Product Overview
The CBB21/MPP series metallized polypropylene film capacitors are designed for electronic equipment applications. These capacitors feature a non-inductive winding structure with metallized polypropylene film and are encapsulated in flame-retardant epoxy resin powder. They are suitable for DC blocking, coupling, decoupling, filtering, bypassing, and other high-frequency, DC, AC, and pulse circuits. Key advantages include excellent self-healing properties, low loss, and low internal temperature rise.
Product Attributes
- Brand: DGCX ()
- Product Type: CBB21/MPP Metallized Polypropylene Film Capacitor (Impregnated Type)
- Origin: Dongguan, Guangdong Province, China
- Encapsulation: Flame-retardant epoxy resin powder (UL94V-0)
- Lead Material: Tinned copper-clad steel wire
- Internal Material: Epoxy resin
- Environmental Compliance: RoHS, REACH, Halogen-free (if specified)
Technical Specifications
| Model | Capacitance (uF) | Tolerance (%) | Rated Voltage (VDC) | Dissipation Factor (DF) (1KHz) (%) | Dimensions (mm) (L x W x T) | Pitch (P) (mm) | Lead Diameter (d) (mm) |
|---|---|---|---|---|---|---|---|
| MPP334J2GC070C3F0ZR | 0.33 | 5% | 400 | 0.1 | 12.0 x 12.0 x 7.0 | 10.0 | 0.6 |
General Electrical Characteristics
| Parameter | Specification | Test Conditions |
|---|---|---|
| Climate Category | 40/105/21 | - |
| Operating Temperature Range | -40 to +105 | (Voltage derating factor 1.25%/ for +85 to +105) |
| Rated Temperature | 85 | - |
| Capacitance Range | 0.001F to 6.8F | - |
| Capacitance Tolerance | 5% (K), 10% (M) | - |
| Rated Voltage (VDC) | 100, 160, 250, 400, 630, 1000, 1250, 1600, 2000 | - |
| Dissipation Factor (DF) | 0.0010 | 1kHz, 20 |
| Insulation Resistance | 30,000 M (for C0.33uF) 10,000 M*uF (for C>0.33uF) | 100VDC, 60 seconds |
| Withstand Voltage | 1.6 UR(VDC) | 5 seconds |
Product Structure and Main Materials
| No. | Main Material | Description | Remarks |
|---|---|---|---|
| 1 | Metallized Polypropylene Film | MPPZAH | -/- |
| 2 | Sprayed Tin Layer | Tin-zinc alloy wire | -/- |
| 3 | Lead Wire | Tinned copper-clad steel wire | -/- |
| 4 | Outer Encapsulation Material | Epoxy resin powder | Flame-retardant UL94-V0 |
| 5 | Inner Protective Material | Epoxy resin | - |
Packaging Information
| Item | Dimensions (L*W*H) |
|---|---|
| Inner Carton | 34.5*23.5*24.5 cm |
| Outer Carton | 49*36*27 cm |
Storage Conditions
- Temperature: Max 35
- Relative Humidity: Max 80%
- Storage Time: Max 12 months (from production date on packaging)
Usage Rules
- Do not exceed the upper category temperature.
- Avoid overload operation.
- Do not exceed the maximum pulse current.
- Avoid repeated squeezing at the lead wire root.
- Be cautious of lead wire tips.
- Soldering:
- Wave Soldering: TP 110 for 120 seconds; Ts 120 for 45 seconds. For P7.5mm, T4mm, soldering time < 4 seconds.
- Soldering Iron: Tip temperature 350, time 3 seconds.
- Lead film capacitors are not suitable for reflow soldering.
2504101957_DGCX-MPP334J2GC070C3F0ZR_C42460046.pdf
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