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Specifications
Normal temperature Frequency Tolerance:
±20ppm
Load Capacitance:
18pF
Operating Temperature:
-40℃~+85℃
Equivalent Series Resistance(ESR):
100Ω
Frequency:
12MHz
Mfr. Part #:
Q22FA23V00418
Package:
SMD3225-4P
Key Attributes
Model Number:
Q22FA23V00418
Product Description
Product Overview
The FA-238V is a crystal unit designed as a component for general consumer electronics equipment. It is RoHS compliant and manufactured by SEIKO EPSON CORPORATION. This product is not intended for high-reliability applications such as life support, satellite, rocket, or other space life systems.
Product Attributes
- Brand: SEIKO EPSON CORPORATION
- Origin: Japan
- Certifications: RoHS Directive
Technical Specifications
| Item | Symbol | Value | Unit | Conditions | Note |
|---|---|---|---|---|---|
| Absolute Maximum Ratings | |||||
| Storage temperature range | T_stg | -40 to +125 | C | Depends on the Environmental characteristics specifications. | |
| Operating Range | |||||
| Operating temperature range | T_use | -40 to +85 | C | Depends on the Motional resistance and Frequency temperature characteristics specifications. | |
| Level of drive | DL | 100 to 200 | W | Recommended: 100 W | |
| Static Characteristics | |||||
| Nominal Frequency | f_nom | 12 | MHz | Fundamental | |
| Frequency tolerance | f_tol | 20 10-6 | CL = 18 pF, Ta = +25 3 C, DL: 100 W | Not include aging | |
| Motional resistance | R1 | 100 Max. | circuit IEC 60444-2, Ta = -40 C ~ +85 C, DL: 100 W | ||
| Shunt capacitance | C0 | 5.0 Max. | pF | circuit and N.A. | |
| Frequency temperature characteristics | f_tem | 20 10-6 | Ta = -40 C ~ +85 C (Ref. at Ta = +25 C 3 C), DL: 100 W | ||
| Isolation resistance | IR | 500 Min. | M | DC 100 V15, 60 seconds between each terminals | |
| Frequency Aging | f_age | 5 10-6/year | Ta = +25 C 3 C | ||
| Environmental and Mechanical Characteristics | |||||
| Shock | f / f [1 10-6] 10 | 100 g dummy Jig (ETC Standard) drop from 1500 mm height on the Concrete, 3 directions, 10 times | *1, *2, *3 | ||
| Vibration | f / f [1 10-6] 5 | 10 Hz to 55 Hz amplitude 0.75 mm, 55 Hz to 500 Hz acceleration 98 m/s, 10 Hz 500 Hz 10 Hz 15 min./cycle, 6 h (2 hours, 3 directions) | *1, *2, *3 | ||
| High temperature storage | f / f [1 10-6] 5 | +85 C 1000 h | *1, *2, *3 | ||
| Low temperature storage | f / f [1 10-6] 5 | -40 C 1000 h | *1, *2, *3 | ||
| Temperature cycle | f / f [1 10-6] 5 | -40 C +85 C, 30 minutes at each temp., 100 cycle | *1, *2, *3 | ||
| Temperature humidity storage | f / f [1 10-6] 10 | +85 C 85 %RH 1000 h | *1, *2, *3 | ||
| Resistance to soldering heat | f / f [1 10-6] 5 | For convention reflow soldering furnace (3 times) | *1, *2 | ||
| Substrate bending | No peeling-off at a soldered part | Bend width reaches 3.0 mm and hold for 5 s 1 s 1 time, Ref. IEC 60068-2-21 | *1, *2 | ||
| Shear | No peeling-off at a soldered part | 20 N press for 10 s 1 s, Ref. IEC 60068-2-21 | *1, *2 | ||
| Pull off | No peeling-off at a soldered part | 10 N press for 10 s 1 s, Ref. IEC 60068-2-21 | *1, *2 | ||
| Solderability | Terminals must be 95 % covered with fresh solder. | Dip termination into solder bath at +235 C 5 C for 5 s (Using Rosin Flux) | *1, *2 | ||
| Dimensions and Circuit | |||||
| Dimensions | Terminal Au plate: 1.5 m Max. | mm | |||
| Circuit | #1, #3: XTAL, #2, #4: GND (connected to the cover) | ||||
| Recommended Soldering Pattern and Marking Layout | |||||
| Recommended soldering pattern | mm | ||||
| Marking layout | Nominal frequency: e.g., 12 MHz [1200] | ||||
| Taping Specification | |||||
| Tape dimensions | TE0804L | Subject to EIA-481 & IEC-60286 | |||
| Reel dimensions | 180.00 1 | mm | |||
| Packing | 4000 pcs./reel | ||||
| Peel force of the cover tape | 0.1 to 1 N | Angle: 165 to 180, Speed: 300 mm/min. | |||
2410121457_EPSON-Q22FA23V00418_C91749.pdf
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