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quality Multilayer Chip Ferrite Beads FH CBM321609U121T Providing EMI Noise Filtering in Surface Mount Package factory
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quality Multilayer Chip Ferrite Beads FH CBM321609U121T Providing EMI Noise Filtering in Surface Mount Package factory
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Specifications
Current Rating:
4A
Number of Circuits:
1
DC Resistance(DCR):
35mΩ
Tolerance:
±25%
Impedance @ Frequency:
120Ω@100MHz
Mfr. Part #:
CBM321609U121T
Package:
1206
Key Attributes
Model Number: CBM321609U121T
Product Description

Multilayer Chip Ferrite Ultra-High Current Beads

Multilayer Chip Ferrite Beads offer high impedance and effective EMI/RFI suppression in a compact, surface-mountable package. Designed for easy integration with SMT equipment, they provide superior performance compared to traditional leaded ferrite beads, especially in high-current applications. Their unique terminal electrode structure ensures a high permissible current of up to 6.0A. These beads are ideal for noise suppression in power lines and ultra-high current signal lines of various electrical equipment, including communication devices, computers, and LCD TVs.

Product Attributes

  • Product Code: CBM
  • Material: Ferrite
  • Packaging Styles: Tape & Reel (T), Bulk (B)

Technical Specifications

Part Number Dimensions (LWT mm) Impedance () Tolerance Test Frequency (MHz) DCR () Max Rated Current (mA) Max
CBM060303X220T 0.60.30.3 22 25% 100 0.040 1800
CBM060303X330T 0.60.30.3 33 25% 100 0.055 1500
CBM060303X800T 0.60.30.3 80 25% 100 0.130 1000
CBM060303X121T 0.60.30.3 120 25% 100 0.160 900
CBM100505U000T 1.00.50.5 0 015 100 0.02 2000
CBM100505U050T 1.00.50.5 5 015 100 0.02 2000
CBM100505U101T 1.00.50.5 100 25% 100 0.15 1000
CBM100505U102T 1.00.50.5 1000 25% 100 0.65 300
CBM160808U000T 1.60.80.8 0 015 100 0.01 6000
CBM160808U050T 1.60.80.8 5 015 100 0.01 6000
CBM160808U101T 1.60.80.8 100 25% 100 0.06 2500
CBM160808U102T 1.60.80.8 1000 25% 100 0.35 700
CBM201209U000T 2.01.20.9 0 015 100 0.01 6000
CBM201209U050T 2.01.20.9 5 015 100 0.01 6000
CBM201209U101T 2.01.20.9 100 25% 100 0.045 4000
CBM201209U102T 2.01.20.9 1000 25% 100 0.12 1500
CBM321609U000T 3.21.60.9 0 015 100 0.01 6000
CBM321609U050T 3.21.60.9 5 015 100 0.01 6000
CBM321609U101T 3.21.60.9 100 25% 100 0.035 4000
CBM321609U102T 3.21.60.9 1000 25% 100 0.12 2100
CBM322513U110T 3.22.51.3 11 715 100 0.02 6000
CBM322513U150T 3.22.51.3 15 921 100 0.02 6000
CBM322513U121T 3.22.51.3 120 25% 100 0.03 5000
CBM322513U102T 3.22.51.3 1000 25% 100 0.23 2500
CBM451616U190T 4.51.61.6 19 1225 100 0.009 6000
CBM451616U600T 4.51.61.6 60 25% 100 0.009 6000
CBM453215U190T 4.53.21.5 19 1225 100 0.01 6000
CBM453215U600T 4.53.21.5 60 25% 100 0.01 6000
CBM453215U101T 4.53.21.5 100 25% 100 0.02 6000
CBM453215U501T 4.53.21.5 500 25% 100 0.08 4000

Reliability Test Method

No. Items Requirements Test Methods and Remarks
1 Operating Temperature Range -55+125 Includes product surface temperature rise
2 Solder ability No visible damage; 95% or more of electrode area shall be coated by new solder. Preheating temperature:120~ 150; Preheating time: 60s; Solder: 96.5%Sn/3.0%Ag/0.5%Cu; Solder temperature: 2455; Immersion tin depth:10mm; Duration: 51s; Dip performance to a flux of about:3 ~ 5 s
3 Resistance to Soldering Heat At least 95% of terminal electrode should be covered with solder. No mechanical damage. Impedance change: within 30% Preheating temperature: 120~150; Preheating time: 60s; Solder: 96.5%Sn/3.0%Ag/0.5%Cu; Solder temperature: 2605; Immersion tin depth:10mm; Duration: 101s; Dip performance to a flux of about:35 s
4 Adhesion of electrode The termination and body should be no damage. Applied force: 5N for 1005 series; 7N for 1608 series; 10N for 2012, 3216 series; 15N for 3225, 4532 series. Keep time: 101S
5 Low temperature resistance No mechanical damage. Impedance change: within 30% Temperature: -552; Testing time: 10000 +24 h
6 Bending strength No mechanical damage Testing board: glass epoxy-resin substrate; For 0.5mm/s, bending: 2mm, duration: 20s1s

2411251503_FH-CBM321609U121T_C91124.pdf

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