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Specifications
Inductance @ Frequency:
-
Insulation Resistance(IR):
10MΩ
Operating Temperature:
-40℃~+85℃
DC Resistance(DCR):
800mΩ
Voltage Rating - DC:
50V
Number of Lines:
2
Voltage Withstand:
-
Mfr. Part #:
CMC1206S-601T
Package:
SMD-4P,3.2x1.6mm
Key Attributes
Model Number:
CMC1206S-601T
Product Description
Product Overview
The CMC Series Chip Common Mode Choke Coils are designed for effective noise suppression. These magnetically shielded inductors are constructed with a Ni-Zn ferrite core and cover plates, utilizing copper wire and silver/nickel/tin electrodes. Available in 0805 and 1206 series, they offer a range of impedance values suitable for various electronic applications requiring filtering and EMI reduction.
Product Attributes
- Product Type: Chip Common Mode Choke Coils
- Series: CMC0805S, CMC1206S
- Core Material: Ni-Zn ferrite
- Cover Plate Material: Ni-Zn ferrite
- Electrode Material: Silver (Ag), Nickel (Ni), Tin (Sn)
- Wire Material: Copper (Cu)
- Adhesive Material: Epoxy Resin
- Design: Magnetically Shielded (S)
- Packaging Options: Tape & Reel (T), Bulk (B)
- Compliance: RoHS compliant
Technical Specifications
| Part Number | Dimensions (L x W x T) (mm) | Nominal Impedance () at 100 MHz | Tolerance (%) | DCR () max | Rated Voltage (Vdc) max | Rated Current (mA) max | Insulation Resistance (M) min |
|---|---|---|---|---|---|---|---|
| CMC0805S-670T | 2.0 0.2 x 1.2 0.2 x 1.2 0.2 | 67 | 25 | 0.25 | 50 | 400 | 10 |
| CMC0805S-700T | 2.0 0.2 x 1.2 0.2 x 1.2 0.2 | 70 | 25 | 0.30 | 50 | 400 | 10 |
| CMC0805S-750T | 2.0 0.2 x 1.2 0.2 x 1.2 0.2 | 75 | 25 | 0.30 | 50 | 400 | 10 |
| CMC0805S-900T | 2.0 0.2 x 1.2 0.2 x 1.2 0.2 | 90 | 25 | 0.35 | 50 | 330 | 10 |
| CMC0805S-121T | 2.0 0.2 x 1.2 0.2 x 1.2 0.2 | 120 | 25 | 0.30 | 50 | 370 | 10 |
| CMC0805S-161T | 2.0 0.2 x 1.2 0.2 x 1.2 0.2 | 160 | 25 | 0.35 | 50 | 330 | 10 |
| CMC0805S-181T | 2.0 0.2 x 1.2 0.2 x 1.2 0.2 | 180 | 25 | 0.35 | 50 | 330 | 10 |
| CMC0805S-261T | 2.0 0.2 x 1.2 0.2 x 1.2 0.2 | 260 | 25 | 0.40 | 50 | 300 | 10 |
| CMC0805S-301T | 2.0 0.2 x 1.2 0.2 x 1.2 0.2 | 300 | 25 | 0.42 | 50 | 290 | 10 |
| CMC0805S-361T | 2.0 0.2 x 1.2 0.2 x 1.2 0.2 | 360 | 25 | 0.45 | 50 | 280 | 10 |
| CMC0805S-371T | 2.0 0.2 x 1.2 0.2 x 1.2 0.2 | 370 | 25 | 0.45 | 50 | 280 | 10 |
| CMC0805S-451T | 2.0 0.2 x 1.2 0.2 x 1.2 0.2 | 450 | 25 | 0.50 | 50 | 250 | 10 |
| CMC0805S-601T | 2.0 0.2 x 1.2 0.2 x 1.2 0.2 | 600 | 25 | 0.60 | 50 | 220 | 10 |
| CMC0805S-901T | 2.0 0.2 x 1.2 0.2 x 1.2 0.2 | 900 | 25 | 0.90 | 50 | 150 | 10 |
| CMC1206S-900T | 3.2 0.2 x 1.6 0.2 x 1.8 0.2 | 90 | 25 | 0.30 | 50 | 370 | 10 |
| CMC1206S-161T | 3.2 0.2 x 1.6 0.2 x 1.8 0.2 | 160 | 25 | 0.40 | 50 | 340 | 10 |
| CMC1206S-261T | 3.2 0.2 x 1.6 0.2 x 1.8 0.2 | 260 | 25 | 0.50 | 50 | 310 | 10 |
| CMC1206S-371T | 3.2 0.2 x 1.6 0.2 x 1.8 0.2 | 370 | 25 | 0.50 | 50 | 300 | 10 |
| CMC1206S-601T | 3.2 0.2 x 1.6 0.2 x 1.8 0.2 | 600 | 25 | 0.80 | 50 | 260 | 10 |
| CMC1206S-801T | 3.2 0.2 x 1.6 0.2 x 1.8 0.2 | 800 | 25 | 0.90 | 50 | 240 | 10 |
| CMC1206S-102T | 3.2 0.2 x 1.6 0.2 x 1.8 0.2 | 1000 | 25 | 1.00 | 50 | 230 | 10 |
| CMC1206S-142T | 3.2 0.2 x 1.6 0.2 x 1.8 0.2 | 1400 | 25 | 1.00 | 50 | 220 | 10 |
| CMC1206S-202T | 3.2 0.2 x 1.6 0.2 x 1.8 0.2 | 2000 | 25 | 1.20 | 50 | 200 | 10 |
| CMC1206S-222T | 3.2 0.2 x 1.6 0.2 x 1.8 0.2 | 2200 | 25 | 1.20 | 50 | 200 | 10 |
