Product Overview
The CBB22(H)/MPP series metalized polypropylene film capacitors are designed for DC filtering applications, including PFC and DC link circuits, in electronic equipment. These capacitors feature a non-inductive winding structure with a metallized polypropylene film dielectric, encapsulated in flame-retardant epoxy resin powder. They offer excellent electrical performance, self-healing properties, and are suitable for use in switching power supplies, electronic ballasts, and frequency converters.
Product Attributes
- Brand: CBB22(H)/MPP
- Manufacturer: Dongguan Chengxi Electronics Co., Ltd.
- Origin: China (Factory in Heyuan City)
- Dielectric Material: Metallized Polypropylene Film
- Encapsulation: Flame-retardant Epoxy Resin Powder (UL94V-0)
- Leads: Tinned Copper Clad Steel Wire
- Environmental Compliance: RoHS, REACH, Halogen-free (if required)
Technical Specifications
| Model/Part Number | Capacitance | Tolerance | Rated Voltage (V.dc) | Dimensions (mm) (L x H x T) | Pitch (P) | Lead Diameter (d) | DF (1kHz) |
|---|---|---|---|---|---|---|---|
| MPP225J2SA09HC3F0ZR | 2.2F | 5% | 450V | 21.5 x 16.2 x 9.3 | 20.0 | 0.8 | 0.1% |
General Electrical Characteristics
| Parameter | Specification | Test Condition |
|---|---|---|
| Climate Category | 40/105/21 | |
| Operating Temperature Range | -40 to +105 | (Voltage derating of 1.25% / from +85 to +105) |
| Rated Temperature | 85 | |
| Capacitance Range | 0.027F to 10F | |
| Capacitance Tolerance | 5% (J), 10% (K), 20% (M) | |
| Rated Voltage | 400/450Vdc, 520Vdc, 630Vdc | |
| Dissipation Factor (DF) | 0.0010 | 1kHz, 20 |
| Insulation Resistance | 30,000M for C0.33uF | 100VDC, 60 seconds |
| Insulation Resistance | 10000M*uF for C>0.33uF | 100VDC, 60 seconds |
| Dielectric Strength | 1.6 UR(VDC) | 5 seconds |
| Max. Pulse Rise Time (dV/dt) | Refer to table in source document |
Product Structure and Main Materials
| No. | Main Material | Description | Remarks |
|---|---|---|---|
| 1 | Metallized Polypropylene Film | MPPZAH | -/- |
| 2 | Sprayed Gold Layer | Zinc-tin alloy wire | -/- |
| 3 | Leads | Tinned Copper Clad Steel Wire | -/- |
| 4 | Outer Encapsulation Material | Epoxy Resin Powder | Flame Retardant UL94V-0 |
| 5 | Inner Protective Material | Epoxy Resin |
Storage Conditions
| Parameter | Specification |
|---|---|
| Temperature | Max 35 |
| Relative Humidity | Max 80% |
| Storage Time | Max 12 months (from production date) |
Soldering Rules
| Method | Parameter | Specification |
|---|---|---|
| Wave Soldering | TP | 110, 120 seconds |
| Wave Soldering | Ts | 120, 45 seconds |
| Wave Soldering (P7.5mm, T4mm) | Soldering Time | < 4 seconds |
| Soldering Iron | Tip Temperature | 350 |
| Soldering Iron | Time | 3 seconds |
Note: TP: Max temperature of capacitor body during wave soldering. Ts: Max temperature of capacitor body during preheating stage.
2512031620_DGCX-MPP225J2SA09HC3F0ZR_C53070638.pdf
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