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Specifications
Mfr. Part #:
Q22FA23V00019
Package:
SMD3225-4P
Key Attributes
Model Number:
Q22FA23V00019
Product Description
Product Overview
The FA-238V is a crystal unit designed as a component for general consumer electronics equipment. It complies with the RoHS Directive and is delivered by Seiko Epson Corporation to DELTA ELECTRONICS, INC. This product is not intended for use in applications requiring extremely high reliability, such as weapons of mass destruction, military purposes, or critical life-support systems.
Product Attributes
- Brand: SEIKO EPSON CORPORATION
- Origin: Japan
- Certifications: RoHS Directive compliant
Technical Specifications
| Item | Symbol | Rating Value | Unit | Conditions | Notes |
|---|---|---|---|---|---|
| Absolute maximum ratings | T_stg | -40 to +125 | C | Depends on the Environmental characteristics specifications. | |
| Operating range | T_use | -20 to +70 | C | ||
| DL | 1 to 100 | 200 W | |||
| Static characteristics | f_o | 12 | MHz | Fundamental | |
| f_tol | 50 x 10-6 | CL = 10 pF, Ta = +25 C, DL : 100 W (Not include aging) | |||
| R1 | 100 | Max. | Max. circuit IEC 60444-2, Ta = Operating temperature range, DL : 100 W | ||
| C0 | 5.0 | Max. pF | circuit and N.A. | ||
| f_tem | 30 x 10-6 | Ta = Operating temperature range (Ref. at Ta = +25 C 3 C), DL : 100 W | |||
| IR | 500 | Min. M | DC 100 V, 15, 60 seconds between each terminals | ||
| f_age | 5 x 10-6/year | Ta = +25 C 3 C | |||
| Environmental and mechanical characteristics | Shock | 10 to 100 g | 100 g dummy Jig (Seiko Epson Standard) drop from 1 500 mm height on the Concrete, 3 directions, 10 times | f / f [1 x 10-6] 10 | |
| Vibration | 10 Hz to 55 Hz amplitude 0.75 mm, 55 Hz to 500 Hz acceleration 98 m/s2, 10 Hz to 500 Hz 15 min./cycle, 6 h (2 hours, 3 directions) | f / f [1 x 10-6] 5 | |||
| High temperature storage | +85 C | 1 000 h | f / f [1 x 10-6] 5 | ||
| Low temperature storage | -40 C | 1 000 h | f / f [1 x 10-6] 5 | ||
| Temperature cycle | -40 C to +85 C | 30 minutes at each temp., 100 cycle | f / f [1 x 10-6] 5 | ||
| Temperature humidity storage | +85 C, 85 %RH | 1 000 h | f / f [1 x 10-6] 10 | ||
| Resistance to soldering heat | For convention reflow soldering furnace (3 times) | Shift motional resistance at after above tests should be less than 20 % or less than 10 . | |||
| Substrate bending | Bend width reaches 3.0 mm and hold for 5 s, 1 s, 1 time, Ref. IEC 60068-2-21 | No peeling-off at a soldered part | |||
| Shear | 10 N press for 10 s, 1 s, Ref. IEC 60068-2-21 | No peeling-off at a soldered part | |||
| Pull off | 10 N press for 10 s, 1 s, Ref. IEC 60068-2-21 | No peeling-off at a soldered part | |||
| Solderability | Dip termination into solder bath at +235 C 5 C for 5 s (Using Rosin Flux) | Terminals must be 95 % covered with fresh solder. |
2410121449_EPSON-Q22FA23V00019_C2924281.pdf
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