. Class (X7R): C25 nF, Ri10000M; C25 nF, Ri CR100S. Class (Y5V): C25 nF, Ri4000M; C25 nF, Ri CR100S. | Measuring Voltage: Rated Voltage. Duration: 605s. Test Humidity: 75%. Test Temperature: 253. |
| Dielectric Withstanding Voltage (DWV) | No breakdown or damage. | Measuring Voltage: Class : 300% Rated voltage; Class : 250% Rated voltage. Duration: 15s. Charge/Discharge Current: 50mA max. |
| Solderability | At least 95% of the terminal electrode is covered by new solder. Visual Appearance: No visible damage. | Preheating: 80~120, 10~30s. Lead Solder: 2355, 20.5s. Lead-free Solder: 2455, 20.5s. |
| Resistance to Soldering Heat | C/C: COG 0.5%, X7R -5%~+10%, Y5V -10%~+20%. DF & IR: Same to initial standard. Appearance: No visible damage. Solderability: 95%. | Preheating: 100~200, 102min. Solder Temperature: 2655, 101s. Recovery Time: 242h. |
| Resistance to Flexure of Substrate | C/C 10%. Appearance: No visible damage. | Test Board: Al2O3 or PCB. Warp: 1mm. Speed: 1mm/sec. Measurement in bending state. |
| Termination Adhesion | No visible damage. | Applied Force: 5N. Duration: 101S. |
| Temperature Cycle | C/C: Class : 1% or 1pF (whichever is larger). Class : B: 10%, F: 20%. | 5 cycles. Steps: Low temp (30 min), Room temp (2-3 min), High temp (30 min), Room temp (2-3 min). Recovery time: 242h. |
| Humidity Load | C/C: Class : 7.5% or 0.75pF (whichever is larger). Class : B: 12.5%, F: 30%. DF: Not more than twice of initial value. IR: Class (Ri5000M or Ri CR50S), X7R (Ri1000M or Ri CR10S), Y5V (Ri400M or Ri CR10S). Appearance: No visible damage. | Temperature: 402. Humidity: 90~95%RH. Voltage: Rated Voltage. Duration: 500h. Recovery Time: 24h (Class 1) or 48h (Class 2). |
| Life Test | C/C: Class : 2% or 1pF (whichever is larger). Class : B: 20%, F: 30%. DF: Not more than twice of initial value. IR: Class (Ri4000M or Ri CR40S), X7R (Ri1000M or Ri CR10S), Y5V (Ri400M or Ri CR10S). | Applied Voltage: 2 Rated Voltage. Duration: 1000h. Temperature: 125 (NPO, X7R), 85 (Y5V). Charge/Discharge Current: 50mA max. Recovery Time: 24h (Class 1), or 48h (Class 2). |
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