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Specifications
Mfr. Part #:
LSF1210-8R2J-T
Package:
1210
Key Attributes
Model Number:
LSF1210-8R2J-T
Product Description
Product Overview
The LSF1210-Series Ferrite Chip Inductor is designed for reliable performance in electronic applications. This specification outlines the product details, electrical characteristics, reliability testing, and packaging information for the LSF1210-Series to be delivered to the user.
Product Attributes
- Brand: EMTEK
- Product Name: LSF1210-Series Ferrite Chip Inductor
- Origin: Taiwan, R.O.C.
- Core Material: Ferrite core
- Wire Material: Copper wire
- Epoxy Material: UV Epoxy (Red)
Technical Specifications
| Product Name | Inductance (uH) | Tolerance | Q/MHz (Min.) | SRF (Typ.) (MHz) | Rdc () Max. | Idc Max. (mA) | Taping Type |
| LSF1210-8R2J-T | 8.2 | J=5% | 600/7.9 | 160 | 1.60 | 600 | T |
| LSF1210-8R2K-T | 8.2 | K=10% | 600/7.9 | 160 | 1.60 | 600 | T |
| LSF1210-8R2M-T | 8.2 | M=20% | 600/7.9 | 160 | 1.60 | 600 | T |
Dimensions
| Parameter | Max. / Ref. (mm) |
| A | 3.60 |
| B | 2.90 |
| C | 2.50 |
| D | 1.10 |
| E | 0.5 0.1 |
Reliability Test Summary
| Test Item | Conditions | Acceptance Criteria |
| Solderability | Dip pads in flux and dip in solder pot (96.5 Sn/3.5 Ag solder) at 255C 5C. | 90% minimum solder coverage. |
| Resistance to Solder Process | Reflowed onto a PC board using 96.5 Sn/3.5 Ag solder paste. Max. temp. 260C for 10 seconds. | No case deformation or change in dimensions. Inductance must not change more than stated tolerance. |
| Vibration | Frequency: 10~50 Hz, Amplitude: 1.5mm, 3 directions for 2 hours each (total 6 hours). | No case deformation or change in dimensions. Inductance must not change more than stated tolerance. |
| High temperature resistance | 1052 for 50012 hours. Measure after 2 hours at room temp/humidity. | No case deformation or change in dimensions. Inductance must not change more than stated tolerance. |
| Static Humidity | 852 and 90 to 95%RH for ten 24-hours. Measure after 2 hours at room temp/humidity. | No shorted or open winding. |
| Component adhesion (push test) | Subjected to 1.8Kg force. | Withstand stated force without failure of termination. |
| Soldering heat resistance | 96.5 Sn/3.5 Ag solder paste:>217C for 90 seconds. | N/A (Implied to withstand). |
| Low temperature resistance | -252 for 50012 hours. Measure after 1-2 hours at room temp/humidity. | No case deformation or change in dimensions. Inductance must not change more than stated tolerance. |
| Resistance to solvent and water | Withstand 6 minutes of alcohol. | No case deformation, change in dimensions, or obliteration of marking. |
| Thermal Shock | 10 cycles: -25 (30 min) to 105 (30 min). Measure after 2 hours at room temp/humidity. | No case deformation or change in dimensions. Inductance must not change more than stated tolerance. |
Packaging
Packaging is designed to prevent damage during transport and storage.
Recommended Soldering Conditions
Recommended for reflow soldering.
Operating and Storage Conditions
- Operating Temperature Range: -25 to +105
- Storage Condition: Temperature 20~25, Relative Humidity 40%~60%
2409301212_EMTEK-LSF1210-8R2J-T_C252066.pdf
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