Product Overview
The Chip Common Mode Choke Coils, CMC0805S and CMC1206S Series, are magnetically shielded wire-wound chip common mode inductors designed for various electronic applications. Constructed with Ni-Zn ferrite cores and featuring silver, nickel, and tin electrodes, these components offer reliable performance with specified impedance ratings. They are suitable for reflow soldering and are manufactured to meet RoHS directives.
Product Attributes
- Product Type: Chip Common Mode Choke Coils
- Series: CMC0805S, CMC1206S
- Core Material: Ni-Zn ferrite
- Electrode Materials: Silver (Ag), Nickel (Ni), Tin (Sn)
- Wire Material: Copper (Cu)
- Adhesive Material: Epoxy Resin
- Design: Magnetically Shielded (S)
- Packaging Types: Tape & Reel (T), Bulk (B)
- Compliance: RoHS compliant
Technical Specifications
| Part Number | Dimensions (L x W x T) (mm) | Impedance () | Test Frequency (MHz) | Rdc () max | Rated Voltage (Vdc) max | Rated Current Idc (mA) max | Insulation Resistance (M) min |
|---|---|---|---|---|---|---|---|
| CMC0805S-670T | 2.00.2 x 1.20.2 x 1.20.2 | 67 | 100 | 0.25 | 50 | 400 | 10 |
| CMC0805S-700T | 2.00.2 x 1.20.2 x 1.20.2 | 70 | 100 | 0.30 | 50 | 400 | 10 |
| CMC0805S-750T | 2.00.2 x 1.20.2 x 1.20.2 | 75 | 100 | 0.30 | 50 | 400 | 10 |
| CMC0805S-900T | 2.00.2 x 1.20.2 x 1.20.2 | 90 | 100 | 0.35 | 50 | 330 | 10 |
| CMC0805S-121T | 2.00.2 x 1.20.2 x 1.20.2 | 120 | 100 | 0.30 | 50 | 370 | 10 |
| CMC0805S-161T | 2.00.2 x 1.20.2 x 1.20.2 | 160 | 100 | 0.35 | 50 | 330 | 10 |
| CMC0805S-181T | 2.00.2 x 1.20.2 x 1.20.2 | 180 | 100 | 0.35 | 50 | 330 | 10 |
| CMC0805S-261T | 2.00.2 x 1.20.2 x 1.20.2 | 260 | 100 | 0.40 | 50 | 300 | 10 |
| CMC0805S-301T | 2.00.2 x 1.20.2 x 1.20.2 | 300 | 100 | 0.42 | 50 | 290 | 10 |
| CMC0805S-361T | 2.00.2 x 1.20.2 x 1.20.2 | 360 | 100 | 0.45 | 50 | 280 | 10 |
| CMC0805S-371T | 2.00.2 x 1.20.2 x 1.20.2 | 370 | 100 | 0.45 | 50 | 280 | 10 |
| CMC0805S-451T | 2.00.2 x 1.20.2 x 1.20.2 | 450 | 100 | 0.50 | 50 | 250 | 10 |
| CMC0805S-601T | 2.00.2 x 1.20.2 x 1.20.2 | 600 | 100 | 0.60 | 50 | 220 | 10 |
| CMC0805S-901T | 2.00.2 x 1.20.2 x 1.20.2 | 900 | 100 | 0.90 | 50 | 150 | 10 |
| CMC1206S-900T | 3.20.2 x 1.60.2 x 1.80.2 | 90 | 100 | 0.30 | 50 | 370 | 10 |
| CMC1206S-161T | 3.20.2 x 1.60.2 x 1.80.2 | 160 | 100 | 0.40 | 50 | 340 | 10 |
| CMC1206S-261T | 3.20.2 x 1.60.2 x 1.80.2 | 260 | 100 | 0.50 | 50 | 310 | 10 |
| CMC1206S-371T | 3.20.2 x 1.60.2 x 1.80.2 | 370 | 100 | 0.50 | 50 | 300 | 10 |
| CMC1206S-601T | 3.20.2 x 1.60.2 x 1.80.2 | 600 | 100 | 0.80 | 50 | 260 | 10 |
| CMC1206S-801T | 3.20.2 x 1.60.2 x 1.80.2 | 800 | 100 | 0.90 | 50 | 240 | 10 |
| CMC1206S-102T | 3.20.2 x 1.60.2 x 1.80.2 | 1000 | 100 | 1.00 | 50 | 230 | 10 |
| CMC1206S-142T | 3.20.2 x 1.60.2 x 1.80.2 | 1400 | 100 | 1.00 | 50 | 220 | 10 |
| CMC1206S-202T | 3.20.2 x 1.60.2 x 1.80.2 | 2000 | 100 | 1.20 | 50 | 200 | 10 |
| CMC1206S-222T | 3.20.2 x 1.60.2 x 1.80.2 | 2200 | 100 | 1.20 | 50 | 200 | 10 |
| Operating Temperature Range: -40~+85 | |||||||
| Solder ability: Electrode surface solder coverage 80% | |||||||
| Resistance to Soldering: Impedance shall not change more than 20% | |||||||
| Insulation Resistance: 10 M | |||||||
| Vibration: Impedance shall not change more than 20% | |||||||
| End Electrode Strength: No visible mechanical damage, electrode did not fall off after test. | |||||||
| Low temperature resistance: Impedance shall not change more than 20% after storage at -402 for 1000h. | |||||||
| High Temperature resistance: Impedance shall not change more than 20% after storage at 852 for 1000h. | |||||||
| Temperature Characteristic: Impedance variation rate shall not exceed 20%. | |||||||
| Thermal Shock: Impedance shall not change more than 20% after 32 cycles of +85 (60 min) -40 (60 min). | |||||||
| High temperature load: Impedance shall not change more than 20% after storage at 852 with rated current for 1000h. | |||||||
| Static Humidity: Impedance shall not change more than 20% after storage at 90%~95%RH, 602 for 1000h. | |||||||
| Bending strength: No visible mechanical damage. | |||||||
| Solvent Resistance: Impedance shall not change more than 20% after soaking in isopropyl alcohol solution at 235 for 50.5 min. | |||||||
Packaging: Available in Tape & Reel (T) and Bulk (B) packaging types. Reel dimensions and taping specifications are available.
Soldering Profile: Recommended for reflow soldering. Use rosin-based flux and lead-free solder (96.5Sn/3.0Ag/0.5Cu). Temperature differences during pre-heating and cooling should be managed to prevent product quality deterioration.
Cleaning Conditions: Max temperature 60, max time 5 minutes, max ultrasonic power 200W.
Storage Requirements: Store within 6 months from the factory inspection date. If exceeding 6 months, check solderability before use. Storage conditions: Temperature -10 to +40, relative humidity 30-70%. Avoid corrosive substances, moisture, dust, heat shock, vibration, and direct sunlight. Store in airtight packaging.
ODS Usage: Company does not use ODS such as CCl4 (carbon tetrachloride) and HCFC in production.
Notes: Products comply with RoHS directive. Ensure product evaluation and confirmation when mounted into customer's product. Do not touch wire with sharp objects such as tweezers to prevent wire breakage.
2410121258_FH-CMC1206S-900T_C394936.pdf
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