MLCC Arrays
MLCC Arrays are monolithic, laminated ceramic capacitors designed for high reliability and excellent soldering performance, suitable for both reflow and wave soldering. They offer high and stable capacitance, significantly saving PCB space (up to 50%) and improving assembly density. By consolidating multiple capacitors into a single unit, they reduce mounting times, increase efficiency, and lower overall costs by minimizing placement, production time, equipment management, and PCB expenses. These arrays are easy to pick and place with SMT packaging and high-speed mounting machines, enhancing printed board efficiency by reducing printed circuits and increasing operating speed. They are compliant with GB/T 21041-2007 and GB/T 21042-2007 standards.
Product Attributes
- Brand: FENGHUA (implied)
- Certifications: GB/T 21041-2007, GB/T 21042-2007
Technical Specifications
| Item | Specification | Test Method and Remarks |
| Capacitance (Class I) | Should be within the specified tolerance. Measuring Frequency: 1MHz10% (1000pF), 1KHz10% (1000pF). Measuring Voltage: 1.00.2Vrms. | |
| Capacitance (Class II) | Should be within the specified tolerance. Test Temperature: 253. Test Frequency: 1KHz10%. Test Voltage: 1.00.2Vrms. | |
| Insulation Resistance (IR) (Class I) | C10 nF, Ri50000M; C10 nF, RiCR500S. Measuring Voltage: Rated Voltage. Duration: 605s. Test Humidity: 75%. Test Temperature: 253. | |
| Insulation Resistance (IR) (Class II) | C25 nF, Ri10000M; C25 nF, RiCR100S. | |
| Dissipation Factor (DF, tan) (Class I) | DF 1/(400+20C) (C30 pF), Measuring Frequency: 1MHz10%. Measuring Voltage: 1.00.2Vrms. DF 0.1% (C30pF). | |
| Dissipation Factor (DF, tan) (Class II) | X7R: 50V 25010-4; 25V 35010-4; 16V 50010-4. Test Temperature: 253. Test Frequency: 1KHz10%. Test Voltage: 1.00.2Vrms. | |
| Dielectric Withstanding Voltage (DWV) | No breakdown or damage. Measuring Voltage: Class: 300% Rated Voltage; Class: 250% Rated Voltage. Duration: 1~5s. Charge/ Discharge Current: 50mA max. | |
| Termination Adhesion | No visible damage. Slowly apply a 5N force (T) to the side porcelain body and hold for 60+1 seconds. | |
| Solderability | At least 95% of the terminal electrode is covered by new solder. Visual Appearance: No visible damage. Preheating conditions: 80 to 120; 10~30s. Lead-free soldering Solder Temperature: 2455. Duration: 20.5s. | |
| Resistance to Soldering Heat | C/C 2.5% or 0.25PF, whichever is larger (Class I); 15% (Class II). DF same to initial value. IR same to initial value. Appearance: No visible damage. At least 95% of the terminal electrode is covered by new solder. Preheating conditions: 100 to 200; 60-120s. Solder Temperature: 2655. Duration: 101s. Recovery Time: 242h. Recovery condition: Room temperature. | |
| Resistance to Flexure of Substrate (Bending Strength) | C/C: Class: 5% or 0.5pF, whichever is larger. Class: 10%. Appearance: No visible damage. Test Board: PCB. Warp: 1mm. Speed: 1mm/sec. Measurement should be made with the board in the bending position. | |
| Temperature Cycle | C/C: Class: 1% or 1pF, whichever is larger. Class: -15% ~ +15%. Appearance: No visible damage. Cycling Times: 5 times. Steps: Low-category temp. (-55 for 30min), Normal temp. (+20 for 2-3min), Up-category temp. (+125 for 30min), Normal temp. (+20 for 2-3min). Recovery time after test: 242h. | |
| Humidity Load | C/C: Class: 7.5% or 0.75pF, whichever is larger. Class: 12.5%. DF 2 times initial value. IR Class: Ri5000M or RiCR50S whichever is smaller. Class: Ri1000M or RiCR10S whichever is smaller. Appearance: No visible damage. Temperature: 402. Humidity: 90~95%RH. Voltage: Rated Voltage. Duration: 500h. Recovery conditions: Room temperature. Recovery Time: 24h2h. | |
| Life Test | C /C: Class I 3% or 0.3pF, whichever is larger. Class II -20% ~ +20%. DF 2 times initial value. IR Class I: Ri4000M or RiCR40S whichever is smaller. |
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