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Specifications
Mfr. Part #:
MPP224J2GD050B200ZR
Package:
Through Hole,P=15mm
Key Attributes
Model Number:
MPP224J2GD050B200ZR
Product Description
Product Overview
The CBB21/MPP series metallized polypropylene film capacitors are designed for electronic equipment with epoxy encapsulation. Featuring a non-inductive winding structure and a self-healing capability, these capacitors offer low loss and minimal internal temperature rise. They are widely used for DC blocking, coupling, decoupling, filtering, bypassing, and other high-frequency, DC, AC, and pulse circuits. The capacitors are constructed with metallized polypropylene film, zinc-tin alloy spray, tinned copper-clad steel leads, and are encapsulated with flame-retardant epoxy resin powder, meeting RoHS environmental requirements.
Product Attributes
- Brand: Dongguan Chengxi Electronics Co., Ltd.
- Product Type: CBB21/MPP Type Metallized Polypropylene Film Capacitor (Impregnated Type)
- Origin: Heyuan Factory, Guangdong Province
- Encapsulation: Flame-retardant Epoxy Resin Powder
- Lead Material: Tinned Copper-Clad Steel Wire
- Environmental Compliance: RoHS, REACH, Halogen-free (if required)
Technical Specifications
| Model/Part Number | Capacitance (uF) | Tolerance (%) | Rated Voltage (V.dc) | Dissipation Factor (DF) (1KHz) | Dimensions (mm) (W x H x T) | Lead Pitch (P) | Lead Diameter (d) | Minimum Length (L) |
|---|---|---|---|---|---|---|---|---|
| MPP224J2GD050B200ZR | 0.22 | 5% | 400 | 0.1% | 17 x 10 x 5.2 | 15.0 | 0.8 | 20.0 |
Electrical Characteristics
| Parameter | Specification | Test Conditions |
|---|---|---|
| Climate Category | 40/105/21 | |
| Operating Temperature Range | -40 to +105 | (+85 to +105: Rated voltage derating 1.25%/) |
| Rated Temperature | 85 | |
| Capacitance Range | 0.001F to 6.8F | |
| Capacitance Tolerance | 5% (J), 10% (K) | |
| Rated Voltage (Vdc) | 100, 160, 250, 400, 630, 1000, 1250, 1600, 2000 | |
| Dissipation Factor (DF) | 0.0010 | (1kHz, 20) |
| Insulation Resistance | 30,000 M for C 0.33uF | (100VDC, 60 seconds) |
| Insulation Resistance | 10,000 M*uF for C > 0.33uF | (100VDC, 60 seconds) |
| Dielectric Strength | 1.6 UR(VDC) | 5 seconds |
Product Structure and Main Materials
| No. | Main Material | Description | Remarks |
|---|---|---|---|
| 1 | Metallized Polypropylene Film | MPPZAH | -/- |
| 2 | Spray Plating Layer | Zinc-tin alloy wire | -/- |
| 3 | Lead Wire | Tinned copper-clad steel wire | -/- |
| 4 | Outer Encapsulation Material | Epoxy resin powder | Flame retardant UL94V-0 |
| 5 | Inner Protective Material | Epoxy resin |
Packaging Information
| Item | Dimensions (L*W*H) |
|---|---|
| Inner Carton | 34.5 x 23.5 x 24.5 cm |
| Outer Carton | 49 x 36 x 27 cm |
Storage Conditions
- Temperature: 35 Max
- Relative Humidity: 80% Max
- Storage Time: Maximum 12 months (from date of production marked on packaging bag)
Product Electrical Characteristics and Test Conditions
| No. | Item | Characteristic | Test Method |
|---|---|---|---|
| 1 | Terminal Strength | Tensile Strength | No visible mechanical damage. Wire diameter: 0.6 & 0.8mm. Load: 10N, Time: 10 seconds. |
| Bending Strength | Wire diameter: 0.6 & 0.8mm. Force: 5N, 90 x 2 times. | ||
| 2 | Solderability | Tinning rate on lead wire 95% | Flux temperature: 2455. Immersion time: 2.50.5 seconds. |
