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Specifications
Normal temperature Frequency Tolerance:
±10ppm
Operating Temperature:
-40℃~+85℃
Load Capacitance:
10pF
Equivalent Series Resistance(ESR):
80Ω
Frequency:
24MHz
Mfr. Part #:
Q24FA20H00491
Package:
SMD2520-4P
Key Attributes
Model Number:
Q24FA20H00491
Product Description
Product Overview
This document details the specifications for the FA-20H crystal unit, product number Q24FA20H0049100. This product complies with the RoHS Directive and is designed for general consumer electronics. It is not intended for high-reliability applications such as weapons of mass destruction, military purposes, satellites, rockets, space life support, or medical equipment.
Product Attributes
- Brand: Seiko Epson Corporation
- Certifications: RoHS Directive compliant
Technical Specifications
| Item | Symbol | Value/Rating | Unit | Conditions | Notes |
|---|---|---|---|---|---|
| Absolute maximum ratings | T_stg | -40 to +125 | C | Depends on the Environmental characteristics specifications. | |
| Operating range | T_use | -40 to +85 | C | ||
| DL | 100 to 200 | W | Recommended: 100 W | ||
| Static characteristics | f_nom | 24 | MHz | Fundamental | |
| f_tol | 10 10-6 | CL = 10pF, Ta = +25 3C, DL = 100 W (Not include aging) | |||
| R1 | 48 | circuit, IEC 60444-2, Ta = Operating temperature range, DL = 100 W | |||
| C0 | 2.0 | Max. pF | circuit and N.A. | ||
| f_tem | 20 10-6 | Ta = Operating temperature range (Ref. at Ta = +25 C 3 C), DL = 100 W | |||
| IR | 500 | Min. M | DC 100 V15, 60 seconds, Between terminal # 1 and terminal # 3 | ||
| f_age | 1 (12 < f_nom 40 MHz) 10-6/year | Ta = +25 C 3 C | |||
| Environmental and mechanical characteristics | Shock | 2 (12 < f_nom 40 MHz) 5 (40 < f_nom 48 MHz) | [1 10-6] | 150 g, dummy Jig (ETC Standard) drop from 1 500 mm height on the Concrete, 3 directions, 10 times | *3 |
| Vibration | 2 (12 < f_nom 40 MHz) 5 (40 < f_nom 48 MHz) | [1 10-6] | 10 Hz to 55 Hz amplitude 0.75 mm, 55 Hz to 500 Hz acceleration 98 m/s, 10 Hz 500 Hz 10 Hz, 15 min./cycle, 6 h (2 hours , 3 directions) | *3 | |
| High temperature storage | 2 (12 < f_nom 40 MHz) 5 (40 < f_nom 48 MHz) | [1 10-6] | + 85 C 1 000 h | *3 | |
| Low temperature storage | 2 (12 < f_nom 40 MHz) 5 (40 < f_nom 48 MHz) | [1 10-6] | - 40 C 1 000 h | *3 | |
| Temperature cycle | 2 (12 < f_nom 40 MHz) 5 (40 < f_nom 48 MHz) | [1 10-6] | - 40 C + 85 C, 30 minutes at each temp., 100 cycle | *3 | |
| Temperature humidity storage | 2 (12 < f_nom 40 MHz) 5 (40 < f_nom 48 MHz) | [1 10-6] | + 85 C 85 %RH 1 000 h | *3 | |
| Resistance to soldering heat | 2 (12 < f_nom 40 MHz) 5 (40 < f_nom 48 MHz) | [1 10-6] | For convention reflow soldering furnace (3 times) | ||
| Substrate bending | No peeling-off at a soldered part | Bend width reaches 3 mm and hold for 5 s 1 s 1 time, Ref. IEC 60068-2-21 | |||
| Shear | No peeling-off at a soldered part | 10 N press for 10 s 1 s, Ref. IEC 60068-2-21 | |||
| Pull off | No peeling-off at a soldered part | 10 N press for 10 s 1 s, Ref. IEC 60068-2-21 | |||
| Solderability | Terminals must be 95 % covered with fresh solder. | Dip termination into solder bath at + 235 C 5 C for 5 s (Using Rosin Flux) |
2410121607_EPSON-Q24FA20H00491_C255953.pdf
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