Reliability Testing
| Item | Requirements | Test Methods and Remarks |
|---|---|---|
| Operating Temperature Range | -40~+85 | |
| Solder ability | Electrode surface solder coverage: 80% | Dip pads in flux and dip in solder pot (96.5Sn/3.0Ag/0.5Cu) at 2455 for 51s. |
| Resistance to Soldering | Impedance shall not change more than 20% | Dip pads in flux and dip in solder pot (96.5Sn/3.0Ag/0.5Cu) at 2605 for 101s. |
| Insulation Resistance | 10 M | Rated voltage applied between windings for one minute. |
| Vibration | Impedance shall not change more than 20% | Amplitude 1.5mm, frequency 10~55Hz, 2h in each of X, Y, Z axes. |
| Adhesion of electrode | End electrode did not fall off after test. | CMC0805 Series: 5 N; CMC1206 Series: 10 N. Keep time: (101)s, Speed: 1.0 mm/s. |
| Low temperature resistance | Impedance shall not change more than 20% | Stored at -402 for 1000 h. |
| High Temperature resistance | Impedance shall not change more than 20% | Stored at 852 for 1000 h. |
| Temperature Characteristic | Impedance variation rate shall not exceed 20% | Held at 202, -402, 202, 852 for 4h each. |
| Thermal Shock | Impedance shall not change more than 20% | +85 for 60 min -40 for 60 min, 32 cycles. Transition time: 2~3 min. |
| High temperature load | Impedance shall not change more than 20% | Rated current applied, stored at 852 for 1000 h. |
| Static Humidity | Impedance shall not change more than 20% | Stored at 90%~95% RH at 602 for 1000 h. |
| Bending strength | No visible mechanical damage. | Test substrate bend down 2 mm at a rate of (10.5) mm/s, hold for 5 s. |
| Solvent Resistance | Impedance shall not change more than 20% | Soaked in isopropyl alcohol solution at 235 for 50.5 min. |
Packaging
Available in Tape & Reel packaging.
- 0805 Series: 3000 pcs per Reel, 9000 pcs per Box (3 Reels), 15000 pcs per Box (5 Reels), etc.
- 1206 Series: 2000 pcs per Reel, 6000 pcs per Box (3 Reels), 10000 pcs per Box (5 Reels), etc.
- Peeling Force: 20g ~ 80g (Tape speed: 300mm/min10%, Angle: 165~180).
Soldering Profile
Recommended for reflow soldering. Use rosin-based flux (halide content < 0.2%) and lead-free solder (96.5Sn/3.0Ag/0.5Cu). Temperature difference between solder and ferrite surface should not exceed 150 during pre-heating and 100 during cooling.
Manual Soldering: Iron temperature: 350 (Max), Power: 30W (Max), Time: < 5S.
Cleaning
- Temperature: 60 (Max)
- Time: 5 minutes (Max)
- Ultrasonic Power: 200W (Max)
Storage Requirements
- Storage Period: Use within 6 months from the factory inspection date. If exceeding 6 months, check solderability before use.
- Storage Conditions: Temperature: -10 ~ +40, Relative Humidity: 30 ~ 70%. Store in a warehouse away from corrosive substances, humidity, dust, heat shock, vibration, and direct sunlight. Keep in airtight packaging.
Usage Of ODS
The company does not use ODS such as CCl4 (Carbon Tetrachloride) and HCFC in its production process.
Notes
- Products are RoHS compliant.
- Ensure that your product has been evaluated and confirmed against your specifications when our product is mounted.
- The company does not warrant against failure caused by any use deviating from the intended use described in this specification.
- Do not touch wire with sharp objects such as tweezers to prevent wire breakage.
2410121258_FH-CMC1206S-601T_C394935.pdf
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