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quality Miniature wire wound chip common mode choke coil FH CMC0805S-301T ideal for USB and LVDS signal lines factory
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quality Miniature wire wound chip common mode choke coil FH CMC0805S-301T ideal for USB and LVDS signal lines factory
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Specifications
Insulation Resistance(IR):
10MΩ
DC Resistance(DCR):
420mΩ
Number of Lines:
2
Voltage Rating - DC:
50V
Mfr. Part #:
CMC0805S-301T
Package:
SMD-4P,2x1.2mm
Key Attributes
Model Number: CMC0805S-301T
Product Description

Product Overview

Wire Wound Chip Common Mode Choke Coils are miniature, surface-mountable filters designed for high-density applications. They feature a large coupling coefficient, minimizing impact on high-speed differential signals while effectively suppressing high-frequency common mode noise. Available in a range of impedances from 67 to 2200, these filters are suitable for various noise levels and signal frequencies. Key applications include USB lines for PCs and peripherals, LVDS lines for laptops and LCDs, and USB lines for digital AV equipment.

Product Attributes

  • Product Type: Wire Wound Chip Common Mode Choke Coils Series (CMC)
  • Design Symbol: Magnetically Shielded (S)
  • Packaging Options: Tape & Reel (T), Bulk (B)

Technical Specifications

Product Type Dimensions (mm) Common Mode Impedance @100MHz () DC Resistance () Max Rated Current (mA) Max Rated Voltage (Vdc) Max Insulation Resistance (M) Min
CMC0805S 2.0 x 1.2 67 25% 0.25 400 50 10
75 25% 0.30 400 50 10
90 25% 0.35 330 50 10
120 25% 0.30 370 50 10
180 25% 0.35 330 50 10
260 25% 0.40 300 50 10
300 25% 0.42 290 50 10
370 25% 0.45 280 50 10
450 25% 0.50 250 50 10
600 25% 0.60 220 50 10
800 25% 0.90 150 50 10
900 25% 0.90 150 50 10
CMC1206S 3.2 x 1.6 90 25% 0.30 370 50 10
160 25% 0.40 340 50 10
260 25% 0.50 310 50 10
370 25% 0.50 300 50 10
600 25% 0.80 260 50 10
800 25% 0.90 240 50 10
1000 25% 1.00 230 50 10
1400 25% 1.00 220 50 10
2000 25% 1.20 200 50 10
2200 25% 1.20 200 50 10

Reliability Test Methods

No. Item Requirements Test Methods and Remarks
1 Solder ability No visible mechanical damage; Electrode surface solder coverage 80%. Dip pads in flux and dip in solder pot (96.5Sn/3.0Ag/0.5Cu) at 2455 for 51s.
2 Resistance to Soldering No visible mechanical damage; Impedance change 20%. Dip pads in flux and dip in solder pot (96.5Sn/3.0Ag/0.5Cu) at 2605 for 101s.
3 Vibration No visible mechanical damage; Impedance change 20%. Amplitude 1.5mm, frequency 10~55Hz, for 2h in each of three axes (X, Y, Z).
4 Adhesion of electrode No electrode detachment after test; No visible mechanical damage. Weld product on PCB and apply force as specified. 0805 Series: 5 N; 1206 Series: 10 N. Keep time: (101)s; Speed: 1.0 mm/s.
5 Low temperature resistance No visible mechanical damage; Impedance change 20%. Store at -402 for 1000h.
6 High temperature resistance No visible mechanical damage; Impedance change 20%. Store at 852 for 1000h.
7 Temperature Shock No visible mechanical damage; Impedance change 20%. +85 for 30 min -40 for 30 min, 100 Cycles.
8 High temperature load No visible mechanical damage; Impedance change 20%. Store at 852 for 1000h with rated current applied.
9 Static Humidity No visible mechanical damage; Impedance change 20%. Subject to 90%~95% RH, at 602 for 1000h.
10 Bending strength No visible mechanical damage. Install on test substrate, apply force vertically. Bend down (20.2) mm at a rate of (10.5) mm/s, keep for (201)s.
11 Solvent Resistance No visible mechanical damage; Impedance change 20%. Soak in isopropyl alcohol solution at 235 for 50.5 min.
12 Insulation Resistance 10 M (CMC series). Rated voltage applied between windings for one minute.

Packaging Information

Size Pieces Per Reel Reels Per Box Pieces Per Box Boxes Per Case Pieces Per Case
0805 3000 3 9000 1.5 45000
1206 2000 5 10000 2 60000
6 18000 3 90000
4 12000 6 120000
4 80000
180000
120000

2409271832_FH-CMC0805S-301T_C20616260.pdf

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