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Specifications
Current Rating:
3A
Number of Circuits:
1
DC Resistance(DCR):
40mΩ
Tolerance:
±25%
Impedance @ Frequency:
60Ω@100MHz
Mfr. Part #:
CBM160808U600T
Package:
0603
Key Attributes
Model Number:
CBM160808U600T
Product Description
Multilayer Chip Ferrite Ultra-High Current Beads
These multilayer chip ferrite beads offer high impedance and effective EMI/RFI suppression over a wide frequency range, ideal for noise suppression in power lines or extra-large current signal lines of electrical equipment such as communication equipment, computers, and LCD TVs. Their compact, leadless design allows for simple SMT mounting, and their dimensions comply with EIA standards for automatic assembly.
- Product Code: CBM
- Product Description: Multilayer Chip Ferrite Ultra-High Current Beads
- Material: Ferrite
- Packaging Styles: Tape & Reel (T), Bulk (B)
| Part Number | Dimensions (LWT mm) | Impedance () | Packaging Style | DC Resistance ()Max | Rated Current (mA)Max |
| CBM060303X220T | 0.60.30.3 | 22 | T | 0.040 | 1800 |
| CBM060303X330T | 0.60.30.3 | 33 | T | 0.055 | 1500 |
| CBM060303X800T | 0.60.30.3 | 80 | T | 0.130 | 1000 |
| CBM060303X121T | 0.60.30.3 | 120 | T | 0.160 | 900 |
| CBM100505U000T | 1.00.50.5 | 0 | T | 0.02 | 2000 |
| CBM100505U050T | 1.00.50.5 | 5 | T | 0.02 | 2000 |
| CBM100505U101T | 1.00.50.5 | 100 | T | 0.15 | 1000 |
| CBM100505U102T | 1.00.50.5 | 1000 | T | 0.65 | 300 |
| CBM160808U000T | 1.60.80.8 | 0 | T | 0.01 | 6000 |
| CBM160808U150T | 1.60.80.8 | 15 | T | 0.01 | 6000 |
| CBM160808U101T | 1.60.80.8 | 100 | T | 0.06 | 2500 |
| CBM160808U102T | 1.60.80.8 | 1000 | T | 0.35 | 700 |
| CBM201209U000T | 2.01.20.9 | 0 | T | 0.01 | 6000 |
| CBM201209U150T | 2.01.20.9 | 15 | T | 0.01 | 6000 |
| CBM201209U101T | 2.01.20.9 | 100 | T | 0.045 | 4000 |
| CBM201209U102T | 2.01.20.9 | 1000 | T | 0.12 | 1500 |
| CBM321609U000T | 3.21.60.9 | 0 | T | 0.01 | 6000 |
| CBM321609U150T | 3.21.60.9 | 15 | T | 0.015 | 6000 |
| CBM321609U101T | 3.21.60.9 | 100 | T | 0.035 | 4000 |
| CBM321609U102T | 3.21.60.9 | 1000 | T | 0.12 | 2100 |
| CBM322513U110T | 3.22.51.3 | 11 | T | 0.02 | 6000 |
| CBM322513U150T | 3.22.51.3 | 15 | T | 0.02 | 6000 |
| CBM322513U121T | 3.22.51.3 | 120 | T | 0.03 | 5000 |
| CBM322513U102T | 3.22.51.3 | 1000 | T | 0.23 | 2500 |
| CBM451616U190T | 4.51.61.6 | 19 | T | 0.009 | 6000 |
| CBM451616U600T | 4.51.61.6 | 60 | T | 0.009 | 6000 |
| CBM451616U800T | 4.51.61.6 | 80 | T | 0.025 | 3000 |
| CBM453215U190T | 4.53.21.5 | 19 | T | 0.01 | 6000 |
| CBM453215U600T | 4.53.21.5 | 60 | T | 0.01 | 6000 |
| CBM453215U101T | 4.53.21.5 | 100 | T | 0.02 | 6000 |
| CBM453215U501T | 4.53.21.5 | 500 | T | 0.08 | 4000 |
| Item | Requirements | Test Methods and Remarks |
| Operating Temperature Range | -55+125 | Includes product surface temperature rise |
| Solder ability | No visible damage; 95% or more of electrode area shall be coated by new solder. | Preheating temperature:120~150, Preheating time: 60s, Solder: 96.5%Sn/3.0%Ag/0.5%Cu, Solder temperature: 2455, Immersion tin depth:10mm, Duration: 51s |
| Resistance to Soldering Heat | At least 95% of terminal electrode should be covered with solder. No mechanical damage. Impedance change: within 30%. | Preheating temperature: 120~150, Preheating time: 60s, Solder: 96.5%Sn/3.0%Ag/0.5%Cu, Solder temperature: 2605, Immersion tin depth:10mm, Duration: 101s |
| Adhesion of electrode | The termination and body should be no damage. | Applied force: 5N for 1005 series; 7N for 1608 series; 10N for 2012, 3216 series; 15N for 3225, 4532 series. Keep time: 101S |
| Low temperature resistance | No mechanical damage. Impedance change: within 30%. | Temperature: -552, Testing time: 10000 +24 h |
| Bending strength | No mechanical damage | Testing board: glass epoxy-resin substrate, Forcing speed: 0.5mm/s, Deflection: 2mm, Duration: 20s1s |
2411251503_FH-CBM160808U600T_C394426.pdf
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