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quality SMD Dielectric Ceramic Filter ECS ECS-DCF-107 Monoblock Type with Electrical Performance and RoHS Directive factory
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quality SMD Dielectric Ceramic Filter ECS ECS-DCF-107 Monoblock Type with Electrical Performance and RoHS Directive factory
quality SMD Dielectric Ceramic Filter ECS ECS-DCF-107 Monoblock Type with Electrical Performance and RoHS Directive factory
quality SMD Dielectric Ceramic Filter ECS ECS-DCF-107 Monoblock Type with Electrical Performance and RoHS Directive factory
>
Specifications
Frequency - Center:
5.4925GHz
Mfr. Part #:
ECS-DCF-107
Key Attributes
Model Number: ECS-DCF-107
Product Description

DIELECTRIC CERAMIC FILTER

This specification covers the characteristics of the dielectric ceramic filter, type ECS-DCF-107. It is a Surface Mount Device (SMD) dielectric ceramic monoblock construction, conforming to RoHS directive and national environment protection laws. Designed for applications requiring precise filtering characteristics.

Product Attributes

  • Brand: ECS Inc. International
  • Part Number: ECS-DCF-107
  • Construction: SMD dielectric ceramic Monoblock
  • Certifications: RoHS directive, national environment protection law

Technical Specifications

Item Requirement Details
ELECTRICAL SPECIFICATIONS
Center frequency MHz 5492.5
Bandwidth [BW] MHz 5150-5835
Insertion Loss in BW dB max 3.0@5825-5835@25
2.7@5150-5825@25
3.5@5825-5835@-4085
3.2@5150-5825@-4085
Ripple in BW dB max 2.5
Return Loss in BW dB min 9.0
Attenuation[Absolute Value] dB min 45.0 @ 5925-5990 MHz, 50.0 @ 5990-7125 MHz
Input Power W max. 1
In/Out Impedance ohm 50
RATING
Withstand DC Voltage (1min max) 50V
Insulation Resistance (10V, 1min5s) 100 M min.
Storage temperature -40 +85
Operation Temperature Range -40 +85
ENVIRONMENTAL TESTS (Characteristics after test, Table 1)
Insertion Loss Change dB max 0.3
Ripple Change dB max 0.3
Return loss dB max 2.0
Attenuation Change dB max 4.0
RECOMMENDED SOLDERING CONDITIONS (Pb-Free Assembly)
PREHEAT Temperature Min/Max 150 / 200
PREHEAT Time from 150 60-120 seconds
RAMP-UP Avg. Ramp-up Rate 200 to 260 3/second(max)
REFLOW Temperature 220
REFLOW Total Time above 220 30-100 seconds
PEAK Temperature 260
PEAK Time 3-5 seconds
RAMP-DOWN Rate 2-6/second
Time from 25 to Peak Temperature 8 minutes max
Composition of solder paste Ag3.0/Cu0.5/ Sn

2412061725_ECS-ECS-DCF-107_C6032175.pdf

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