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quality Film Capacitor DGCX MPP474J2JC070C030ZH Designed for High Frequency and Pulse Circuit Applications factory
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quality Film Capacitor DGCX MPP474J2JC070C030ZH Designed for High Frequency and Pulse Circuit Applications factory
quality Film Capacitor DGCX MPP474J2JC070C030ZH Designed for High Frequency and Pulse Circuit Applications factory
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Specifications
Mfr. Part #:
MPP474J2JC070C030ZH
Package:
Through Hole
Key Attributes
Model Number: MPP474J2JC070C030ZH
Product Description

Product Overview

The CBB21/MPP series metallized polypropylene film capacitors, designed for epoxy encapsulation and impregnation, offer a non-inductive wound structure with tinned copper wire or tinned copper-clad steel leads. These capacitors are suitable for DC blocking, coupling, decoupling, filtering, bypassing, and other high-frequency, DC, AC, and pulse circuits. Key features include excellent self-healing properties due to the metallized polypropylene film, low loss, reduced internal temperature rise, and flame-retardant epoxy resin powder coating.

Product Attributes

  • Brand: DGCX (Company Trademark)
  • Origin: Dongguan, Guangdong Province, China
  • Material: Metallized Polypropylene Film, Flame-retardant Epoxy Resin Powder, Tinned Copper-clad Steel Leads
  • Certifications: RoHS compliant, REACH compliant, Halogen-free (if required)

Technical Specifications

Model/Series Product Code Capacitance Tolerance Rated Voltage (V.dc) Dimensions (mm) (L*W*H) Lead Pitch (mm) Dissipation Factor (DF) (1kHz, 20C) Insulation Resistance Dielectric Strength Max. Pulse Rise Rate (dV/dt) Operating Temperature Range
CBB21/MPP MPP474J2JC070N030ZH 0.47F 5% 630V 11.5 * 13.8 * 6.7 7.5 0.0010 30,000M (for C0.33uF) / 10000M*uF (for C>0.33uF) 1.6 UR(VDC), 5 sec Refer to chart (varies by UR and P) -40C to +105C
CBB21/MPP (Example) 0.001F to 6.8F 5%, 10% 100V, 160V, 250V, 400V, 630V, 1000V, 1250V, 1600V, 2000V N/A 5.0, 7.5, 10.0, 12.5, 15.0, 17.5, 20, 22.5, 25, 27.5, 31, 37.5, 41 0.0010 N/A N/A N/A N/A

Product Features

  • Metallized polypropylene film, non-inductive structure.
  • Good self-healing properties.
  • Low loss and low internal temperature rise.
  • Flame-retardant epoxy resin powder coating.

Storage Conditions

  • Temperature: Max 35
  • Relative Humidity: Max 80%
  • Storage Time: Max 12 months (from production date on packaging)
  • Avoid prolonged exposure to air, high temperature, and high humidity.

Usage Guidelines

  • Do not exceed the upper category temperature.
  • Avoid overload usage.
  • Do not exceed maximum pulse current.
  • Avoid repeated squeezing at the lead root.
  • Soldering: Follow specified temperature and time limits for wave soldering and iron soldering to prevent characteristic degradation.

2505291610_DGCX-MPP474J2JC070C030ZH_C49003003.pdf

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