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quality Compact FH 6124CG101J500NT MLCC arrays designed for space saving and simplified installation on PCBs factory
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quality Compact FH 6124CG101J500NT MLCC arrays designed for space saving and simplified installation on PCBs factory
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Specifications
Capacitance:
100pF
Circuit Type:
Independent
Temperature Coefficient:
C0G
Tolerance:
±5%
Voltage Rating:
50V
Number of Capacitors:
4
Mfr. Part #:
6124CG101J500NT
Package:
0612
Key Attributes
Model Number: 6124CG101J500NT
Product Description

Product Overview

The MLCC_Arrays (C-ARRAY SERIES) are high-density chip capacitors designed to save space and improve assembly efficiency on PCBs. They offer higher capacitance per volumetric area, reduce mounting times, lower manufacturing costs, and simplify installation with SMT packaging. These capacitors are ideal for space-constrained applications like notebook computers, PDAs, and cordless phones, particularly in input/output interface circuits.

Product Attributes

  • Brand: GH
  • Product Name: MLCC_Arrays (C-ARRAY SERIES)
  • Certifications: GH/T 21041-2007, GH/T 21042-2007

Technical Specifications

ModelProduct Size (inch)Elements InsideDielectric StyleCapacitance (pF)Capacitance ToleranceRated Voltage (V)Terminal MaterialPackage StyleTemperature Coefficient / CharacteristicsOuter Dimensions (mm) L x W x T
61240.06 x 0.124COG, X7R, X5R, Z5U, Y5V0.5pF to 100nF0.05pF, 0.10pF, 0.25pF, 0.5pF, 1.0%, 2.0%, 5.0%, 10%, 20%, +50%/-20%, +80%/-20%16V, 25V, 50V, 100VS (Silver), C (Copper), N (Nickel Barrier)B (Bulk Bag), T (Taping Package)COG: 030 ppm/ (-55~125)
X7R: 15% (-55~125)
X5R: 15% (-55~85)
Z5U: -56%~+22% (10~85)
Y5V: -80%~+30% (-25~85)
1.600.20 x 3.200.20 x 0.800.10
50840.05 x 0.084COG, X7R, X5R, Z5U, Y5V0.5pF to 220nF0.05pF, 0.10pF, 0.25pF, 0.5pF, 1.0%, 2.0%, 5.0%, 10%, 20%, +50%/-20%, +80%/-20%16V, 25V, 50VS (Silver), C (Copper), N (Nickel Barrier)B (Bulk Bag), T (Taping Package)COG: 030 ppm/ (-55~125)
X7R: 15% (-55~125)
X5R: 15% (-55~85)
Z5U: -56%~+22% (10~85)
Y5V: -80%~+30% (-25~85)
1.250.20 x 2.000.20 x 0.800.10
50820.05 x 0.082COG, X7R, X5R, Z5U, Y5V0.5pF to 220nF0.05pF, 0.10pF, 0.25pF, 0.5pF, 1.0%, 2.0%, 5.0%, 10%, 20%, +50%/-20%, +80%/-20%16V, 25V, 50VS (Silver), C (Copper), N (Nickel Barrier)B (Bulk Bag), T (Taping Package)COG: 030 ppm/ (-55~125)
X7R: 15% (-55~125)
X5R: 15% (-55~85)
Z5U: -56%~+22% (10~85)
Y5V: -80%~+30% (-25~85)
1.250.20 x 2.000.20 x 0.800.10

Reliability Test

ItemTechnical SpecificationTest Method and Remarks
CapacitanceClass : Should be within the specified tolerance.
Class : Should be within the specified tolerance.
Measuring Frequency: 1MHz10% (1000pF), 1KHz10% (1000pF) for Class .
Measuring Voltage: 1.00.2Vrms (1000pF), 1.00.2Vrms (Class , C10F), 0.50.1Vrms (Class , C10F).
Test Temperature: 253.
Dissipation Factor (DF, tan)Class : 0.56% (Cr5pF), 1.5[(150/Cr)+7]10-4 (5pFCr50pF), 0.15% (50pFCr1000pF), 0.15% (1000pF).
Class (X7R): 2.5% (50V), 3.5% (25V), 5.0% (16V), 5.0% (10V), 7.5% (6.3V).
Class (Y5V): 7.0% (C1.0F, 25V), 9.0% (C1.0F, 25V), 15% (16V), 15% (10V), 15% (6.3V).
Measuring Frequency: 1MHz10% for Class .
Measuring Frequency: 1KHz10% (C10F), 12024 Hz (C10F) for Class .
Measuring Voltage: 1.00.2Vrms (Class , C10F), 0.50.1Vrms (Class , C10F).
Insulation Resistance (IR)Class : C10 nF, Ri50000M; C10 nF, Ri CR500S.
Class (X7R): C25 nF, Ri10000M; C25 nF, Ri CR100S.
Class (Y5V): C25 nF, Ri4000M; C25 nF, Ri CR100S.
Measuring Voltage: Rated Voltage. Duration: 605s. Test Humidity: 75%. Test Temperature: 253. Test Current: 50mA.
Dielectric Withstanding Voltage (DWV)No breakdown or damage.Measuring Voltage: Class:300% Rated voltage; Class:250% Rated voltage. Duration: 15s. Charge/ Discharge Current: 50mA max.
SolderabilityAt least 95% of the terminal electrode is covered by new solder. Visual Appearance: No visible damage.Preheating: 80~120 for 10~30s. Lead solder: 2355 for 20.5s. Lead-free solder: 2455 for 20.5s.
Resistance to Soldering HeatC/C: 0.5% (NPO to SL), -5~+10% (X7R), -10~+20% (Y5V). DF & IR: Same to initial value. Appearance: No visible damage. Solderability: 95%.Preheating: 100~200 for 102min. Solder Temperature: 2655 for 101s. Recovery: 242h at room temperature.
Resistance to Flexure of Substrate (Bending Strength)Appearance: No visible damage.Test Board: Al2O3 or PCB. Warp: 1mm. Speed: 1mm/sec. Measurement in bending position. C/C: 10%.
Termination AdhesionAppearance: No visible damage.Applied Force: 5N. Duration: 101S.
Temperature CycleC/C: Class: 1% or 1pF (whichever is larger). Class: B: 10%, F: 20%.5 cycles: Low temp (-55/ -25/+10) for 30min, Normal temp (+20) for 2-3min, High temp (+125/ +85) for 30min, Normal temp (+20) for 2-3min. Recovery: 242h.
Humidity LoadC/C: Class: 7.5% or 0.75pF (whichever is larger). Class: B: 12.5%, F: 30%. DF: Not more than twice initial value. IR: Class (Ri5000M or Ri CR50S). X7R (Ri1000M or Ri CR10S). Y5V (Ri400M or Ri CR10S). Appearance: No visible damage.Temperature: 402. Humidity: 90~95%RH. Voltage: Rated Voltage. Duration: 500h. Recovery: 24h (Class 1) or 48h (Class 2).
Life TestC/C: Class: 2% or 1pF (whichever is larger). Class: B: 20%, F: 30%. DF: Not more than twice initial value. IR: Class (Ri4000M or Ri CR40S).Applied Voltage: 2 Rated Voltage. Duration: 1000h. Temperature: 125 (NPO, X7R), 85 (Y5V). Charge/ Discharge Current: 50mA max. Recovery: 24h (Class 1) or 48h (Class 2).

2410121231_FH-6124CG101J500NT_C1322399.pdf

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