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Specifications
Load Capacitance:
10pF
Frequency:
28.63636MHz
Mfr. Part #:
X1E0003410465
Package:
SMD3225-4P
Key Attributes
Model Number:
X1E0003410465
Product Description
SEIKO EPSON CORPORATION Crystal FA-238A
The SEIKO EPSON CORPORATION FA-238A is a crystal component designed for general consumer electronics. It conforms to the automotive part standard "AEC-Q200" and is authorized for use in automobile navigation systems. This product complies with the RoHS Directive.
Product Attributes
- Brand: SEIKO EPSON CORPORATION
- Model: FA-238A
- Product No.: X1E000341046500
- Origin: Japan
- Certifications: RoHS Directive, AEC-Q200
Technical Specifications
| Item | Symbol | Value | Unit | Conditions | Note |
| Storage temperature range | T_stg | -40 to +125 | C | Depends on the Environmental characteristics specifications. | Min. Typ. Max. |
| Operating temperature range | T_use | -40 to +85 | C | Min. Typ. Max. | |
| Level of drive | DL | 1 to 200 | W | Min. Typ. Max. | |
| Nominal Frequency | f_nom | 28.63636 | MHz | Fundamental | |
| Frequency tolerance | f_tol | +20 to -10 | 10-6 | CL = 10 pF, Ta = +25 C, DL : 100 W (Not include aging) | |
| Motional resistance | R1 | 50 | Max. | Ta = Operating temperature range, DL : 100 W | |
| Shunt capacitance | C0 | 5 | Max. pF | ||
| Frequency temperature characteristics | f_tem | 30 | 10-6 | Ta = Operating temperature range (Ref. at Ta = +25 C), DL : 100 W | |
| Unwanted responses | RS/R1 | 6 | Min. dB | f_nom 10 % | |
| Isolation resistance | IR | 500 | Min. M | DC 100 V, 60 seconds between each terminals (#1, #3) | |
| Frequency Aging | f_age | 5 | Max. 10-6/year | Ta = +25 C (first year, no bias) | |
| Shock | f / f [1 10-6] | 5 | 100 g dummy Jig (Epson Standard) drop from 1 500 mm height on the Concrete, 3 directions, 10 times | *1 *2 *3 | |
| Vibration | f / f [1 10-6] | 5 | 10 Hz to 55 Hz amplitude 0.75 mm, 55 Hz to 500 Hz acceleration 98 m/s2, 10 Hz to 500 Hz, 15 min./cycle, 6 h (2 hours, 3 directions) | *1 *2 *3 | |
| High temperature storage | f / f [1 10-6] | 10 | +125 C, 1 000 h | *1 *2 *3 | |
| Low temperature storage | f / f [1 10-6] | 5 | -40 C, 1 000 h | *1 *2 *3 | |
| Temperature cycle | f / f [1 10-6] | 10 | -40 C to +125 C, 30 minutes at each temp., 1 000 cycle | *1 *2 *3 | |
| Temperature humidity storage | f / f [1 10-6] | 5 | +85 C, 85 %RH, 1 000 h | *1 *2 *3 | |
| Resistance to soldering heat | 3 | For convention reflow soldering furnace (3 times) | |||
| Substrate bending | No peeling-off at a soldered part | Bend width reaches 3.0 mm and hold for 20 s 1 s, 1 time | Ref. IEC 60068-2-21 | ||
| Shear | No peeling-off at a soldered part | 10 N press for 10 s 1 s | Ref. IEC 60068-2-21 | ||
| Pull off | No peeling-off at a soldered part | 10 N press for 10 s 1 s | Ref. IEC 60068-2-21 | ||
| Solderability | Terminals must be 95 % covered with fresh solder. | Dip termination into solder bath at +235 C 5 C for 5 s (Using Rosin Flux) |
2410121457_EPSON-X1E0003410465_C3028879.pdf
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