| 3 | Soldering Heat Resistance | Appearance | No visible damage. Solder temperature: 2605. Immersion time: 101 seconds. Recovery time: 1-2 hours. |
| Dissipation Factor Increase | 0.004 (C 1.0F, 10kHz); 0.004 (C > 1.0F, 1kHz) | ||
| Capacitance Change | C/C 3% | ||
| 4 | Temperature Rapid Change | Appearance | No visible damage. 5 cycles of A=-40, B=+105. Duration: t=30min. |
| Vibration | No visible damage. Amplitude 0.75mm or acceleration 98m/s (whichever is smaller), frequency 10-500Hz. Three directions, mutually perpendicular, 2h per direction, total 6h. | ||
| Shock | No visible damage. 4000 times, acceleration 390m/s, pulse duration: 6ms. | ||
| Final Measurement | Appearance: No visible damage. Capacitance Change: C/C 5%. Dissipation Factor Increase: 0.004. Insulation Resistance: IR/IR 50%. | ||
| 5 | Sequential Humidity & Temperature Test | Appearance | No visible damage. Dry heat: +105, 16 hours. Cyclic damp heat (Test Db, first cycle). Cold: -40, 2 hours. Low pressure: 8.5kPa, 1 hour. No permanent breakdown, arcing, or harmful deformation of the casing. Cyclic damp heat (Test Db, remaining cycles). |
| Final Measurement | Appearance: No visible damage. Capacitance Change: C/C 5%. Dissipation Factor Increase: 0.005. Insulation Resistance: IR/IR 50%. | ||
| 6 | Steady State Damp Heat | Appearance | No visible damage. Relative Humidity: 90-95%RH. Temperature: 402. No load, Duration: 21 days. Recovery time: 1-2 hours. |
| Capacitance Change | C/C 5% | ||
| Dissipation Factor Increase | 0.002 (C 1.0F, 10kHz); 0.004 (C > 1.0F, 1kHz) | ||
| Insulation Resistance | IR/IR 50% | ||
| 7 | Endurance | Appearance | No visible damage. T=85, 1000 hours. Applied voltage: 1.25UR. |
| Capacitance Change | C/C 8% | ||
| Dissipation Factor Increase | 0.004 | ||
| Insulation Resistance | IR/IR 50% | ||
| 8 | Charge and Discharge | Capacitance Change | C/C 5% |
| Charge/Discharge cycles: 10,000. Charging time: 0.5s. Discharging time: 0.5s. Charging voltage: Rated voltage UR. Charging resistance: 220/CR (). Discharging resistance: 10/CR or 20 (whichever is larger). CR: Rated capacitance (uF). | |||
| Dissipation Factor Increase | 0.005 (10KHz, CR 1.0uF); 0.005 (1KHz, CR > 1.0uF) | ||
| Insulation Resistance | IR/IR 50% |
Usage Rules
- Operating Range: Do not exceed the upper limit category temperature. Avoid overload. Do not exceed maximum pulse current.
- Handling Precautions: Avoid repeated squeezing at the lead root. Be mindful of the lead tip.
- Soldering: Solder heat can transfer to the capacitor core through the leads and encapsulation layer. Caution must be taken against attenuation or damage due to high temperatures and prolonged soldering.
- Soldering Temperature Range:
- Wave Soldering (MPP Polypropylene Film Capacitors): TP 110 for 120 seconds; Ts 120 for 45 seconds. For P 7.5mm, T 4mm, wave soldering time < 4 seconds.
- Soldering Iron: Tip temperature not exceeding 350, time not exceeding 3 seconds.
- Lead film capacitors are not suitable for reflow soldering.
- Ts: Maximum temperature the capacitor body endures during wave soldering.
- Tp: Maximum temperature the capacitor body endures during the preheating stage.
2512031620_DGCX-MPP224J2GD050B200ZR_C53070569.pdf
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