MLCC_Arrays ()
MLCC_Arrays, also known as C-ARRAY SERIES, are multi-layer ceramic capacitors designed to save PCB space and improve assembly efficiency. They offer higher capacitance per volumetric area, reduce manufacturing costs by minimizing pick-and-place operations, and are compatible with SMT processes for easy high-speed mounting. These capacitors enhance printed board working efficiency by reducing printed circuits and increasing operational speed. They are manufactured according to GH/T 21041-2007 and GH/T 21042-2007 standards.
Key Features:
- Space Saving: Can save up to 50% of PCB space, increasing assembly density.
- High Volumetric Capacitance: One chip equals four 0603 type capacitors, reducing mounting steps and improving efficiency.
- Cost Saving: Reduces pick-and-place operations, manufacturing time, equipment management costs, and PCB expenses.
- Easy Mounting: Available in SMT tape packaging for high-speed placement.
- Improved Efficiency: Reduces printed circuits and increases the working speed of printed circuit boards.
Applications:
- Suitable for PCBs with strict component space requirements, such as notebook computers, PDAs, and cordless phones.
- Particularly effective for input and output interface circuits.
Product Attributes:
- Manufacturer: (Not specified in detail, but implied)
- Certifications: GH/T 21041-2007, GH/T 21042-2007
Technical Specifications:
| Part Number Prefix | Product Size (inch) | Elements Inside | Dielectric Style | Capacitance Tolerance | Rated Voltage (V) | Termination Material | Package Style |
|---|---|---|---|---|---|---|---|
| 6124 | 0.06 x 0.12 | 4 | COG, X7R, X5R, Z5U, Y5V | A, B, C, D, F, G, J, K, M, S, Z | 16, 25, 50, 100 | S, C, N | B, T |
| 5084 | 0.05 x 0.08 | 4 | COG, X7R, Y5V | A, B, C, D, F, G, J, K, M, S, Z | 16, 25, 50 | S, C, N | B, T |
| 5082 | 0.05 x 0.08 | 2 | COG, X7R, Y5V | A, B, C, D, F, G, J, K, M, S, Z | 16, 25, 50 | S, C, N | B, T |
Temperature Coefficient / Characteristics:
| Dielectric Style | Reference Temperature Point | Nominal Temperature Coefficient | Operation Temperature Range |
|---|---|---|---|
| COG | 20C | 030 ppm/ | -55125 |
| X7R | 20C | 15% | -55125 |
| X5R | 20C | 15% | -5585 |
| Z5U | 20C | -56%+22% | 1085 |
| Y5V | 20C | -80%+30% | -2585 |
Outline Dimensions (mm):
| Specification Model | L | W | T | P | E |
|---|---|---|---|---|---|
| 5082 | 1.250.20 | 2.000.20 | 0.800.10 | 1.000.10 | 1.000.10 |
| 5084 | 1.250.20 | 2.000.20 | 0.800.10 | 1.000.10 | 0.500.05 |
| 6124 | 1.600.20 | 3.200.20 | 0.800.10 | 1.000.10 | 0.800.20 |
Capacitance Range:
Please refer to the detailed tables in the original document for specific capacitance values available for each material, working voltage, and model.
Reliability Test:
| Item | Technical Specification | Test Method and Remarks |
|---|---|---|
| Capacitance | Class : Should be within the specified tolerance. Class : Should be within the specified tolerance. | Measuring Frequency: 1000pF: 1MHz10%; 1000pF: 1KHz10%. Measuring Voltage: 1.00.2Vrms. Test Temperature: 253. |
| Dissipation Factor (DF, tan) | Class : See detailed values. Class : X7R: 2.5% (50V) to 7.5% (6.3V). Y5V: 7.0% (<1.0F) to 15% (6.3V). | Test Frequency: 1KHz10% (C10F) or 12024 Hz (C10F). Test Voltage: 1.00.2Vrms or 0.50.1Vrms. |
| Insulation Resistance (IR) | Class : C10 nF, Ri50000M; C10 nF, Ri CR500S. Class : X7R: C25 nF, Ri10000M; C25 nF, Ri CR100S. Y5V: C25 nF, Ri4000M; C25 nF, Ri CR100S. | Test Voltage: Rated Voltage. Duration: 605s. Test Humidity: 75%. Test Temperature: 253. |
| Dielectric Withstanding Voltage (DWV) | No breakdown or damage. | Measuring Voltage: Class: 300% Rated voltage; Class: 250% Rated voltage. Duration: 15s. |
| Solderability | At least 95% of the terminal electrode is covered by new solder. Visual Appearance: No visible damage. | Preheating: 80~120, 10~30s. Lead solder: 2355, 20.5s. Lead-free solder: 2455, 20.5s. |
| Resistance to Soldering Heat | C/C: COG 0.5%, X7R -5~+10%, Y5V -10~+20%. DF & IR: Same to initial value. Appearance: No visible damage. Solderability: 95%. | Preheating: 100~200, 102min. Solder Temperature: 2655, Duration: 101s. Recovery Time: 242h. |
| Resistance to Flexure of Substrate (Bending Strength) | C/C 10%. Appearance: No visible damage. | Test Board: Al2O3 or PCB. Warp: 1mm. Speed: 1mm/sec. Measurement in bent position. |
| Termination Adhesion | No visible damage. | Applied Force: 5N. Duration: 101S. |
| Temperature Cycle | C/C: Class: 1% or 1pF. Class: B: 10%, F: 20%. | 5 cycles. Temperature range: -55 to +125 (COG/X7R/X5R) or -25 to +85 (Y5V/Z5U). Step duration: 30 min. Recovery time: 242h. |
| Humidity Load | C/C: Class: 7.5% or 0.75pF. Class: B: 12.5%, F: 30%. DF 2x initial value. IR: See detailed values. Appearance: No damage. | Temperature: 402. Humidity: 90~95%RH. Voltage: Rated Voltage. Duration: 500 hours. Recovery Time: 24h (Class 1) or 48h (Class 2). |
| Life Test | C/C: Class: 2% or 1pF. Class: B: 20%, F: 30%. DF 2x initial value. IR: See detailed values. | Applied Voltage: 2 Rated Voltage. Duration: 1000h. Temperature: 125 (COG/X7R) or 85 (Y5V). Recovery Time: 24h (Class 1) or 48h (Class 2). |
2410121231_FH-6124B104K500NT_C62857.pdf
Please Use Our Online Inquiry Contact Form Below If You Have Any Questions, Our Team Will Get Back To You As Soon As Possible