Product Overview
Wire Wound Chip Common Mode Choke Coils are miniature, surface-mountable filters designed for high-density applications. They feature a large coupling coefficient, minimizing impact on high-speed differential signals while effectively suppressing high-frequency common mode noise. Available in a range of impedances from 67 to 2200, these filters are suitable for various noise levels and signal frequencies. Key applications include USB lines for PCs and peripherals, LVDS lines for laptops and LCDs, and USB lines for digital AV equipment.
Product Attributes
- Product Type: Wire Wound Chip Common Mode Choke Coils Series (CMC)
- Design Symbol: Magnetically Shielded (S)
- Packaging Options: Tape & Reel (T), Bulk (B)
Technical Specifications
| Product Type | Dimensions (mm) | Common Mode Impedance @100MHz () | DC Resistance () Max | Rated Current (mA) Max | Rated Voltage (Vdc) Max | Insulation Resistance (M) Min |
|---|---|---|---|---|---|---|
| CMC0805S | 2.0 x 1.2 | 67 25% | 0.25 | 400 | 50 | 10 |
| 75 25% | 0.30 | 400 | 50 | 10 | ||
| 90 25% | 0.35 | 330 | 50 | 10 | ||
| 120 25% | 0.30 | 370 | 50 | 10 | ||
| 180 25% | 0.35 | 330 | 50 | 10 | ||
| 260 25% | 0.40 | 300 | 50 | 10 | ||
| 300 25% | 0.42 | 290 | 50 | 10 | ||
| 370 25% | 0.45 | 280 | 50 | 10 | ||
| 450 25% | 0.50 | 250 | 50 | 10 | ||
| 600 25% | 0.60 | 220 | 50 | 10 | ||
| 800 25% | 0.90 | 150 | 50 | 10 | ||
| 900 25% | 0.90 | 150 | 50 | 10 | ||
| CMC1206S | 3.2 x 1.6 | 90 25% | 0.30 | 370 | 50 | 10 |
| 160 25% | 0.40 | 340 | 50 | 10 | ||
| 260 25% | 0.50 | 310 | 50 | 10 | ||
| 370 25% | 0.50 | 300 | 50 | 10 | ||
| 600 25% | 0.80 | 260 | 50 | 10 | ||
| 800 25% | 0.90 | 240 | 50 | 10 | ||
| 1000 25% | 1.00 | 230 | 50 | 10 | ||
| 1400 25% | 1.00 | 220 | 50 | 10 | ||
| 2000 25% | 1.20 | 200 | 50 | 10 | ||
| 2200 25% | 1.20 | 200 | 50 | 10 |
Reliability Test Methods
| No. | Item | Requirements | Test Methods and Remarks |
|---|---|---|---|
| 1 | Solder ability | No visible mechanical damage; Electrode surface solder coverage 80%. | Dip pads in flux and dip in solder pot (96.5Sn/3.0Ag/0.5Cu) at 2455 for 51s. |
| 2 | Resistance to Soldering | No visible mechanical damage; Impedance change 20%. | Dip pads in flux and dip in solder pot (96.5Sn/3.0Ag/0.5Cu) at 2605 for 101s. |
| 3 | Vibration | No visible mechanical damage; Impedance change 20%. | Amplitude 1.5mm, frequency 10~55Hz, for 2h in each of three axes (X, Y, Z). |
| 4 | Adhesion of electrode | No electrode detachment after test; No visible mechanical damage. | Weld product on PCB and apply force as specified. 0805 Series: 5 N; 1206 Series: 10 N. Keep time: (101)s; Speed: 1.0 mm/s. |
| 5 | Low temperature resistance | No visible mechanical damage; Impedance change 20%. | Store at -402 for 1000h. |
| 6 | High temperature resistance | No visible mechanical damage; Impedance change 20%. | Store at 852 for 1000h. |
| 7 | Temperature Shock | No visible mechanical damage; Impedance change 20%. | +85 for 30 min -40 for 30 min, 100 Cycles. |
| 8 | High temperature load | No visible mechanical damage; Impedance change 20%. | Store at 852 for 1000h with rated current applied. |
| 9 | Static Humidity | No visible mechanical damage; Impedance change 20%. | Subject to 90%~95% RH, at 602 for 1000h. |
| 10 | Bending strength | No visible mechanical damage. | Install on test substrate, apply force vertically. Bend down (20.2) mm at a rate of (10.5) mm/s, keep for (201)s. |
| 11 | Solvent Resistance | No visible mechanical damage; Impedance change 20%. | Soak in isopropyl alcohol solution at 235 for 50.5 min. |
| 12 | Insulation Resistance | 10 M (CMC series). | Rated voltage applied between windings for one minute. |
Packaging Information
| Size | Pieces Per Reel | Reels Per Box | Pieces Per Box | Boxes Per Case | Pieces Per Case |
|---|---|---|---|---|---|
| 0805 | 3000 | 3 | 9000 | 1.5 | 45000 |
| 1206 | 2000 | 5 | 10000 | 2 | 60000 |
| 6 | 18000 | 3 | 90000 | ||
| 4 | 12000 | 6 | 120000 | ||
| 4 | 80000 | ||||
| 180000 | |||||
| 120000 |
2409271832_FH-CMC0805S-301T_C20616260.pdf
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