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Quality Wire wound chip power inductor DMBJ PNLS4010-1R0M 1UH designed for VR AR devices and portable gaming factory
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Quality Wire wound chip power inductor DMBJ PNLS4010-1R0M 1UH designed for VR AR devices and portable gaming factory
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Specifications
Current - Saturation (Isat):
2.2A
Mfr. Part #:
PNLS4010-1R0M 1UH
Package:
SMD,4x4mm
Key Attributes
Model Number: PNLS4010-1R0M 1UH
Product Description

PNLS Series Chip Power Inductor

The PNLS Series Chip Power Inductor is a wire-wound inductor designed for a wide range of electronic applications. It features a closed magnetic circuit design for reduced leakage flux and EMI, metallization on the ferrite core for enhanced durability, and low DCR for minimal power loss. Its compact and slim profile minimizes PCB space. This series is widely used in smart phones, set-top boxes, VR/AR devices, notebooks, desktop computers, servers, portable gaming devices, personal navigation systems, and multimedia devices.

Product Attributes

  • Brand: Dongguan Zhenbaojia Electronics Co., Ltd.
  • Product Series: PNLS Series
  • Type: Wire Wound Chip Inductor
  • Origin: Dongguan, China

Technical Specifications

Product TypeExternal Dimensions (LW) (mm)Nominal InductanceInductance ToleranceFig.ABC (max)D (max)E (max)
PNLS2520102.01.6R10, 1R0, 100K (10%), M (20%), N (30%)Fig.12.50.32.00.351.052.10.85
PNLS2520122.01.6R10, 1R0, 100K (10%), M (20%), N (30%)Fig.12.50.32.00.351.252.00.85
PNLS30103.03.0R10, 1R0, 100K (10%), M (20%), N (30%)Fig.13.00.33.00.351.202.50.85
PNLS30123.03.0R10, 1R0, 100K (10%), M (20%), N (30%)Fig.23.00.33.00.351.302.80.90
PNLS30153.03.0R10, 1R0, 100K (10%), M (20%), N (30%)Fig.23.00.33.00.351.502.60.90
PNLS40104.04.0R10, 1R0, 100K (10%), M (20%), N (30%)Fig.24.00.34.00.351.153.51.30
PNLS40124.04.0R10, 1R0, 100K (10%), M (20%), N (30%)Fig.24.00.34.00.351.353.51.30
PNLS40184.04.0R10, 1R0, 100K (10%), M (20%), N (30%)Fig.24.00.34.00.351.803.51.30
PNLS40204.04.0R10, 1R0, 100K (10%), M (20%), N (30%)Fig.24.00.34.00.352.103.51.30
PNLS40264.04.0R10, 1R0, 100K (10%), M (20%), N (30%)Fig.24.00.34.00.352.803.51.30
PNLS40304.04.0R10, 1R0, 100K (10%), M (20%), N (30%)Fig.24.00.34.00.353.003.51.30
PNLS50125.05.0R10, 1R0, 100K (10%), M (20%), N (30%)Fig.25.00.35.00.351.304.01.50
PNLS50205.05.0R10, 1R0, 100K (10%), M (20%), N (30%)Fig.25.00.35.00.352.004.01.50
PNLS50405.05.0R10, 1R0, 100K (10%), M (20%), N (30%)Fig.25.00.35.00.354.004.01.50
PNLS50455.05.0R10, 1R0, 100K (10%), M (20%), N (30%)Fig.25.00.35.00.354.504.01.50
PNLS60126.06.0R10, 1R0, 100K (10%), M (20%), N (30%)Fig.36.00.36.00.351.305.01.65
PNLS60206.06.0R10, 1R0, 100K (10%), M (20%), N (30%)Fig.26.00.36.00.352.005.01.65
PNLS60306.06.0R10, 1R0, 100K (10%), M (20%), N (30%)Fig.36.00.36.00.353.005.01.85
PNLS60456.06.0R10, 1R0, 100K (10%), M (20%), N (30%)Fig.36.00.36.00.354.505.01.65
PNLS60506.06.0R10, 1R0, 100K (10%), M (20%), N (30%)Fig.36.00.36.00.355.305.01.65
PNLS60606.06.0R10, 1R0, 100K (10%), M (20%), N (30%)Fig.36.00.36.00.356.305.01.65
PNLS80408.08.0R10, 1R0, 100K (10%), M (20%), N (30%)Fig.38.00.38.00.354.206.32.45
ParameterSpecification
Operating Temperature Range-40 to +85
Storage Temperature Range-10 to +40, 70% RH
Test Conditions (Standard)Ambient Temperature: 2015, Relative Humidity: 6520%, Air Pressure: 86 kPa to 106 kPa
Test Conditions (If Doubt)Ambient Temperature: 202, Relative Humidity: 655%, Air Pressure: 86kPa to 106 kPa
Solderability95% min. coverage of all metallized area. Solder temp: 2405, Immersion time: 31 sec. Solder: Sn-3Ag-0.5Cu
Resistance to Solder HeatNo visible damage. Electrical and mechanical characteristics shall be satisfied. Solder Temp: 2653, Immersion time: 61 sec. Preheating: 100-150 for 1 min. Measurement after 242 hrs at room temp. Solder: Sn-3Ag-0.5Cu
BendNo deformation. Inductance within 20%, DC resistance meets standard. Test: bend substrate by 2mm, hold for 10s.
VibrationAppearance: no mechanical damage. Inductance change within 20%. Waveform: Sine wave, Frequency: 10~55~10 Hz, Sweep time: 1min, Amplitude: 1.5mm(peak-peak). Axes: X,Y,Z (3 axes). Duration: 2 hrs/axis, total 6 hrs.
Temperature ShockAppearance: no mechanical damage. Inductance change within 20%. Temperature: -40, +85 (30 min each). Cycles: 5. Measurement after 24 hrs at room temp.
Humidity ResistanceAppearance: no mechanical damage. Inductance change within 20%. Humidity: 90-95% RH. Temperature: 602. Applied current: Rated current. Testing time: 1000 (+48,0) hours. Measurement after 24 hrs at room temp.
High Temperature ResistanceAppearance: no mechanical damage. Inductance change within 20%. Temperature: +852. Applied current: Rated current. Testing time: 1000 (+48,0) hours. Measurement after 24 hrs at room temp.
Low Temperature Storage LifeAppearance: no mechanical damage. Inductance change within 20%. Temperature: -402. Testing time: 1000 (+48,0) hours. Measurement after 24 hrs at room temp.
Terminal StrengthNo deformation. Inductance change within 20%. DC resistance meets standard. Test: 10N thrust for 10 sec (2N for 0603[0201]).
DropNo failure after test. Drop on concrete or steel board. Method: free fall. Height: 100cm. Drop direction: 3 directions. Total times: 3 times per direction (9 times total).
Salt MistAppearance: no mechanical damage. Inductance change within 20%. Concentration of salt solution: (50.1)%. PH: 6.5-7.2. Time: 482h.

2204211700_DMBJ-PNLS4010-1R0M-1UH_C2997585.pdf

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